Loading...

CC430F5145IRGZR

Texas Instruments

CC430F5145IRGZR by Texas Instruments

CC430F5145IRGZR by Texas Instruments is a 16-bit microprocessor with 16384 ROM words and 2 RAM words. Operating at a max clock frequency of 20 MHz, it is ideal for industrial applications requiring a CPU family of MSP430. With peripherals like TIMER, it supports I2C, SPI, UART, USB bus compatibility.

Median Price

$4.504

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,045 parts In-Stock

1+ parts

$4.504

100+ parts

$3.672

1k+ parts

$2.448

10k+ parts

-

7,045

$4.504

$3.672

$2.448

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.448

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$2.448

-

-

-

Digiode

USA . 4,021 parts In-Stock

1+ parts

$4.279

100+ parts

-

1k+ parts

-

10k+ parts

-

4,021

$4.279

-

-

-

Vyrian

USA . 3,105 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,105

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 100 parts In-Stock

1+ parts

$2.399

100+ parts

-

1k+ parts

$2.303

10k+ parts

-

100

$2.399

-

$2.303

-

Continental Prestige Electronics

USA . 4,175 parts In-Stock

1+ parts

$2.448

100+ parts

-

1k+ parts

-

10k+ parts

$2.399

4,175

$2.448

-

-

$2.399

Argo Parts USA

USA . 3,971 parts In-Stock

1+ parts

$2.448

100+ parts

-

1k+ parts

-

10k+ parts

-

3,971

$2.448

-

-

-

Ampacity Inc.

Singapore . 6,945 parts In-Stock

1+ parts

$3.830

100+ parts

-

1k+ parts

-

10k+ parts

-

6,945

$3.830

-

-

-

Corphita

USA . 2,544 parts In-Stock

1+ parts

$4.054

100+ parts

-

1k+ parts

-

10k+ parts

-

2,544

$4.054

-

-

-

AZTECH Wire

Italy . 249 parts In-Stock

1+ parts

$21.840

100+ parts

-

1k+ parts

-

10k+ parts

-

249

$21.840

-

-

-

Parana Technologies

USA . 335 parts In-Stock

1+ parts

$24.518

100+ parts

-

1k+ parts

$25.183

10k+ parts

-

335

$24.518

-

$25.183

-

DigiPath Technology Company

USA . 109 parts In-Stock

1+ parts

$26.997

100+ parts

$24.837

1k+ parts

-

10k+ parts

-

109

$26.997

$24.837

-

-

ChromeModa Solutions

Germany . 2,764 parts In-Stock

1+ parts

$27.548

100+ parts

$22.589

1k+ parts

-

10k+ parts

-

2,764

$27.548

$22.589

-

-

IDEA Electronic Components Group

UK . 1,174 parts In-Stock

1+ parts

$27.548

100+ parts

$26.171

1k+ parts

$24.793

10k+ parts

-

1,174

$27.548

$26.171

$24.793

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$29.290

100+ parts

$26.654

1k+ parts

$24.018

10k+ parts

-

3,000

$29.290

$26.654

$24.018

-

Corohmni

South Africa . 212 parts In-Stock

1+ parts

$52.944

100+ parts

-

1k+ parts

-

10k+ parts

-

212

$52.944

-

-

-

Component Stockers USA

USA . 53 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

53

-

-

-

-

Overview

Elevate your projects with the Texas Instruments CC430F5145IRGZR, a versatile and high-quality microprocessor circuit that offers unmatched performance in various applications. With a maximum clock frequency of 20 MHz and a wide range of peripherals including timers, this chip carrier is ideal for industrial use. The MSP430 CPU family ensures reliable operation even in harsh conditions, while the flash ROM programmability allows for flexibility in programming. Trust Texas Instruments for innovative solutions that deliver value and efficiency to your designs.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Provides durability and cost-effectiveness.

Surface Mount

YES - Allows for easy and efficient PCB assembly.

Maximum Supply Voltage

3.6 V - Supports a wide range of applications.

Package Shape

SQUARE - Optimizes space utilization on PCBs.

Bit Size

16 - Offers sufficient processing power for various tasks.

Power Supplies (V)

2/3.3 - Compatible with common voltage requirements.

No. of Terminals

48 - Provides ample connectivity options.

Package Style (Meter)

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - Offers versatile mounting possibilities.

Minimum Supply Voltage

2.4 V - Ensures operation even at lower voltages.

Maximum Operating Temperature

85 °C - Suitable for industrial environments.

CPU Family

MSP430 - Known for its efficiency and reliability in embedded systems.

Minimum Operating Temperature

40 °C - Can withstand extreme temperature conditions.

Terminal Finish

NICKEL PALLADIUM GOLD - Ensures good conductivity and corrosion resistance.

Terminal Position

QUAD - Facilitates easier PCB layout and routing.

ROM Words

16384 - Provides ample storage for program data.

Maximum Seated Height

1 mm - Ideal for compact electronic devices.

RAM Words

2 - Supports basic data processing requirements.

Width

7 mm - Fits well within standard PCB design constraints.

Peripherals

TIMER - Adds functionality for time-sensitive applications.

Maximum Clock Frequency

20 MHz - Offers fast processing speeds.

Maximum Time At Peak Reflow Temperature (s)

30 - Ensures proper soldering during assembly.

Peak Reflow Temperature °C

260 - Suitable for lead-free assembly processes.

Length

7 mm - Complements the square package shape for efficient use of space.

Temperature Grade

INDUSTRIAL - Designed for reliable operation in industrial environments.

Peripheral IC Type

MICROPROCESSOR CIRCUIT - Provides advanced processing capabilities.

RAM Bytes

2048 - Offers ample memory for data storage and processing.

Technology

CMOS - Known for low power consumption and high noise immunity.

Terminal Form

NO LEAD - Allows for RoHS-compliant manufacturing processes.

Nominal Supply Voltage

3.3 V - Standard voltage level for many electronic devices.

ROM Programmability

FLASH - Enables easy and quick firmware updates.

Bus Compatibility

I2C; SPI; UART; USB - Supports various communication protocols for flexibility.

Terminal Pitch

0.5 mm - Allows for dense PCB layout with high connectivity.

Moisture Sensitivity Level (MSL)

3 - Suitable for reflow soldering processes.

Speed

20 rpm - Suitable for moderate processing requirements.

No. of I/O Lines

30 - Provides sufficient I/O for interfacing with external devices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC430F5145IRGZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART; USB

CPU Family:

MSP430

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Peripherals:

TIMER

Trade Compliance

CC430F5145IRGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19