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DM383AAAR11

Texas Instruments

DM383AAAR11 by Texas Instruments

Texas Instruments DM383AAAR11 microprocessor features 32-bit architecture, 1.28-1.42V supply voltage range, and 30MHz clock frequency. Ideal for low power applications with integrated cache, 655360 RAM words, and 72 DMA channels for high-speed data processing in compact devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,799 parts In-Stock

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5,799

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Digiode

USA . 3,479 parts In-Stock

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3,479

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 368 parts In-Stock

1+ parts

$3.135

100+ parts

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368

$3.135

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AZTECH Wire

Italy . 391 parts In-Stock

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$9.497

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391

$9.497

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One Stop Electronics

USA . 1,018 parts In-Stock

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$20.000

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1,018

$20.000

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Corohmni

South Africa . 17 parts In-Stock

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$46.899

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17

$46.899

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$54.994

100+ parts

$50.045

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$45.095

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50

$54.994

$50.045

$45.095

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Parana Technologies

USA . 2,003 parts In-Stock

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$60.202

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2,003

$60.202

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DigiPath Technology Company

USA . 117 parts In-Stock

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$66.290

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IDEA Electronic Components Group

UK . 519 parts In-Stock

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$67.643

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$64.261

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$60.879

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519

$67.643

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$60.879

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ChromeModa Solutions

Germany . 56 parts In-Stock

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$67.643

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$55.467

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56

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$55.467

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Microchip USA

USA . 2,789 parts In-Stock

1+ parts

$92.360

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$90.760

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$89.950

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$89.150

2,789

$92.360

$90.760

$89.950

$89.150

Corphita

USA . 3,461 parts In-Stock

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Native Components

USA . 27 parts In-Stock

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$2.764

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27

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$2.764

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Overview

Elevate your technological capabilities with the DM383AAAR11 by Texas Instruments, a cutting-edge microprocessor designed for optimal performance and efficiency. Manufactured with precision and expertise, this product offers integrated cache and a wide range of applications in various industries. Experience seamless operation and enhanced processing power without compromising on quality or reliability. Upgrade to Texas Instruments and unlock the potential of your devices like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Having an integrated cache improves the overall performance of the microprocessor by reducing the access time to frequently used data.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.42 V

Operating at a maximum supply voltage of 1.42 V ensures efficiency and stability in power consumption.

On Chip Data RAM Width: 8

Having a wide on-chip data RAM width of 8 enhances the microprocessor's ability to handle and process data efficiently.

Address Bus Width: 27

The wide address bus width of 27 allows for extensive memory addressing capabilities, making it suitable for handling large amounts of data.

Package Shape: SQUARE

The square package shape is efficient for space utilization and allows for better alignment on the circuit board.

Bit Size: 32

With a bit size of 32, the microprocessor can handle and process data in 32-bit chunks, improving speed and performance.

No. of Terminals: 609

The high number of terminals enables connectivity to various components on the circuit board, enhancing functionality and compatibility.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style allows for precise and secure mounting on the circuit board, ensuring stability and reliability in operation.

Minimum Supply Voltage: 1.28 V

With a minimum supply voltage of 1.28 V, the microprocessor can operate efficiently even at lower power levels.

Terminal Finish: TIN SILVER COPPER

The terminal finish of TIN SILVER COPPER provides excellent conductivity and resistance to corrosion, ensuring reliable connections.

Terminal Position: BOTTOM

Having the terminals positioned at the bottom facilitates easier installation and soldering on the circuit board.

Maximum Seated Height: 1.32 mm

The low maximum seated height allows for a compact design, making it suitable for applications with space constraints.

RAM Words: 655360

The high number of RAM words provides ample memory storage for data processing and computational tasks.

Width: 16 mm

With a width of 16 mm, the microprocessor is compact and can fit into tight spaces without sacrificing performance.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the microprocessor during production and maintenance.

External Data Bus Width: 16

Having an external data bus width of 16 allows for high-speed data transfer between the microprocessor and external peripherals.

Maximum Clock Frequency: 30 MHz

Operating at a maximum clock frequency of 30 MHz ensures fast processing speeds and reliable performance in demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the microprocessor can withstand high-temperature soldering processes effectively.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures the microprocessor's reliability and durability under extreme heat conditions.

Length: 16 mm

The compact length of 16 mm makes the microprocessor suitable for miniaturized electronic devices and applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor allows for simplified instruction set architecture, resulting in faster and more efficient processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Terminal Form: BALL

Having a terminal form of BALL enables secure and reliable solder connections, ensuring durability and consistent performance.

Nominal Supply Voltage: 1.35 V

Operating at a nominal supply voltage of 1.35 V provides a good balance between power efficiency and performance.

No. of DMA Channels: 72

Having 72 DMA channels allows for efficient data transfer between peripherals and memory, optimizing overall system performance.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density mounting and connectivity, suitable for compact electronic devices.

Format: FLOATING POINT

Using a floating-point format allows for efficient and accurate numerical computations, making the microprocessor suitable for complex mathematical operations.

Moisture Sensitivity Level (MSL): 3

The MSL of 3 indicates that the microprocessor has a moderate level of moisture sensitivity, ensuring reliability in various environmental conditions.

Speed: 970 rpm

Operating at a speed of 970 rpm enables the microprocessor to handle tasks quickly and efficiently, suitable for high-demand applications.

Low Power Mode: YES

Having a low power mode improves energy efficiency and reduces power consumption when the microprocessor is not operating at full capacity.

Technical Specifications

Microprocessors DM383AAAR11 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

27

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B609

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

609

On Chip Data RAM Width:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

655360

Maximum Seated Height:

1.32 mm

Speed:

970 rpm

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

DM383AAAR11 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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