Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
AM5K2E02ABD25 by Texas Instruments is a microprocessor with integrated cache and 64-bit external data bus width. It operates b/w 0-85 °C, has 32 DMA channels, and supports floating point format. Ideal for high-performance computing applications requiring low power consumption.
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Component Stockers USA
Plastic or epoxy material provides durability and light weight, making the product suitable for portable devices.
Integrated cache improves processing speed and efficiency by storing frequently accessed data and instructions, reducing the need to access main memory.
Surface mount technology allows for easy and efficient installation on circuit boards, saving space and enabling automated assembly processes.
Operating within the specified voltage range ensures optimal performance and reduces the risk of damage to the microprocessor.
A wider data RAM width allows for faster processing of data, enhancing overall performance of the microprocessor.
A wider address bus enables the microprocessor to access a larger range of memory locations, increasing its capability to handle complex tasks.
Square package shape provides a uniform size and layout, making it easier to integrate the microprocessor into various applications and circuit designs.
Having a high number of terminals allows for a greater connection density, enabling more input/output options and functionalities in the device.
Grid array with fine pitch design enhances connectivity and signal integrity, optimizing performance and reliability of the microprocessor in complex circuit layouts.
Operating at low supply voltage minimizes power consumption and heat generation, making the microprocessor energy-efficient and suitable for battery-powered devices.
With a high maximum operating temperature, the microprocessor can perform reliably in various environmental conditions without overheating or malfunctioning.
Having a low minimum operating temperature ensures the microprocessor can function in colder environments, providing versatility in application scenarios.
The use of tin, silver, and copper for terminal finish enhances connectivity, prevents corrosion, and ensures reliable electrical contacts for optimal performance.
Bottom terminal position simplifies the installation and connection of the microprocessor on the circuit board, facilitating assembly and reducing complexity.
Low seated height allows for slim and compact designs, enabling the microprocessor to be used in space-constrained applications without compromising performance.
Large RAM capacity enables the microprocessor to handle extensive data processing tasks and multitasking operations efficiently, enhancing overall performance.
Moderate width allows for easy integration of the microprocessor into various system designs and configurations, providing flexibility in application requirements.
Boundary scan feature simplifies testing and debugging of the microprocessor during manufacturing and maintenance, ensuring quality and reliability of the final product.
Wide external data bus width facilitates fast data transfer between the microprocessor and external devices, enhancing system efficiency and performance.
Optimal reflow temperature and time specifications ensure proper soldering and mounting of the microprocessor onto the circuit board, guaranteeing robust mechanical connections.
High peak reflow temperature enables reliable soldering and bonding of the microprocessor components, ensuring durability and long-term stability of the product.
Moderate length provides a balanced form factor for the microprocessor, allowing for efficient placement and integration within various device designs and layouts.
RISC architecture enables faster execution of instructions and efficient processing of data, making the microprocessor suitable for high-performance computing applications.
CMOS technology offers low power consumption, high speed, and compatibility with a wide range of devices, making the microprocessor energy-efficient and versatile in different applications.
Ball terminal form simplifies soldering and installation processes, ensuring secure connections and reliable electrical contacts for optimal performance of the microprocessor.
Stable nominal supply voltage ensures consistent and reliable operation of the microprocessor, reducing the risk of errors or malfunctions in the device.
Having multiple DMA channels allows for efficient data transfer and processing, enhancing system performance and responsiveness in handling data-intensive tasks.
Fine terminal pitch provides high-density connections and signal integrity, enabling reliable communication between the microprocessor and other components in the system.
Floating-point format supports complex mathematical computations and precision calculations, making the microprocessor suitable for scientific, engineering, and data-intensive applications.
MSL 4 rating indicates moderate sensitivity to moisture, requiring proper handling and storage to prevent damage and ensure the long-term reliability of the microprocessor.
High processing speed of 1250 revolutions per minute enables rapid execution of instructions and efficient data processing, enhancing overall performance and responsiveness.
Low power mode feature enables energy-saving operation and efficient power management, extending battery life and reducing overall power consumption in the device.
Microprocessors AM5K2E02ABD25 attributes and parameters. Explore more Microprocessors devices from Texas Instruments
Address Bus Width:
Boundary Scan:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of DMA Channels:
No. of Terminals:
On Chip Data RAM Width:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
RAM Words:
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
AM5K2E02ABD25 Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A991.B.4
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
CSNF651
Honeywell Sensing And Control
CSNF651 by Honeywell Sensing And Control is an industrial-grade analog circuit with 3 terminals. It operates b/w -40 to 85°C, supporting supply voltages from -15V to 15V. Ideal for applications requiring a special shape rectangular package style and through-hole terminal form.
BAV99
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Alpha & Omega Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Silicon Group
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N2222A
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
2N7002
Bytesonic Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Position: DUAL; Minimum Operating Temperature: -55 Cel;
LD1117S33CTR
STMicroelectronics
STMicroelectronics LD1117S33CTR is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 1.3A. It operates within an input voltage range of 4.75V to 15V, making it suitable for various applications requiring stable voltage regulation in compact designs. The device features low dropout voltage of 1.3V, high temperature operation up to 125°C, and small outline package style for space-constrained PCB layouts.
1N4148WT
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99LT1G
Onsemi
BAV99LT1G by Onsemi is a series connected diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.006 us and can handle up to 100V repetitive peak reverse voltage. Ideal for rectification applications, this diode operates b/w -65°C to 150°C temperature range.
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
C1210C104K5RACTU
KEMET Corporation
KEMET C1210C104K5RACTU is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics and ±10% tolerance, suitable for surface mount applications in a wide temperature range from -55°C to 125°C. Its compact rectangular package makes it ideal for various electronic devices.
Micro Commercial Components
Small Signal Bipolar Transistors; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-609 Code: e0;
LP2950CDT-3.3G
LP2950CDT-3.3G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 0.1A. It has a small outline package style, operates at temperatures ranging from -40 to 125 °C, and is suitable for applications requiring low dropout voltage and precise voltage regulation in electronic circuits.
PIC18F4550-I/P
Microchip Technology
PIC18F4550-I/P by Microchip Technology is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring low power consumption and high-speed data processing. With 2048 RAM bytes and 256 Data EEPROM size, this CMOS technology-based microcontroller offers versatile performance in various embedded systems.
1N4148
Taiwan Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Peak Reflow Temperature (C): 260; Maximum Operating Temperature: 175 Cel; JESD-609 Code: e3; No. of Elements: 1;
SPC TECHNOLOGY/ MULTICOMP
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V; Terminal Finish: Tin/Lead (Sn/Pb);
SZNUP2105LT1G
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
STM32F407VGT6
STM32F407VGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 196608 bytes RAM, and 16-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring CAN, ETHERNET, I2C(3), SPI(3), UART(2), USB(2) connectivity and features DMA(16) for efficient data transfer. With a max clock frequency of 50 MHz and operating temperature range of -40 to 85 °C, it offers high performance in a compact package style (14mm x 14mm).
MPC8245LVV266D
NXP Semiconductors
NXP Semiconductors' MPC8245LVV266D is a 32-bit microprocessor with integrated cache and low power mode. It operates at a max clock frequency of 66 MHz, suitable for applications requiring high-speed processing such as networking equipment and industrial automation systems. The processor features a CMOS technology, with a terminal pitch of 1.27 mm and a package style of grid array, making it ideal for compact designs.
AM6442BSDGGAALV
AM6442BSDGGAALV by Texas Instruments is a Microprocessor with 64-bit architecture, 16-bit data RAM width, and 25 MHz clock frequency. It is ideal for applications requiring high-speed processing and low power consumption, such as embedded systems, IoT devices, and industrial automation.
STM32MP135DAF7
STM32MP135DAF7 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 26-bit address bus width. It operates at a max clock frequency of 48 MHz, suitable for low power applications in various industries like IoT and embedded systems. With a package style of grid array and thin profile, it offers high performance in a compact form factor.
MCF54453VP266
MICROPROCESSOR; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;
MC7448VU800ND
MC7448VU800ND by NXP Semiconductors is a 32-bit microprocessor with max clock freq of 800 MHz. Operating at 0-105°C, it has low power mode and requires supply voltage of 0.95-1.3 V. Ideal for applications needing high-speed processing in compact spaces.
MC7455ARX733LG
Freescale Semiconductor
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 483; Package Code: BGA; Package Shape: SQUARE; Low Power Mode: YES;
XAM5728BABCXE
XAM5728BABCXE by Texas Instruments is a microprocessor with 32-bit external data bus width, 16-bit address bus width, and max clock frequency of 38.4 MHz. It is used in applications requiring low power mode, such as embedded systems and IoT devices.
MCF54454CVR200
The NXP Semiconductors MCF54454CVR200 microprocessor features a 32-bit address and external data bus width, with integrated cache and low power mode. It operates at a max clock frequency of 66 MHz, suitable for industrial applications requiring high-speed processing in compact form factors. The package style is grid array with terminal pitch of 1 mm, making it ideal for space-constrained designs needing efficient data handling capabilities.
MPC860DEVR80D4
NXP Semiconductors' MPC860DEVR80D4 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 50 MHz. It is designed for low power mode applications, utilizing a 3.3V nominal voltage and integrated cache for enhanced performance in embedded systems.
MPC8270CZUUPEA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B480;
AM3351BZCE30R
AM3351BZCE30R by Texas Instruments is a 32-bit microprocessor with integrated cache and a max clock frequency of 26 MHz. It is commonly used in applications requiring low power mode, such as embedded systems and IoT devices.
AM5708BCBDJEA
AM5708BCBDJEA by Texas Instruments is a Microprocessor with 32-bit External Data Bus, 16-bit Address Bus, and integrated cache. It operates at a max clock frequency of 38.4 MHz and supports low power mode. Ideal for industrial applications requiring high-speed processing in compact form factor.
MIMXRT1021DAF5B
The NXP Semiconductors MIMXRT1021DAF5B is a 32-bit microprocessor with integrated cache and a max clock frequency of 24 MHz. It is commonly used in applications requiring low power mode, such as IoT devices and wearable technology.
AM3357ZCZD72
AM3357ZCZD72 by Texas Instruments is a 32-bit microprocessor with integrated cache and 28-bit address bus width. It operates at a max clock frequency of 26 MHz, suitable for low power applications in grid array packages. With terminal pitch of 0.8 mm and bottom position, it offers high performance in compact designs.
KMPC8270CZUQLDA
KMPC8270CZUQLDA by Freescale Semiconductor is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 83.33 MHz. It features an external data bus width of 64 bits and is suitable for applications requiring high-speed processing in compact devices.
APX81131UG-7
Diodes Incorporated
APX81131UG-7 by Diodes Incorporated is a small outline microprocessor with 4 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 1.1V to 5.5V and uses CMOS technology for industrial applications requiring fixed-point processing in compact spaces.
AM5706BCBDJEAS
MICROPROCESSOR, RISC; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e1;
P2020NSE2MHC
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE;
MPC8321VRADDCA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Bit Size: 32;
STM32MP153CAB3
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
AM5K2E04XABD4
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1089; Package Code: FBGA; Package Shape: SQUARE;
AM5K2E02ABDA25
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1089; Package Code: FBGA; Package Shape: SQUARE;
AM5K2E02XABD
AM5K2E02DABDA25
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1089; Package Code: FBGA; Package Shape: SQUARE; Maximum Supply Voltage: .997 V;
AM5K2E02SABDA25
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1089; Package Code: FBGA; Package Shape: SQUARE; Technology: CMOS;
AM5K2E02DABD4
AM5K2E02XABD25
AM5K2E02ABDA4
AM5K2E02DABDA4
AM5K2E02SABD
AM5K2E02SABDA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1089; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;
AM5K2E02DABD25
AM5K2E02SABDA4
AM5K2E02ABDA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1089; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;
AM5K2E02SABD25
AM5K2E02DABDA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1089; Package Code: FBGA; Package Shape: SQUARE; Format: FLOATING POINT;
AM5K2E02ABD
AM5K2E02ABD4
AM5K2E02DABD
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