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AM5K2E04XABDA25

Texas Instruments

AM5K2E04XABDA25 by Texas Instruments

AM5K2E04XABDA25 by Texas Instruments is a microprocessor with integrated cache and 64-bit external data bus width. It operates in industrial temperature range, featuring 2097152 RAM words and 16-bit address bus width. Ideal for applications requiring high-speed processing and low power consumption.

Median Price

$186.047

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 190 parts In-Stock

1+ parts

$136.124

100+ parts

$123.215

1k+ parts

$117.348

10k+ parts

-

190

$136.124

$123.215

$117.348

-

Mouser Electronics

USA . 5 parts In-Stock

1+ parts

$235.970

100+ parts

$188.640

1k+ parts

-

10k+ parts

-

5

$235.970

$188.640

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,626 parts In-Stock

1+ parts

$129.318

100+ parts

-

1k+ parts

-

10k+ parts

-

4,626

$129.318

-

-

-

Vyrian

USA . 7,799 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,799

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 667 parts In-Stock

1+ parts

$0.879

100+ parts

-

1k+ parts

-

10k+ parts

-

667

$0.879

-

-

-

Northwest PG Solutions

USA . 1,460 parts In-Stock

1+ parts

$0.967

100+ parts

-

1k+ parts

-

10k+ parts

-

1,460

$0.967

-

-

-

Parana Technologies

USA . 1,879 parts In-Stock

1+ parts

$29.110

100+ parts

-

1k+ parts

$55.544

10k+ parts

-

1,879

$29.110

-

$55.544

-

DigiPath Technology Company

USA . 1,484 parts In-Stock

1+ parts

$32.054

100+ parts

$29.490

1k+ parts

-

10k+ parts

-

1,484

$32.054

$29.490

-

-

ChromeModa Solutions

Germany . 1,693 parts In-Stock

1+ parts

$32.708

100+ parts

$26.821

1k+ parts

-

10k+ parts

-

1,693

$32.708

$26.821

-

-

IDEA Electronic Components Group

UK . 1,240 parts In-Stock

1+ parts

$32.708

100+ parts

$31.073

1k+ parts

$29.437

10k+ parts

-

1,240

$32.708

$31.073

$29.437

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Corphita

USA . 2,991 parts In-Stock

1+ parts

$122.512

100+ parts

-

1k+ parts

-

10k+ parts

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2,991

$122.512

-

-

-

Microchip USA

USA . 2,615 parts In-Stock

1+ parts

$165.520

100+ parts

$161.100

1k+ parts

$158.890

10k+ parts

$156.690

2,615

$165.520

$161.100

$158.890

$156.690

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

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Overview

Unleash the power of cutting-edge technology with the AM5K2E04XABDA25 from Texas Instruments. As a leader in microprocessor manufacturing, Texas Instruments delivers unparalleled quality and reliability. This microprocessor is versatile, with applications ranging from industrial automation to consumer electronics. With integrated cache and advanced features like boundary scan and low power mode, this processor offers unmatched performance and efficiency. Elevate your projects with the AM5K2E04XABDA25 and experience the ultimate in innovation and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for packaging microprocessors due to its durability and cost-effectiveness.

Integrated Cache: YES

Having an integrated cache enables faster access to frequently used data, improving overall performance.

Maximum Supply Voltage: 1.05 V

Operating at a lower voltage helps in reducing power consumption and heat generation.

Address Bus Width: 16

A wider address bus allows for larger memory addressing capabilities, which can be beneficial for complex applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array package style provides a high terminal count in a compact form factor, saving space on the PCB.

Width: 27 mm

The compact width of the microprocessor allows for efficient integration into various electronic devices.

Peripheral IC Type: MICROPROCESSOR, RISC

Utilizing RISC architecture in the microprocessor helps in improving performance through simplified instruction set and reduced complexity.

Technology: CMOS

CMOS technology enables low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Moisture Sensitivity Level (MSL): 4

A moisture sensitivity level of 4 indicates that the microprocessor can withstand multiple reflows without degradation, ensuring long-term reliability.

Low Power Mode: YES

The availability of a low power mode allows the microprocessor to conserve energy when not operating at full capacity, extending battery life in portable devices.

Technical Specifications

Microprocessors AM5K2E04XABDA25 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1089

JESD-609 Code:

e1

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

5

No. of Terminals:

On Chip Data RAM Width:

8

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

RAM Words:

2097152

Maximum Seated Height:

3.55 mm

Speed:

1250 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Peripheral IC Type:

Trade Compliance

AM5K2E04XABDA25 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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