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CC430F5145IRGZ

Texas Instruments

CC430F5145IRGZ by Texas Instruments

CC430F5145IRGZ by Texas Instruments is a CMOS microprocessor circuit with 48 terminals in a square chip carrier package. It operates b/w -40 to 85 °C with supply voltage range of 2.4V to 3.6V, making it ideal for industrial applications requiring low power consumption and compact design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,491 parts In-Stock

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Digiode

USA . 292 parts In-Stock

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AZTECH Wire

Italy . 215 parts In-Stock

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$5.640

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One Stop Electronics

USA . 247 parts In-Stock

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$6.000

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Parana Technologies

USA . 471 parts In-Stock

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$15.774

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$16.135

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ChromeModa Solutions

Germany . 3,968 parts In-Stock

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$17.724

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$14.534

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IDEA Electronic Components Group

UK . 256 parts In-Stock

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$17.724

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$16.838

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$15.952

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256

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Corohmni

South Africa . 2,632 parts In-Stock

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$59.077

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DigiPath Technology Company

USA . 1,843 parts In-Stock

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$15.980

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Northwest PG Solutions

USA . 1,533 parts In-Stock

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Native Components

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Corphita

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Overview

Discover the Texas Instruments CC430F5145IRGZ, a cutting-edge microprocessor circuit that offers unparalleled quality and reliability. With a wide range of applications in various industries, this product provides customers with exceptional value and benefits. From its industrial-grade temperature grade to its innovative CMOS technology, this chip carrier delivers top-notch performance while ensuring a seamless user experience. Trust Texas Instruments for superior solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

The surface mount capability allows for easy installation and space-saving on PCBs, making it a convenient choice for compact designs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, providing flexibility in usage.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB and easy orientation during assembly.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for interfacing with other components, making it versatile for different types of circuits.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers thermal efficiency, compactness, and enhanced performance in heat dissipation.

Minimum Supply Voltage: 2.4 V

With a low minimum supply voltage, the product can operate efficiently even in low-power scenarios, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the product to withstand harsh environmental conditions, ensuring reliability in various applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range enables the product to function reliably in extreme cold environments, expanding its usability.

Terminal Position: QUAD

The quad terminal position offers easy connectivity and stable insertion on the PCB, facilitating installation and maintenance.

Maximum Seated Height: 1 mm

The low maximum seated height profile enables a compact overall design, making it suitable for space-constrained applications.

Width: 7 mm

The 7mm width provides a balance between compactness and ease of handling during installation, offering versatility in placement on the PCB.

Length: 7 mm

The 7mm length complements the square package shape, ensuring a symmetrical layout and efficient use of PCB space.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating signifies robustness and reliability in demanding industrial environments, making it a suitable choice for rugged applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit peripheral IC type, the product offers advanced processing capabilities and versatile functionality for a wide range of applications.

Technology: CMOS

The use of CMOS technology provides low power consumption, high speed, and compatibility with various digital systems, enhancing overall performance.

Terminal Form: NO LEAD

The no-lead terminal form ensures reliable soldering connections and eliminates the risk of lead-related issues, enhancing product safety and longevity.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage offers standard compatibility with common power sources, ensuring ease of integration into different systems.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density mounting and precise interconnection on the PCB, enabling efficient signal routing and layout optimization.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC430F5145IRGZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

CC430F5145IRGZ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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