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CC430F5145IRGZT

Texas Instruments

CC430F5145IRGZT by Texas Instruments

CC430F5145IRGZT by Texas Instruments is a 16-bit microprocessor with 16384 ROM words and 2 RAM words. Operating at a max clock frequency of 20 MHz, it features peripherals like TIMER and supports I2C, SPI, UART, USB buses. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$5.020

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,700 parts In-Stock

1+ parts

$5.406

100+ parts

$4.407

1k+ parts

$2.938

10k+ parts

-

3,700

$5.406

$4.407

$2.938

-

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.633

10k+ parts

$4.429

250

-

-

$4.633

$4.429

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$3.672

100+ parts

-

1k+ parts

-

10k+ parts

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50

$3.672

-

-

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Digiode

USA . 2,912 parts In-Stock

1+ parts

$5.136

100+ parts

-

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2,912

$5.136

-

-

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Vyrian

USA . 8,959 parts In-Stock

1+ parts

-

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-

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8,959

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Chip Stock

USA . 3,500 parts In-Stock

1+ parts

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3,500

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,710 parts In-Stock

1+ parts

$3.672

100+ parts

-

1k+ parts

-

10k+ parts

-

2,710

$3.672

-

-

-

Continental Prestige Electronics

USA . 2,395 parts In-Stock

1+ parts

$3.672

100+ parts

-

1k+ parts

-

10k+ parts

$3.599

2,395

$3.672

-

-

$3.599

Netroflash

USA . 100 parts In-Stock

1+ parts

$3.672

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$3.672

-

-

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Ampacity Inc.

Singapore . 1,939 parts In-Stock

1+ parts

$4.600

100+ parts

-

1k+ parts

-

10k+ parts

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1,939

$4.600

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Corphita

USA . 4,061 parts In-Stock

1+ parts

$4.865

100+ parts

-

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10k+ parts

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4,061

$4.865

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-

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Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$14.296

100+ parts

$13.009

1k+ parts

$11.723

10k+ parts

-

20

$14.296

$13.009

$11.723

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Parana Technologies

USA . 1,822 parts In-Stock

1+ parts

$71.016

100+ parts

-

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1,822

$71.016

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Corohmni

South Africa . 256 parts In-Stock

1+ parts

$76.573

100+ parts

-

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10k+ parts

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256

$76.573

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DigiPath Technology Company

USA . 326 parts In-Stock

1+ parts

$78.197

100+ parts

$71.941

1k+ parts

-

10k+ parts

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326

$78.197

$71.941

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ChromeModa Solutions

Germany . 4,018 parts In-Stock

1+ parts

$79.793

100+ parts

$65.430

1k+ parts

-

10k+ parts

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4,018

$79.793

$65.430

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IDEA Electronic Components Group

UK . 1,663 parts In-Stock

1+ parts

$79.793

100+ parts

$75.803

1k+ parts

$71.814

10k+ parts

-

1,663

$79.793

$75.803

$71.814

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Lixinc

USA . 10,918 parts In-Stock

1+ parts

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10,918

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A-Z Elektronik GmbH

Germany . 7,155 parts In-Stock

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7,155

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Alle Elektronik GmbH

Germany . 4,770 parts In-Stock

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4,770

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

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3,500

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Futuretech Components

Singapore . 224 parts In-Stock

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224

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Kepictronics

USA . 224 parts In-Stock

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224

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Overview

Discover the Texas Instruments CC430F5145IRGZT, a top-quality microprocessor circuit designed for a wide range of applications. With its advanced technology and reliable performance, this IC offers unparalleled value to customers. Whether you're looking to enhance your industrial systems or streamline your IoT devices, the CC430F5145IRGZT delivers exceptional speed, versatility, and efficiency. Trust in Texas Instruments' reputation for excellence and elevate your projects with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making it a good choice for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of input voltage levels, providing flexibility in power supply options.

Package Shape: SQUARE

Square package shape helps in easy alignment and placement on PCBs, ensuring proper fit and space utilization.

Bit Size: 16

16-bit architecture allows for higher computational capabilities and performance compared to lower bit sizes.

Power Supplies (V): 2/3.3

Supports dual power supply options, providing flexibility in system design and power management.

No. of Terminals: 48

A higher number of terminals allow for more I/O connectivity and expansion options for peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers a combination of heat dissipation, compact size, and lightweight design for efficient performance in various applications.

Minimum Supply Voltage: 2.4 V

Ensures reliable operation even at lower voltage levels, making the product suitable for low-power applications.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without compromising performance, suitable for industrial and harsh environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC430F5145IRGZT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART; USB

CPU Family:

MSP430

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Peripherals:

TIMER

Trade Compliance

CC430F5145IRGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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