Loading...

CC430F6143IRGCR

Texas Instruments

CC430F6143IRGCR by Texas Instruments

CC430F6143IRGCR by Texas Instruments is a 16-bit microprocessor with 2/3.3V power supplies, 2048 bytes of RAM, and 8192 ROM words. Ideal for industrial applications, it operates b/w -40 to 85°C and features FLASH ROM programmability in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,424 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,424

-

-

-

-

Digiode

USA . 3,062 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,062

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 874 parts In-Stock

1+ parts

$0.162

100+ parts

-

1k+ parts

-

10k+ parts

$0.155

874

$0.162

-

-

$0.155

Northwest PG Solutions

USA . 992 parts In-Stock

1+ parts

$0.178

100+ parts

-

1k+ parts

-

10k+ parts

$0.157

992

$0.178

-

-

$0.157

AZTECH Wire

Italy . 893 parts In-Stock

1+ parts

$11.049

100+ parts

-

1k+ parts

-

10k+ parts

-

893

$11.049

-

-

-

One Stop Electronics

USA . 394 parts In-Stock

1+ parts

$25.000

100+ parts

-

1k+ parts

-

10k+ parts

-

394

$25.000

-

-

-

Corohmni

South Africa . 1,095 parts In-Stock

1+ parts

$38.108

100+ parts

-

1k+ parts

-

10k+ parts

-

1,095

$38.108

-

-

-

Parana Technologies

USA . 2,157 parts In-Stock

1+ parts

$53.717

100+ parts

-

1k+ parts

-

10k+ parts

-

2,157

$53.717

-

-

-

DigiPath Technology Company

USA . 1,148 parts In-Stock

1+ parts

$59.149

100+ parts

$54.417

1k+ parts

-

10k+ parts

-

1,148

$59.149

$54.417

-

-

ChromeModa Solutions

Germany . 1,725 parts In-Stock

1+ parts

$60.356

100+ parts

$49.492

1k+ parts

-

10k+ parts

-

1,725

$60.356

$49.492

-

-

IDEA Electronic Components Group

UK . 391 parts In-Stock

1+ parts

$60.356

100+ parts

$57.338

1k+ parts

$54.320

10k+ parts

-

391

$60.356

$57.338

$54.320

-

Corphita

USA . 3,203 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,203

-

-

-

-

Overview

Discover the cutting-edge CC430F6143IRGCR by Texas Instruments, a top-tier manufacturer known for producing high-quality microprocessor circuits. This innovative product falls under the category of Other Function uPs,uCs & Peripheral ICs, boasting a 16-bit size and impressive 2048 RAM bytes. Ideal for industrial applications, this chip carrier with a very thin profile offers unmatched performance at a nominal supply voltage of 3.3V. Unlock the potential of your projects with the CC430F6143IRGCR, delivering reliability, efficiency, and precision in every use.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for more flexibility in power requirements and greater compatibility with different applications.

Package Shape: SQUARE

Square packages are space-efficient and allow for easier PCB layout and routing of traces.

Bit Size: 16

A larger bit size allows for higher processing capabilities and more complex operations to be performed.

Power Supplies (V): 2/3.3

Having multiple power supply options allows for flexibility in different power scenarios and compatibility with various systems.

No. of Terminals: 64

Higher number of terminals facilitate more connections and functionalities, making the product versatile in its applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of package styles provides thermal management, protection, and a compact form factor for the product.

Minimum Supply Voltage: 2.4 V

Having a low minimum supply voltage enables operation in lower power scenarios and enhances energy efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand elevated heat conditions without performance degradation.

CPU Family: MSP430

Being part of the MSP430 family means access to a proven and reliable set of microcontrollers with a wide range of features and support.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this product suitable for use in extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable connections.

Terminal Position: QUAD

Quad terminal position allows for easy and secure soldering on the PCB, enhancing the product's reliability in operation.

ROM Words: 8192

Having a large ROM capacity allows for storing a significant amount of data and program instructions for more complex applications.

Maximum Seated Height: 1 mm

A low seated height enables the product to be compact and suitable for applications with space constraints.

Width: 9 mm

A compact width dimension contributes to the space-saving design and ease of integration into various electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

The product's ability to withstand reflow soldering processes for up to 30 seconds ensures reliable solder joints and easy assembly.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can endure the soldering process without damage, ensuring proper functionality.

Length: 9 mm

A compact length dimension contributes to the overall space-saving design and ease of integration into various electronic systems.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperatures means the product can operate reliably in harsh and demanding environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Featuring a microprocessor circuit allows the product to process data and perform complex functions for diverse applications.

RAM Bytes: 2048

With a larger RAM capacity, the product can store and access more data quickly, enhancing its performance in multitasking scenarios.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and fast switching speeds, improving overall product efficiency.

Terminal Form: NO LEAD

No-lead terminal form is environmentally friendly and provides better solder joint reliability for long-term product operation.

Nominal Supply Voltage: 3.3 V

Having a stable nominal supply voltage simplifies power management and ensures consistent performance across different applications.

ROM Programmability: FLASH

Using flash ROM allows for easy reprogramming of the memory, enabling firmware updates and customization of the product's functionality.

Terminal Pitch: 0.5 mm

With a fine terminal pitch, the product supports high-density PCB designs, enabling more compact and feature-rich electronic devices.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates that the product can withstand moderate exposure to moisture during soldering processes, ensuring reliability.

Speed: 20 rpm

With a speed of 20 rpm, the product can perform fast data processing and execute commands swiftly, enhancing overall system performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC430F6143IRGCR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Bit Size:

16

CPU Family:

MSP430

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Trade Compliance

CC430F6143IRGCR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19