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CC430F6145IRGCR

Texas Instruments

CC430F6145IRGCR by Texas Instruments

CC430F6145IRGCR by Texas Instruments is a 16-bit microprocessor with 2/3.3V power supplies, 16384 ROM words, and 2048 RAM bytes. It operates in industrial temperatures from -40 to 85°C and is ideal for applications requiring a MICROPROCESSOR CIRCUIT in a compact CHIP CARRIER package with PLASTIC/EPOXY material.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,789 parts In-Stock

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8,789

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Digiode

USA . 989 parts In-Stock

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989

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Distributors (Availability)

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Native Components

USA . 315 parts In-Stock

1+ parts

$0.196

100+ parts

-

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$0.188

315

$0.196

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$0.188

Northwest PG Solutions

USA . 1,020 parts In-Stock

1+ parts

$0.215

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-

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$0.190

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$0.215

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$0.190

One Stop Electronics

USA . 1,518 parts In-Stock

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$14.000

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1,518

$14.000

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$17.735

100+ parts

$16.139

1k+ parts

$14.543

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3,000

$17.735

$16.139

$14.543

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AZTECH Wire

Italy . 589 parts In-Stock

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$19.640

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589

$19.640

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Corohmni

South Africa . 252 parts In-Stock

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$65.904

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252

$65.904

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Parana Technologies

USA . 85 parts In-Stock

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$72.207

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$72.207

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DigiPath Technology Company

USA . 1,913 parts In-Stock

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$79.508

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$79.508

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ChromeModa Solutions

Germany . 6,609 parts In-Stock

1+ parts

$81.131

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$66.527

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6,609

$81.131

$66.527

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IDEA Electronic Components Group

UK . 816 parts In-Stock

1+ parts

$81.131

100+ parts

$77.074

1k+ parts

$73.018

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816

$81.131

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$73.018

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Component Stockers USA

USA . 303 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 21,543 parts In-Stock

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Corphita

USA . 3,814 parts In-Stock

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Overview

Unlock the potential of your next project with the CC430F6145IRGCR by Texas Instruments. With a reputation for high-quality products, Texas Instruments delivers excellence in every detail. This versatile microprocessor circuit offers endless possibilities in various applications. From its innovative technology to its reliable performance, this chip carrier with a very thin profile provides exceptional value and benefits to customers. Experience the advantages of the MSP430 CPU family and unleash the power of creativity with the CC430F6145IRGCR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product more affordable for customers.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time during manufacturing.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power options and compatibility with a wide range of systems.

Package Shape: SQUARE

Square packages are space-efficient and allow for better heat dissipation.

Bit Size: 16

A larger bit size allows for more complex and advanced processing capabilities.

Power Supplies (V): 2/3.3

Supports different voltage requirements, offering versatility in power usage.

No. of Terminals: 64

Sufficient number of terminals for connecting to various components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers protection, heat dissipation, and space-saving benefits.

Minimum Supply Voltage: 2.4 V

Ensures reliable operation even with lower voltage inputs.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments, suitable for industrial applications.

CPU Family: MSP430

Belonging to the MSP430 family ensures compatibility, support, and resources from the manufacturer.

Minimum Operating Temperature: -40 °C

Designed to operate in extremely low-temperature conditions, suitable for various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity, corrosion resistance, and durability for long-term use.

Terminal Position: QUAD

Quad terminal position facilitates easier soldering and connection to the PCB.

ROM Words: 16384

Large ROM capacity allows for storing a significant amount of data and instructions.

Maximum Seated Height: 1 mm

Low seated height saves space in compact designs and reduces the overall profile of the product.

Width: 9 mm

Compact width allows for integration into tight spaces or on densely packed PCBs.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for an extended duration during manufacturing processes.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during the soldering process without damage.

Length: 9 mm

Compact length, suitable for applications where space is limited.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, it provides advanced processing capabilities for different applications.

RAM Bytes: 2048

A sufficient amount of RAM for storing and processing data efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: NO LEAD

No-lead terminal form is environmentally friendly and complies with RoHS regulations.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance and compatibility with standard power sources.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates or changes to the stored data.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting and precise connections on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product is sensitive to moisture but can withstand standard PCB assembly processes.

Speed: 20 rpm

Operates at a speed of 20 rotations per minute, suitable for a wide range of applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC430F6145IRGCR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Bit Size:

16

CPU Family:

MSP430

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Trade Compliance

CC430F6145IRGCR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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