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CC430F5125IRGZT

Texas Instruments

CC430F5125IRGZT by Texas Instruments

CC430F5125IRGZT by Texas Instruments is a 16-bit microprocessor with 16384 ROM words and 2 RAM words. Operating at up to 20 MHz, it features peripherals like TIMER and supports I2C, SPI, UART buses. Ideal for industrial applications requiring low power consumption and high clock frequency.

Median Price

$4.608

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 750 parts In-Stock

1+ parts

$5.273

100+ parts

$4.299

1k+ parts

$2.866

10k+ parts

-

750

$5.273

$4.299

$2.866

-

Rochester

USA . 2,750 parts In-Stock

1+ parts

-

100+ parts

$3.590

1k+ parts

$3.210

10k+ parts

$3.020

2,750

-

$3.590

$3.210

$3.020

DigiKey

USA . 2,750 parts In-Stock

1+ parts

-

100+ parts

$4.730

1k+ parts

-

10k+ parts

-

2,750

-

$4.730

-

-

Verical

USA . 2,750 parts In-Stock

1+ parts

-

100+ parts

$4.487

1k+ parts

$4.013

10k+ parts

$3.775

2,750

-

$4.487

$4.013

$3.775

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,928 parts In-Stock

1+ parts

$3.781

100+ parts

-

1k+ parts

-

10k+ parts

-

4,928

$3.781

-

-

-

Vyrian

USA . 6,735 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,735

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 172 parts In-Stock

1+ parts

$3.582

100+ parts

-

1k+ parts

-

10k+ parts

-

172

$3.582

-

-

-

Component Stockers USA

USA . 4,313 parts In-Stock

1+ parts

$4.060

100+ parts

$3.820

1k+ parts

$3.450

10k+ parts

-

4,313

$4.060

$3.820

$3.450

-

Native Components

USA . 904 parts In-Stock

1+ parts

$6.501

100+ parts

-

1k+ parts

-

10k+ parts

-

904

$6.501

-

-

-

Corohmni

South Africa . 683 parts In-Stock

1+ parts

$15.053

100+ parts

-

1k+ parts

-

10k+ parts

-

683

$15.053

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$48.965

100+ parts

$44.558

1k+ parts

$40.151

10k+ parts

-

1,000

$48.965

$44.558

$40.151

-

Parana Technologies

USA . 1,506 parts In-Stock

1+ parts

$68.781

100+ parts

-

1k+ parts

-

10k+ parts

-

1,506

$68.781

-

-

-

ChromeModa Solutions

Germany . 3,334 parts In-Stock

1+ parts

$77.282

100+ parts

$63.371

1k+ parts

-

10k+ parts

-

3,334

$77.282

$63.371

-

-

IDEA Electronic Components Group

UK . 248 parts In-Stock

1+ parts

$77.282

100+ parts

$73.418

1k+ parts

$69.554

10k+ parts

-

248

$77.282

$73.418

$69.554

-

Northwest PG Solutions

USA . 1,994 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.371

10k+ parts

-

1,994

-

-

$6.371

-

DigiPath Technology Company

USA . 705 parts In-Stock

1+ parts

-

100+ parts

$69.677

1k+ parts

-

10k+ parts

-

705

-

$69.677

-

-

Overview

Unlock the power of innovation with the Texas Instruments CC430F5125IRGZT. Known for their superior quality and cutting-edge technology, Texas Instruments delivers a versatile solution in the category of Other Function uPs,uCs & Peripheral ICs. Ideal for a variety of applications, this chip carrier with a very thin profile offers a seamless integration into your projects. With a maximum clock frequency of 20 MHz and flash ROM programmability, this industrial-grade microprocessor circuit provides unmatched performance and reliability. Elevate your designs and experience the value that Texas Instruments brings to your projects with the CC430F5125IRGZT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product suitable for various applications.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options.

Bit Size: 16

16-bit processing capability enables more complex tasks and calculations to be performed efficiently.

Power Supplies (V): 2/3.3

Support for dual power supply options allows for flexibility in powering the device.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh environments.

ROM Words: 16384

Large ROM capacity allows for storing extensive program code or data.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the product's capability to interface with various peripherals.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC430F5125IRGZT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Peripherals:

TIMER

Trade Compliance

CC430F5125IRGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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