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AM5K2E02ABD25

Texas Instruments

AM5K2E02ABD25 by Texas Instruments

AM5K2E02ABD25 by Texas Instruments is a microprocessor with integrated cache and 64-bit external data bus width. It operates b/w 0-85 °C, has 32 DMA channels, and supports floating point format. Ideal for high-performance computing applications requiring low power consumption.

Median Price

$138.440

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 314 parts In-Stock

1+ parts

$107.681

100+ parts

$104.442

1k+ parts

$80.963

10k+ parts

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314

$107.681

$104.442

$80.963

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Mouser Electronics

USA . 2 parts In-Stock

1+ parts

$169.200

100+ parts

$132.300

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2

$169.200

$132.300

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Distributors (In-Stock)

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Digiode

USA . 3,435 parts In-Stock

1+ parts

$102.297

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3,435

$102.297

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Bristol Electronics

USA . 40 parts In-Stock

1+ parts

$111.000

100+ parts

$97.680

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40

$111.000

$97.680

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Vyrian

USA . 4,398 parts In-Stock

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-

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4,398

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ACDS - Activité Composants Distribution Service

France . 40 parts In-Stock

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40

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Dan-Mar Components

USA . 40 parts In-Stock

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 291 parts In-Stock

1+ parts

$9.936

100+ parts

-

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291

$9.936

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Northwest PG Solutions

USA . 2,323 parts In-Stock

1+ parts

$10.929

100+ parts

$9.836

1k+ parts

-

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2,323

$10.929

$9.836

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$21.140

100+ parts

$19.237

1k+ parts

$17.335

10k+ parts

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5,000

$21.140

$19.237

$17.335

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Parana Technologies

USA . 1,211 parts In-Stock

1+ parts

$36.908

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-

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1,211

$36.908

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DigiPath Technology Company

USA . 1,228 parts In-Stock

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$40.641

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1,228

$40.641

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IDEA Electronic Components Group

UK . 2,343 parts In-Stock

1+ parts

$41.470

100+ parts

$39.396

1k+ parts

$37.323

10k+ parts

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2,343

$41.470

$39.396

$37.323

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ChromeModa Solutions

Germany . 1,512 parts In-Stock

1+ parts

$41.470

100+ parts

$34.005

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-

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1,512

$41.470

$34.005

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Corohmni

South Africa . 399 parts In-Stock

1+ parts

$85.889

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399

$85.889

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Corphita

USA . 2,965 parts In-Stock

1+ parts

$96.913

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2,965

$96.913

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Microchip USA

USA . 2,121 parts In-Stock

1+ parts

$118.490

100+ parts

$115.330

1k+ parts

$113.750

10k+ parts

$112.170

2,121

$118.490

$115.330

$113.750

$112.170

QUARKTWIN TECHNOLOGY LTD

USA . 7,662 parts In-Stock

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7,662

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Component Stockers USA

USA . 246 parts In-Stock

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246

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Overview

Discover the AM5K2E02ABD25 by Texas Instruments, a high-quality microprocessor that offers unparalleled performance and reliability. Manufactured by the renowned Texas Instruments, this microprocessor is perfect for a wide range of applications. With integrated cache and low power mode, this product provides exceptional value and benefits to customers. Whether you're looking to enhance your computing experience or boost efficiency in your projects, the AM5K2E02ABD25 delivers top-notch performance and functionality. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic or epoxy material provides durability and light weight, making the product suitable for portable devices.

Integrated Cache: YES

Integrated cache improves processing speed and efficiency by storing frequently accessed data and instructions, reducing the need to access main memory.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and enabling automated assembly processes.

Maximum Supply Voltage: 1.05 V

Operating within the specified voltage range ensures optimal performance and reduces the risk of damage to the microprocessor.

On Chip Data RAM Width: 8

A wider data RAM width allows for faster processing of data, enhancing overall performance of the microprocessor.

Address Bus Width: 16

A wider address bus enables the microprocessor to access a larger range of memory locations, increasing its capability to handle complex tasks.

Package Shape: SQUARE

Square package shape provides a uniform size and layout, making it easier to integrate the microprocessor into various applications and circuit designs.

No. of Terminals: 1089

Having a high number of terminals allows for a greater connection density, enabling more input/output options and functionalities in the device.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch design enhances connectivity and signal integrity, optimizing performance and reliability of the microprocessor in complex circuit layouts.

Minimum Supply Voltage: 0.95 V

Operating at low supply voltage minimizes power consumption and heat generation, making the microprocessor energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microprocessor can perform reliably in various environmental conditions without overheating or malfunctioning.

Minimum Operating Temperature: 0 °C

Having a low minimum operating temperature ensures the microprocessor can function in colder environments, providing versatility in application scenarios.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finish enhances connectivity, prevents corrosion, and ensures reliable electrical contacts for optimal performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies the installation and connection of the microprocessor on the circuit board, facilitating assembly and reducing complexity.

Maximum Seated Height: 3.55 mm

Low seated height allows for slim and compact designs, enabling the microprocessor to be used in space-constrained applications without compromising performance.

RAM Words: 2097152

Large RAM capacity enables the microprocessor to handle extensive data processing tasks and multitasking operations efficiently, enhancing overall performance.

Width: 27 mm

Moderate width allows for easy integration of the microprocessor into various system designs and configurations, providing flexibility in application requirements.

Boundary Scan: YES

Boundary scan feature simplifies testing and debugging of the microprocessor during manufacturing and maintenance, ensuring quality and reliability of the final product.

External Data Bus Width: 64

Wide external data bus width facilitates fast data transfer between the microprocessor and external devices, enhancing system efficiency and performance.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow temperature and time specifications ensure proper soldering and mounting of the microprocessor onto the circuit board, guaranteeing robust mechanical connections.

Peak Reflow Temperature °C: 245

High peak reflow temperature enables reliable soldering and bonding of the microprocessor components, ensuring durability and long-term stability of the product.

Length: 27 mm

Moderate length provides a balanced form factor for the microprocessor, allowing for efficient placement and integration within various device designs and layouts.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture enables faster execution of instructions and efficient processing of data, making the microprocessor suitable for high-performance computing applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of devices, making the microprocessor energy-efficient and versatile in different applications.

Terminal Form: BALL

Ball terminal form simplifies soldering and installation processes, ensuring secure connections and reliable electrical contacts for optimal performance of the microprocessor.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent and reliable operation of the microprocessor, reducing the risk of errors or malfunctions in the device.

No. of DMA Channels: 32

Having multiple DMA channels allows for efficient data transfer and processing, enhancing system performance and responsiveness in handling data-intensive tasks.

Terminal Pitch: 0.8 mm

Fine terminal pitch provides high-density connections and signal integrity, enabling reliable communication between the microprocessor and other components in the system.

Format: FLOATING POINT

Floating-point format supports complex mathematical computations and precision calculations, making the microprocessor suitable for scientific, engineering, and data-intensive applications.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates moderate sensitivity to moisture, requiring proper handling and storage to prevent damage and ensure the long-term reliability of the microprocessor.

Speed: 1250 rpm

High processing speed of 1250 revolutions per minute enables rapid execution of instructions and efficient data processing, enhancing overall performance and responsiveness.

Low Power Mode: YES

Low power mode feature enables energy-saving operation and efficient power management, extending battery life and reducing overall power consumption in the device.

Technical Specifications

Microprocessors AM5K2E02ABD25 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1089

JESD-609 Code:

e1

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

32

No. of Terminals:

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

RAM Words:

2097152

Maximum Seated Height:

3.55 mm

Speed:

1250 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Peripheral IC Type:

Trade Compliance

AM5K2E02ABD25 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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