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CC430F6145IRGC

Texas Instruments

CC430F6145IRGC by Texas Instruments

CC430F6145IRGC by Texas Instruments is a 64-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85°C, with supply voltage ranging from 2.4V to 3.6V. This chip carrier is ideal for industrial applications requiring very thin profile and surface mount compatibility.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 8,201 parts In-Stock

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Digiode

USA . 2,093 parts In-Stock

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AZTECH Wire

Italy . 849 parts In-Stock

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$10.118

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One Stop Electronics

USA . 803 parts In-Stock

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Parana Technologies

USA . 2,058 parts In-Stock

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DigiPath Technology Company

USA . 1,305 parts In-Stock

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ChromeModa Solutions

Germany . 408 parts In-Stock

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$27.003

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IDEA Electronic Components Group

UK . 166 parts In-Stock

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$27.003

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$25.653

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Corohmni

South Africa . 135 parts In-Stock

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Corphita

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Northwest PG Solutions

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Native Components

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Overview

Experience the cutting-edge technology of the Texas Instruments CC430F6145IRGC, a high-quality microprocessor circuit designed for a wide range of applications. With its advanced features and industrial-grade temperature tolerance, this chip carrier offers unmatched performance and reliability. From IoT devices to industrial automation systems, this versatile IC delivers seamless integration and superior functionality. Trust in Texas Instruments for exceptional quality and innovation that drives success in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are commonly used in electronic components due to their durability and ability to withstand high temperatures, making this product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation on a circuit board, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, making the product versatile for different applications.

Package Shape: SQUARE

The square package shape is compact and allows for efficient use of space on a circuit board.

No. of Terminals: 64

Having a high number of terminals allows for more connections and functionality in the product, making it suitable for complex electronic systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and compact design for the product.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage ensures efficient power consumption and operation, making the product energy-efficient.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can operate effectively in various environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the product can function in cold environments without any issues.

Terminal Position: QUAD

The quad terminal position allows for easy connections and ensures stability in the product's electrical connections.

Maximum Seated Height: 1 mm

The low maximum seated height ensures that the product can fit in compact spaces and slim electronic devices.

Width: 9 mm

The compact width of the product makes it suitable for use in small electronic devices and circuit board designs.

Length: 9 mm

The short length of the product further enhances its compact design and suitability for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can operate reliably in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, the product offers advanced processing capabilities and can handle complex tasks efficiently.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the manufacturing process and ensures a reliable connection without the risk of lead contamination.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is commonly used in electronic devices, ensuring compatibility and ease of integration with existing systems.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for fine-pitch connections, enabling high-density mounting and reducing the overall size of the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC430F6145IRGC attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

JESD-30 Code:

S-PQCC-N64

Length:

9 mm

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Peripheral IC Type:

Trade Compliance

CC430F6145IRGC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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