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AM5K2E02XABD25

Texas Instruments

AM5K2E02XABD25 by Texas Instruments

The Texas Instruments AM5K2E02XABD25 microprocessor features integrated cache, 64-bit external data bus width, and 32 DMA channels. It is suitable for applications requiring high-speed processing and low power consumption in a compact square package with 1089 terminals.

Median Price

$116.295

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 120 parts In-Stock

1+ parts

$116.295

100+ parts

$112.798

1k+ parts

$87.440

10k+ parts

-

120

$116.295

$112.798

$87.440

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 925 parts In-Stock

1+ parts

$110.480

100+ parts

-

1k+ parts

-

10k+ parts

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925

$110.480

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-

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Vyrian

USA . 4,692 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,692

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 114 parts In-Stock

1+ parts

$16.210

100+ parts

-

1k+ parts

-

10k+ parts

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114

$16.210

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-

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Parana Technologies

USA . 1,565 parts In-Stock

1+ parts

$56.592

100+ parts

-

1k+ parts

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10k+ parts

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1,565

$56.592

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-

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ChromeModa Solutions

Germany . 5,119 parts In-Stock

1+ parts

$63.587

100+ parts

$52.141

1k+ parts

-

10k+ parts

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5,119

$63.587

$52.141

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IDEA Electronic Components Group

UK . 1,786 parts In-Stock

1+ parts

$63.587

100+ parts

$60.408

1k+ parts

$57.228

10k+ parts

-

1,786

$63.587

$60.408

$57.228

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Corphita

USA . 1,449 parts In-Stock

1+ parts

$104.666

100+ parts

-

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-

10k+ parts

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1,449

$104.666

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Microchip USA

USA . 1,896 parts In-Stock

1+ parts

$127.970

100+ parts

$124.550

1k+ parts

$122.850

10k+ parts

$121.140

1,896

$127.970

$124.550

$122.850

$121.140

QUARKTWIN TECHNOLOGY LTD

USA . 11,233 parts In-Stock

1+ parts

-

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11,233

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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DigiPath Technology Company

USA . 1,949 parts In-Stock

1+ parts

-

100+ parts

$57.330

1k+ parts

-

10k+ parts

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1,949

-

$57.330

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Native Components

USA . 613 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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613

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Northwest PG Solutions

USA . 337 parts In-Stock

1+ parts

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337

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Overview

Unlock the power of cutting-edge technology with the AM5K2E02XABD25 by Texas Instruments. This high-quality microprocessor offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. Whether you're designing advanced electronics or pushing the boundaries of innovation, this product delivers the value, benefits, and advantages you need to succeed. Trust in Texas Instruments to provide top-of-the-line solutions that meet and exceed your expectations. Elevate your projects with the AM5K2E02XABD25 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, ensuring a longer lifespan for the product.

Integrated Cache: YES

Having integrated cache improves the performance and efficiency of the microprocessor by reducing the need to access external memory.

Maximum Supply Voltage: 1.05 V

Operating at a low maximum supply voltage helps in saving power and reducing heat generation, making the product more energy efficient.

Address Bus Width: 16

A wider address bus width allows for faster data processing and more memory addressing capabilities within the microprocessor.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor, it is optimized for efficiency and high-speed processing, making it a suitable choice for advanced computing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the overall energy efficiency and reliability of the microprocessor.

Technical Specifications

Microprocessors AM5K2E02XABD25 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1089

JESD-609 Code:

e1

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

32

No. of Terminals:

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

RAM Words:

2097152

Maximum Seated Height:

3.55 mm

Speed:

1250 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Peripheral IC Type:

Trade Compliance

AM5K2E02XABD25 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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