Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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AM5K2E02ABD by Texas Instruments is a microprocessor with 64-bit external data bus width, 16-bit address bus width, and integrated cache. It is suitable for applications requiring high-speed processing in a compact form factor, such as embedded systems and industrial automation. The processor operates at speeds up to 1000 rpm and features low power mode for energy-efficient performance.
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This material provides good protection and durability for the microprocessor, ensuring a longer lifespan.
Having an integrated cache improves the speed and efficiency of the microprocessor, making it perform better for various tasks.
Surface mount technology allows for easier and more efficient installation of the microprocessor on circuit boards.
Operating at a relatively low maximum supply voltage helps in reducing power consumption and heat generation, making it energy efficient.
A wider address bus allows for faster data transfer and processing, enhancing the overall performance of the microprocessor.
The square shape of the package may provide better thermal dissipation and easier mounting on circuit boards.
Having a high number of terminals allows for more connections and functionalities, making the microprocessor versatile and capable of handling various tasks.
The grid array package style with fine pitch makes the microprocessor suitable for high-density mounting and provides better electrical performance.
The low minimum supply voltage allows for power-efficient operation and extends the battery life of devices using this microprocessor.
The high maximum operating temperature tolerance ensures the microprocessor can function reliably even in challenging thermal conditions.
The low minimum operating temperature indicates the microprocessor can operate in a wide range of environments, from cold to hot temperatures.
Bottom terminal position may facilitate better heat dissipation and easier assembly of the microprocessor on circuit boards.
The relatively low maximum seated height allows for compact designs and thinner devices when integrating this microprocessor.
A moderate width size provides a good balance between compactness and ease of handling during installation of the microprocessor.
Having boundary scan capability allows for easier testing and debugging of the microprocessor, enhancing reliability and ease of maintenance.
A wider external data bus width enables faster data transfer between the microprocessor and other components, improving overall system performance.
The length of the microprocessor is balanced with its width, providing a compact form factor suitable for various applications.
Being a RISC microprocessor type indicates it is optimized for high performance and efficient operation in tasks requiring rapid processing speeds.
Using CMOS technology makes the microprocessor power-efficient, reliable, and capable of high-speed processing suitable for a wide range of applications.
Ball terminal form allows for easier installation and better electrical connections, enhancing the reliability and performance of the microprocessor.
Having a nominal supply voltage in the optimal range ensures stable and efficient operation of the microprocessor in various applications.
The moderate terminal pitch makes it easier to solder and connect the microprocessor, facilitating smooth integration into electronic devices.
The floating-point format allows for accurate and high-speed mathematical calculations, making the microprocessor suitable for computation-intensive tasks.
Operating at a high speed of 1000 rpm ensures quick processing and response times, making the microprocessor efficient for multitasking and demanding applications.
Having a low power mode option allows for energy-efficient operation, extending the battery life of devices using this microprocessor and reducing overall power consumption.
Microprocessors AM5K2E02ABD attributes and parameters. Explore more Microprocessors devices from Texas Instruments
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External Data Bus Width:
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Integrated Cache:
JESD-30 Code:
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Low Power Mode:
No. of Terminals:
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AM5K2E02ABD Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
LL4148
Rfe International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
OPA2277UA
Texas Instruments
OPA2277UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 100 uV and micropower consumption of 1.65 mA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1000 kHz in a small outline package.
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148WS
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
LM358N
NXP Semiconductors
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; JESD-609 Code: e3; Minimum DS Breakdown Voltage: 60 V;
BAV99-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Config: SINGLE;
C0603C104K5RACAUTO
KEMET Corporation
KEMET C0603C104K5RACAUTO is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for automotive applications meeting AEC-Q200 standard, it comes in SMT package with matte tin finish and wraparound terminals.
Vishay Intertechnology
2N7002 by Vishay Intertechnology is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE, suitable for surface mount with GULL WING terminals.
SS14
Onsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Synsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Infineon Technologies
Diotec Semiconductor Ag
Samsung
Changzhou Starsea Electronics
RC0603FR-071KL
Yageo
Yageo's RC0603FR-071KL is a fixed resistor with 1000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. Ideal for surface mount applications in electronics, it operates b/w -55 to 155 °C with a temperature coefficient of 100 ppm/°C.
MC33269T-3.3G
MC33269T-3.3G by Onsemi is a fixed positive single output LDO regulator with a max output current of 0.8 A and a dropout voltage of 1.35 V. It is commonly used in applications that require stable voltage regulation, such as power supplies for electronic devices.
FDD5614P
FDD5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 0.1 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 175°C. The PLASTIC/EPOXY package with GULL WING terminals ensures efficient heat dissipation and reliable performance.
MCF5485CZP200
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;
STM32MP131CAG3T
STMicroelectronics
STM32MP131CAG3T by STMicroelectronics is a 32-bit microprocessor with 48 MHz clock frequency, 172032 RAM words, and 56 DMA channels. It is used in applications requiring low power mode, such as IoT devices and embedded systems.
CM8063701098702SR0PA
Intel
Intel CM8063701098702SR0PA is a 64-bit microprocessor with 1155 terminals. It operates at a speed of 3500 rpm and features integrated cache. Suitable for various applications requiring high processing power in a square package shape.
MPC8323ECVRAFDCA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
MCIMX537CVV8CR2
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;
SAM9X60D6K-I/4GB
Microchip Technology
SAM9X60D6K-I/4GB by Microchip features 16 DMA channels, 50MHz clock frequency, and 1.8V nominal voltage. Ideal for industrial applications requiring a low power mode, this microprocessor with integrated cache and 16-bit external data bus width is designed for high-speed processing in compact devices.
MCIMX6U5EVM10ACR
MCIMX6U5EVM10ACR by NXP Semiconductors is a 32-bit microprocessor with 64-bit external data bus width, operating at max 24 MHz clock frequency. Ideal for low power applications, it features integrated cache and boundary scan support. Its grid array package style makes it suitable for compact electronic devices.
MPC8248CVRTIEA
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
MCIMX6U5DVM10AB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
MCF54452CVR200
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE;
AM3517AZCNC
The Texas Instruments AM3517AZCNC microprocessor features 16-bit address and external data bus width, with a max clock frequency of 26 MHz. It operates at supply voltages of 1.2V, 1.8V, and 3.3V, suitable for low power mode applications in various devices requiring high-speed processing capabilities. The package style is grid array with a low profile and fine pitch design, making it ideal for compact electronic systems where space is limited.
STM32MP135FAF7
STM32MP135FAF7 by STMicroelectronics is a 32-bit microprocessor with integrated cache, 48 MHz clock frequency, and 172032 RAM words. It is used in applications requiring low power mode, such as embedded systems and IoT devices. With a max supply voltage of 1.38 V and operating temperature range from -40 to 105 °C, it offers high performance in a compact square package shape.
P1010NXE5HHB
MICROPROCESSOR, RISC; No. of Terminals: 425; Package Body Material: PLASTIC/EPOXY; Terminal Finish: TIN SILVER; Package Equivalence Code: BGA425,23X23,32; Technology: CMOS;
T1023NSE7PQA
The NXP Semiconductors T1023NSE7PQA microprocessor features a 64-bit architecture, 16-bit address bus width, and 32-bit external data bus width. Ideal for applications requiring high-speed processing, it operates b/w 0 to 105°C with low power mode support.
STM32MP157CAD3
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
MPC8280ZUUPEA
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE;
MC7448HX1400ND
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE;
MIMXRT1015CAF4A
The NXP Semiconductors MIMXRT1015CAF4A microprocessor features a 32-bit architecture with integrated cache and 131072 RAM words. With a max clock frequency of 24 MHz, it is suitable for industrial applications requiring low power mode and boundary scan capability. This CMOS technology chip operates in an extended temperature range from -40 to 105°C, making it ideal for various embedded systems.
SAM9X60D6KT-I/4GB
SAM9X60D6KT-I/4GB by Microchip features 16 DMA channels, 50MHz clock frequency, and 1.8V nominal voltage. Ideal for industrial applications requiring a low power mode, this microprocessor with integrated cache and 16-bit external data bus width is designed for high-speed processing in compact systems.
MC9328MXSVP10
MC9328MXSVP10 by NXP Semiconductors is a 32-bit microprocessor with 225 terminals, operating at a max frequency of 16 MHz. It features an address bus width of 25 bits and external data bus width of 32 bits. Ideal for applications requiring low power mode and fixed point format in commercial temperature grade environments.
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DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
AM5K2E04XABD4
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1089; Package Code: FBGA; Package Shape: SQUARE;
AM5K2E02ABDA25
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1089; Package Code: FBGA; Package Shape: SQUARE;
AM5K2E02XABD
AM5K2E02DABDA25
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1089; Package Code: FBGA; Package Shape: SQUARE; Maximum Supply Voltage: .997 V;
AM5K2E02SABDA25
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1089; Package Code: FBGA; Package Shape: SQUARE; Technology: CMOS;
AM5K2E02DABD4
AM5K2E02XABD25
AM5K2E02ABD25
AM5K2E02ABDA4
AM5K2E02DABDA4
AM5K2E02SABD
AM5K2E02SABDA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1089; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;
AM5K2E02DABD25
AM5K2E02SABDA4
AM5K2E02ABDA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1089; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;
AM5K2E02SABD25
AM5K2E02DABDA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1089; Package Code: FBGA; Package Shape: SQUARE; Format: FLOATING POINT;
AM5K2E02ABD4
AM5K2E02DABD
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