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AM5K2E02ABD

Texas Instruments

AM5K2E02ABD by Texas Instruments

AM5K2E02ABD by Texas Instruments is a microprocessor with 64-bit external data bus width, 16-bit address bus width, and integrated cache. It is suitable for applications requiring high-speed processing in a compact form factor, such as embedded systems and industrial automation. The processor operates at speeds up to 1000 rpm and features low power mode for energy-efficient performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,974 parts In-Stock

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Digiode

USA . 1,181 parts In-Stock

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1,181

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Distributors (Availability)

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One Stop Electronics

USA . 679 parts In-Stock

1+ parts

$1.000

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679

$1.000

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AZTECH Wire

Italy . 295 parts In-Stock

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$10.080

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295

$10.080

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Parana Technologies

USA . 969 parts In-Stock

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$27.849

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$40.696

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969

$27.849

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$40.696

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ChromeModa Solutions

Germany . 3,991 parts In-Stock

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$31.291

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$25.659

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3,991

$31.291

$25.659

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IDEA Electronic Components Group

UK . 1,685 parts In-Stock

1+ parts

$31.291

100+ parts

$29.726

1k+ parts

$28.162

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1,685

$31.291

$29.726

$28.162

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Native Components

USA . 294 parts In-Stock

1+ parts

$67.700

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$64.992

294

$67.700

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$64.992

Northwest PG Solutions

USA . 181 parts In-Stock

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$74.470

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$74.470

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DigiPath Technology Company

USA . 1,569 parts In-Stock

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$28.212

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Corphita

USA . 118 parts In-Stock

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Overview

Experience top-notch performance and reliability with the AM5K2E02ABD microprocessor by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge technology to meet your digital processing needs. This microprocessor is versatile and efficient, making it perfect for a wide range of applications. With its integrated cache and low power mode, you can trust this product to provide seamless operation while maximizing energy efficiency. Upgrade your system today with the AM5K2E02ABD and enjoy unparalleled value and benefits like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection and durability for the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Having an integrated cache improves the speed and efficiency of the microprocessor, making it perform better for various tasks.

Surface Mount: YES

Surface mount technology allows for easier and more efficient installation of the microprocessor on circuit boards.

Maximum Supply Voltage: 0.997 V

Operating at a relatively low maximum supply voltage helps in reducing power consumption and heat generation, making it energy efficient.

Address Bus Width: 16

A wider address bus allows for faster data transfer and processing, enhancing the overall performance of the microprocessor.

Package Shape: SQUARE

The square shape of the package may provide better thermal dissipation and easier mounting on circuit boards.

No. of Terminals: 1089

Having a high number of terminals allows for more connections and functionalities, making the microprocessor versatile and capable of handling various tasks.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array package style with fine pitch makes the microprocessor suitable for high-density mounting and provides better electrical performance.

Minimum Supply Voltage: 0.902 V

The low minimum supply voltage allows for power-efficient operation and extends the battery life of devices using this microprocessor.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures the microprocessor can function reliably even in challenging thermal conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature indicates the microprocessor can operate in a wide range of environments, from cold to hot temperatures.

Terminal Position: BOTTOM

Bottom terminal position may facilitate better heat dissipation and easier assembly of the microprocessor on circuit boards.

Maximum Seated Height: 3.55 mm

The relatively low maximum seated height allows for compact designs and thinner devices when integrating this microprocessor.

Width: 27 mm

A moderate width size provides a good balance between compactness and ease of handling during installation of the microprocessor.

Boundary Scan: YES

Having boundary scan capability allows for easier testing and debugging of the microprocessor, enhancing reliability and ease of maintenance.

External Data Bus Width: 64

A wider external data bus width enables faster data transfer between the microprocessor and other components, improving overall system performance.

Length: 27 mm

The length of the microprocessor is balanced with its width, providing a compact form factor suitable for various applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor type indicates it is optimized for high performance and efficient operation in tasks requiring rapid processing speeds.

Technology: CMOS

Using CMOS technology makes the microprocessor power-efficient, reliable, and capable of high-speed processing suitable for a wide range of applications.

Terminal Form: BALL

Ball terminal form allows for easier installation and better electrical connections, enhancing the reliability and performance of the microprocessor.

Nominal Supply Voltage: 0.95 V

Having a nominal supply voltage in the optimal range ensures stable and efficient operation of the microprocessor in various applications.

Terminal Pitch: 0.8 mm

The moderate terminal pitch makes it easier to solder and connect the microprocessor, facilitating smooth integration into electronic devices.

Format: FLOATING POINT

The floating-point format allows for accurate and high-speed mathematical calculations, making the microprocessor suitable for computation-intensive tasks.

Speed: 1000 rpm

Operating at a high speed of 1000 rpm ensures quick processing and response times, making the microprocessor efficient for multitasking and demanding applications.

Low Power Mode: YES

Having a low power mode option allows for energy-efficient operation, extending the battery life of devices using this microprocessor and reducing overall power consumption.

Technical Specifications

Microprocessors AM5K2E02ABD attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1089

Length:

27 mm

Low Power Mode:

YES

No. of Terminals:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

3.55 mm

Speed:

1000 rpm

Maximum Supply Voltage:

.997 V

Minimum Supply Voltage:

.902 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

AM5K2E02ABD Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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