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AM5K2E02DABD4

Texas Instruments

AM5K2E02DABD4 by Texas Instruments

AM5K2E02DABD4 by Texas Instruments is a microprocessor with 64-bit external data bus width, integrated cache, and RISC technology. It operates b/w 0-85°C and has low power mode. Ideal for applications requiring high-speed processing in compact devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,172 parts In-Stock

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7,172

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Digiode

USA . 214 parts In-Stock

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214

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Distributors (Availability)

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One Stop Electronics

USA . 598 parts In-Stock

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$2.000

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598

$2.000

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AZTECH Wire

Italy . 242 parts In-Stock

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$10.197

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242

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Parana Technologies

USA . 1,920 parts In-Stock

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$40.450

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$40.450

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DigiPath Technology Company

USA . 2,363 parts In-Stock

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$44.540

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2,363

$44.540

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ChromeModa Solutions

Germany . 1,334 parts In-Stock

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$45.449

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$37.268

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1,334

$45.449

$37.268

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IDEA Electronic Components Group

UK . 638 parts In-Stock

1+ parts

$45.449

100+ parts

$43.177

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$40.904

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638

$45.449

$43.177

$40.904

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Corphita

USA . 4,456 parts In-Stock

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Northwest PG Solutions

USA . 831 parts In-Stock

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831

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Native Components

USA . 421 parts In-Stock

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421

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Overview

Experience unparalleled performance and reliability with the Texas Instruments AM5K2E02DABD4 microprocessor. As a leader in the industry, Texas Instruments ensures top-notch quality and cutting-edge technology in all their products. This microprocessor is versatile and can be used in a variety of applications, providing customers with endless possibilities. With integrated cache and low power mode, this product offers exceptional value and benefits, making it the perfect choice for your next project. Trust Texas Instruments to deliver excellence with the AM5K2E02DABD4 microprocessor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and heat resistance, making the microprocessor suitable for various applications.

Integrated Cache: YES

Integrated cache improves the overall performance of the microprocessor by reducing memory access times.

Surface Mount: YES

Surface mount compatibility allows for easier and more efficient installation on circuit boards.

Maximum Supply Voltage: 0.997 V

Low maximum supply voltage helps in reducing power consumption and heat dissipation.

Address Bus Width: 16

16-bit address bus width allows for efficient memory addressing and data transfer.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch packaging offers high density integration and reliable connections.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stability and performance in various environmental conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture in the microprocessor enhances processing speed and efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient.

Speed: 1400 rpm

High speed of 1400 rpm ensures quick and responsive performance in demanding applications.

Technical Specifications

Microprocessors AM5K2E02DABD4 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1089

Length:

27 mm

Low Power Mode:

YES

No. of Terminals:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

3.55 mm

Speed:

1400 rpm

Maximum Supply Voltage:

.997 V

Minimum Supply Voltage:

.902 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

AM5K2E02DABD4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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