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CC430F6147IRGCR

Texas Instruments

CC430F6147IRGCR by Texas Instruments

The Texas Instruments CC430F6147IRGCR is a 16-bit microprocessor with 64 terminals, operating at up to 20 MHz. It features 32768 ROM words and 4096 RAM bytes, suitable for industrial applications requiring low power consumption and high clock frequency. With I2C, SPI, UART, and USB compatibility, it offers versatile connectivity options in a compact chip carrier package.

Median Price

$7.862

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,621 parts In-Stock

1+ parts

$5.704

100+ parts

$4.650

1k+ parts

$3.100

10k+ parts

-

8,621

$5.704

$4.650

$3.100

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Mouser Electronics

USA . 1,894 parts In-Stock

1+ parts

$10.020

100+ parts

$6.410

1k+ parts

$4.920

10k+ parts

$4.780

1,894

$10.020

$6.410

$4.920

$4.780

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$3.935

100+ parts

-

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100

$3.935

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Digiode

USA . 1,061 parts In-Stock

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$5.419

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-

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1,061

$5.419

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Vyrian

USA . 5,042 parts In-Stock

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5,042

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Chip Stock

USA . 145 parts In-Stock

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145

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LittleDiode

UK . 2 parts In-Stock

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2

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,123 parts In-Stock

1+ parts

$3.935

100+ parts

-

1k+ parts

-

10k+ parts

$3.856

6,123

$3.935

-

-

$3.856

Argo Parts USA

USA . 2,045 parts In-Stock

1+ parts

$3.935

100+ parts

-

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2,045

$3.935

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Netroflash

USA . 500 parts In-Stock

1+ parts

$3.935

100+ parts

-

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500

$3.935

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Ampacity Inc.

Singapore . 5,130 parts In-Stock

1+ parts

$4.850

100+ parts

-

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5,130

$4.850

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Corphita

USA . 3,624 parts In-Stock

1+ parts

$5.134

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3,624

$5.134

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Semicontronic

India . 4,802 parts In-Stock

1+ parts

$10.550

100+ parts

$10.286

1k+ parts

$10.234

10k+ parts

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4,802

$10.550

$10.286

$10.234

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Corohmni

South Africa . 2,894 parts In-Stock

1+ parts

$19.834

100+ parts

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2,894

$19.834

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Parana Technologies

USA . 211 parts In-Stock

1+ parts

$45.248

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211

$45.248

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DigiPath Technology Company

USA . 2,131 parts In-Stock

1+ parts

$49.823

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2,131

$49.823

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ChromeModa Solutions

Germany . 4,941 parts In-Stock

1+ parts

$50.840

100+ parts

$41.689

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4,941

$50.840

$41.689

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IDEA Electronic Components Group

UK . 168 parts In-Stock

1+ parts

$50.840

100+ parts

$48.298

1k+ parts

$45.756

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168

$50.840

$48.298

$45.756

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A-Z Elektronik GmbH

Germany . 6,628 parts In-Stock

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6,628

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Alle Elektronik GmbH

Germany . 3,085 parts In-Stock

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3,085

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Kepictronics

USA . 1,722 parts In-Stock

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Overview

Experience the pinnacle of quality and innovation with the CC430F6147IRGCR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge technology that guarantees superior performance and reliability. This versatile microprocessor circuit is ideal for a wide range of applications, providing customers with unmatched value and benefits. Discover endless possibilities with the CC430F6147IRGCR and revolutionize your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in manufacturing.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, the product can operate reliably in a wide range of power supply conditions.

Package Shape: SQUARE

Square package shape provides efficient use of space on the PCB layout.

Bit Size: 16

16-bit architecture allows for complex processing and calculation tasks to be performed efficiently.

Power Supplies (V): 2/3.3

Support for dual power supply voltages offers flexibility in system design and integration.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles offer compatibility with different mounting and cooling options, enabling versatile use in various environments.

Minimum Supply Voltage: 2.4 V

Low minimum supply voltage allows for efficient power management and extended battery life in portable devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliability and performance in demanding industrial conditions.

CPU Family: MSP430

MSP430 CPU family is known for its low power consumption and high performance, making it suitable for battery-powered applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the product to function in extreme cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

Terminal finish with a combination of metals provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

ADC Channels: YES

Integrated ADC channels allow for analog signal processing, expanding the product's capability to interface with sensors and other analog devices.

Terminal Position: QUAD

Quad terminal position enhances solder joint reliability and provides mechanical stability during PCB assembly and operation.

ROM Words: 32768

Large ROM capacity of 32768 words allows for storing program instructions and data for complex applications.

Maximum Seated Height: 1 mm

Low seated height enables the product to be used in compact designs and slim-profile devices.

RAM Words: 4

Although the RAM capacity is modest at 4 words, it still allows for temporary data storage and efficient processing.

Width: 9 mm

Narrow width of 9mm facilitates space-saving integration in tight layouts or small form factor systems.

Maximum Clock Frequency: 20 MHz

High clock frequency of 20 MHz enables fast data processing and real-time operation in time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature of 30 seconds ensures proper soldering and joint formation during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C guarantees reliable and durable solder joints for robust performance.

Length: 9 mm

Short length of 9mm complements the narrow width, allowing for compact and space-efficient PCB layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can withstand harsh environmental conditions and operate reliably in industrial settings.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, the product offers advanced computational capabilities and versatile peripheral interfaces for various applications.

RAM Bytes: 4096

Large RAM capacity of 4096 bytes provides ample space for data storage and efficient memory management.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance and energy efficiency.

Terminal Form: NO LEAD

No-lead terminal form simplifies soldering process and improves thermal performance and mechanical reliability.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent and reliable operation in various applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customization of the product's functionality.

Bus Compatibility: I2C; SPI; UART; USB

Compatibility with multiple communication interfaces such as I2C, SPI, UART, and USB enhances connectivity and interoperability with other devices.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting and space-saving design in compact electronic systems.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product can withstand moderate exposure to moisture during storage and handling.

Speed: 20 rpm

High-speed operation of 20 rpm ensures efficient processing and response times for real-time applications and control systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC430F6147IRGCR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART; USB

CPU Family:

MSP430

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Trade Compliance

CC430F6147IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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