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CC430F6147IRGCT

Texas Instruments

CC430F6147IRGCT by Texas Instruments

CC430F6147IRGCT by Texas Instruments is a 16-bit microprocessor circuit with 64 terminals and a max clock frequency of 20 MHz. It is commonly used in industrial applications due to its wide temperature range and compatibility with I2C, SPI, UART, and USB bus protocols.

Median Price

$8.232

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 500 parts In-Stock

1+ parts

$6.845

100+ parts

$5.580

1k+ parts

$3.720

10k+ parts

-

500

$6.845

$5.580

$3.720

-

DigiKey

USA . 2,969 parts In-Stock

1+ parts

$9.620

100+ parts

$7.303

1k+ parts

$6.542

10k+ parts

$6.369

2,969

$9.620

$7.303

$6.542

$6.369

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 40 parts In-Stock

1+ parts

$5.580

100+ parts

-

1k+ parts

-

10k+ parts

-

40

$5.580

-

-

-

Digiode

USA . 1,414 parts In-Stock

1+ parts

$6.503

100+ parts

-

1k+ parts

-

10k+ parts

-

1,414

$6.503

-

-

-

Vyrian

USA . 1,671 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,671

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,746 parts In-Stock

1+ parts

$5.580

100+ parts

-

1k+ parts

-

10k+ parts

$5.468

4,746

$5.580

-

-

$5.468

Netroflash

USA . 500 parts In-Stock

1+ parts

$5.580

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$5.580

-

-

-

Ampacity Inc.

Singapore . 1,540 parts In-Stock

1+ parts

$5.820

100+ parts

-

1k+ parts

-

10k+ parts

-

1,540

$5.820

-

-

-

Corphita

USA . 3,872 parts In-Stock

1+ parts

$6.160

100+ parts

-

1k+ parts

-

10k+ parts

-

3,872

$6.160

-

-

-

Corohmni

South Africa . 3,035 parts In-Stock

1+ parts

$15.293

100+ parts

-

1k+ parts

-

10k+ parts

-

3,035

$15.293

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$50.935

100+ parts

$46.351

1k+ parts

$41.767

10k+ parts

-

5,000

$50.935

$46.351

$41.767

-

Parana Technologies

USA . 2,206 parts In-Stock

1+ parts

$61.784

100+ parts

$5,737.563

1k+ parts

$55.605

10k+ parts

-

2,206

$61.784

$5,737.563

$55.605

-

DigiPath Technology Company

USA . 943 parts In-Stock

1+ parts

$68.032

100+ parts

-

1k+ parts

-

10k+ parts

-

943

$68.032

-

-

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ChromeModa Solutions

Germany . 1,699 parts In-Stock

1+ parts

$69.420

100+ parts

$56.924

1k+ parts

-

10k+ parts

-

1,699

$69.420

$56.924

-

-

IDEA Electronic Components Group

UK . 36 parts In-Stock

1+ parts

$69.420

100+ parts

$65.949

1k+ parts

$62.478

10k+ parts

-

36

$69.420

$65.949

$62.478

-

Argo Parts USA

USA . 2,741 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,741

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-

-

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Component Stockers USA

USA . 614 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

614

-

-

-

-

Overview

Discover the CC430F6147IRGCT by Texas Instruments, a high-quality microprocessor circuit that offers unmatched performance and reliability. With its advanced technology and impressive features, this product is perfect for a wide range of applications. Whether you need it for industrial or commercial purposes, this chip carrier with a very thin profile delivers exceptional results. Benefit from its flash ROM programmability, extensive bus compatibility, and versatile terminal positions. Experience the value and advantages that this Texas Instruments product brings to your projects. Upgrade your designs with the CC430F6147IRGCT and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the integrated circuits inside, making the product reliable for long-term use.

Surface Mount: YES

This feature enables easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of operating voltages, offering flexibility in different applications.

Bit Size: 16

The 16-bit architecture enables faster processing and higher performance compared to lower bit sizes.

Power Supplies (V): 2/3.3

Supports multiple power supply options, catering to different power requirements and scenarios.

No. of Terminals: 64

Sufficient number of terminals for connectivity and interface with peripheral devices and components.

ADC Channels: YES

Integrated ADC channels allow for analog-to-digital conversion, expanding the range of input signals that can be processed.

ROM Words: 32768

Large ROM capacity for storing program instructions and data, enabling complex algorithms and applications to be implemented.

RAM Words: 4

Sufficient RAM capacity for temporary data storage and processing, supporting multitasking and data manipulation.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the product energy-efficient and responsive.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporation of a microprocessor circuit enhances the overall functionality and processing capabilities of the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC430F6147IRGCT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART; USB

CPU Family:

MSP430

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Trade Compliance

CC430F6147IRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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