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DM388AAAR01F

Texas Instruments

DM388AAAR01F by Texas Instruments

Texas Instruments DM388AAAR01F microprocessor features 32-bit architecture, 28-bit address bus, and 16-bit external data bus. Ideal for low power applications with a max clock frequency of 30 MHz. Suitable for use in devices requiring high-speed processing and integrated cache memory.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,485 parts In-Stock

1+ parts

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4,485

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Digiode

USA . 3,791 parts In-Stock

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3,791

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 726 parts In-Stock

1+ parts

$4.000

100+ parts

-

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726

$4.000

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AZTECH Wire

Italy . 420 parts In-Stock

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$17.975

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420

$17.975

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Parana Technologies

USA . 2,048 parts In-Stock

1+ parts

$35.466

100+ parts

$3,293.520

1k+ parts

$31.919

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-

2,048

$35.466

$3,293.520

$31.919

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DigiPath Technology Company

USA . 495 parts In-Stock

1+ parts

$39.052

100+ parts

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495

$39.052

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ChromeModa Solutions

Germany . 1,420 parts In-Stock

1+ parts

$39.849

100+ parts

$32.676

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1,420

$39.849

$32.676

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IDEA Electronic Components Group

UK . 652 parts In-Stock

1+ parts

$39.849

100+ parts

$37.857

1k+ parts

$35.864

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652

$39.849

$37.857

$35.864

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Native Components

USA . 37 parts In-Stock

1+ parts

$53.660

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$51.514

37

$53.660

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$51.514

Northwest PG Solutions

USA . 1,362 parts In-Stock

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$59.026

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1,362

$59.026

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Corphita

USA . 911 parts In-Stock

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911

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Overview

Experience unmatched performance and efficiency with the Texas Instruments DM388AAAR01F microprocessor. Crafted by a trusted manufacturer, this cutting-edge technology is designed for a wide range of applications, offering seamless integration and reliability. With its integrated cache and advanced features, this microprocessor delivers exceptional value and benefits to customers seeking superior quality and performance. Upgrade your system with the DM388AAAR01F and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting devices.

Integrated Cache: YES

Having integrated cache helps in improving the overall performance of the microprocessor by reducing access time to frequently used instructions and data.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient heat dissipation, making the microprocessor suitable for small form factor devices.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26 V ensures safe operation without risking damage to the microprocessor, providing stability in varying voltage conditions.

Address Bus Width: 28

A wider address bus width of 28 allows for efficient data transfer between the microprocessor and memory, improving processing speed and performance.

Package Shape: SQUARE

The square package shape simplifies the assembly process and provides uniform thermal performance, ensuring reliable operation in various environmental conditions.

Bit Size: 32

With a bit size of 32, the microprocessor can handle and process larger amounts of data simultaneously, enhancing multitasking capabilities and overall processing speed.

No. of Terminals: 609

The high number of terminals allows for complex connectivity options and interfaces, enabling versatile usage in a wide range of applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable for prolonged operation.

Technical Specifications

Microprocessors DM388AAAR01F attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B609

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

609

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.32 mm

Speed:

720 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

DM388AAAR01F Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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