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DM385AAAR11

Texas Instruments

DM385AAAR11 by Texas Instruments

The Texas Instruments DM385AAAR11 microprocessor features 32-bit architecture, 28-bit address bus width, and integrated cache. Ideal for low power applications with a max clock frequency of 30 MHz. Suitable for use in devices requiring high processing speeds and efficient power consumption.

Median Price

$42.649

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 77 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

77

-

-

-

-

Rochester

USA . 73 parts In-Stock

1+ parts

-

100+ parts

$37.910

1k+ parts

$33.920

10k+ parts

$31.930

73

-

$37.910

$33.920

$31.930

Verical

USA . 68 parts In-Stock

1+ parts

-

100+ parts

$47.388

1k+ parts

$42.400

10k+ parts

$39.913

68

-

$47.388

$42.400

$39.913

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,853 parts In-Stock

1+ parts

$34.798

100+ parts

-

1k+ parts

-

10k+ parts

-

3,853

$34.798

-

-

-

DigiKey Marketplace

USA . 77 parts In-Stock

1+ parts

$38.110

100+ parts

-

1k+ parts

-

10k+ parts

-

77

$38.110

-

-

-

Vyrian

USA . 5,329 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,329

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 703 parts In-Stock

1+ parts

$1.981

100+ parts

-

1k+ parts

-

10k+ parts

-

703

$1.981

-

-

-

Northwest PG Solutions

USA . 1,671 parts In-Stock

1+ parts

$2.179

100+ parts

-

1k+ parts

-

10k+ parts

-

1,671

$2.179

-

-

-

Microchip USA

USA . 1,045 parts In-Stock

1+ parts

$27.440

100+ parts

$27.040

1k+ parts

$26.850

10k+ parts

$26.650

1,045

$27.440

$27.040

$26.850

$26.650

Corphita

USA . 2,267 parts In-Stock

1+ parts

$32.967

100+ parts

-

1k+ parts

-

10k+ parts

-

2,267

$32.967

-

-

-

Parana Technologies

USA . 2,166 parts In-Stock

1+ parts

$44.750

100+ parts

-

1k+ parts

-

10k+ parts

-

2,166

$44.750

-

-

-

ChromeModa Solutions

Germany . 1,376 parts In-Stock

1+ parts

$50.281

100+ parts

$41.230

1k+ parts

-

10k+ parts

-

1,376

$50.281

$41.230

-

-

IDEA Electronic Components Group

UK . 273 parts In-Stock

1+ parts

$50.281

100+ parts

$47.767

1k+ parts

$45.253

10k+ parts

-

273

$50.281

$47.767

$45.253

-

Ampacity Inc.

Singapore . 74 parts In-Stock

1+ parts

$67.770

100+ parts

-

1k+ parts

-

10k+ parts

-

74

$67.770

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 9,466 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,466

-

-

-

-

DigiPath Technology Company

USA . 206 parts In-Stock

1+ parts

-

100+ parts

$45.333

1k+ parts

-

10k+ parts

-

206

-

$45.333

-

-

Overview

Experience unparalleled performance and reliability with the Texas Instruments DM385AAAR11 microprocessor. As a trusted industry leader, Texas Instruments delivers top-quality products that exceed expectations. Ideal for a wide range of applications, this microprocessor offers seamless integration, high-speed processing, and low power consumption. Unlock new possibilities and maximize efficiency with the DM385AAAR11 - the perfect choice for your next project. Elevate your performance with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection to the microprocessor, ensuring it can withstand varied environmental conditions.

Integrated Cache: YES

The presence of integrated cache enhances the performance of the microprocessor by allowing for quicker access to frequently used instructions and data, resulting in improved speed and efficiency.

Maximum Supply Voltage: 1.42 V

The higher maximum supply voltage allows for increased power delivery to the microprocessor, enabling it to handle intensive tasks and maintain stability under load.

Address Bus Width: 28

The wider address bus width of 28 bits expands the memory addressing capability of the microprocessor, allowing it to access larger memory spaces and process more data at a time.

Package Shape: SQUARE

The square package shape offers efficient use of space and easy integration into circuit designs, making it suitable for compact electronic devices.

Bit Size: 32

With a 32-bit architecture, the microprocessor can handle larger chunks of data and perform complex calculations with higher precision, making it suitable for demanding computing tasks.

Power Supplies (V): 1.14/1.42

The availability of both 1.14V and 1.42V power supplies provides flexibility in power management, allowing users to optimize performance and energy efficiency based on specific requirements.

No. of Terminals: 609

Having a large number of terminals enables the microprocessor to establish connections with various components on the circuit board, enhancing its functionality and compatibility with different system configurations.

Maximum Operating Temperature: 95 °C

The high maximum operating temperature of 95°C ensures stable performance even in challenging thermal conditions, making the microprocessor suitable for industrial and automotive applications.

Minimum Operating Temperature: 0 °C

The capability to operate at a minimum temperature of 0°C ensures reliable functionality in cold environments, expanding the range of applications where the microprocessor can be used.

Technical Specifications

Microprocessors DM385AAAR11 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B609

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

609

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA609,31X31,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.14/1.42

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.32 mm

Speed:

970 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

DM385AAAR11 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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