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AM5K2E02XABD

Texas Instruments

AM5K2E02XABD by Texas Instruments

AM5K2E02XABD by Texas Instruments is a microprocessor with 64-bit external data bus width, 16-bit address bus width, and integrated cache. It is designed for applications requiring high processing speed and low power consumption, such as embedded systems in automotive or industrial settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,151 parts In-Stock

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Digiode

USA . 1,841 parts In-Stock

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1,841

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Distributors (Availability)

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AZTECH Wire

Italy . 701 parts In-Stock

1+ parts

$9.774

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701

$9.774

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One Stop Electronics

USA . 370 parts In-Stock

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$22.000

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370

$22.000

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Native Components

USA . 638 parts In-Stock

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$43.780

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$42.029

638

$43.780

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$42.029

Northwest PG Solutions

USA . 851 parts In-Stock

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$48.158

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851

$48.158

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Parana Technologies

USA . 972 parts In-Stock

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$73.055

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972

$73.055

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DigiPath Technology Company

USA . 695 parts In-Stock

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$80.442

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$74.007

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695

$80.442

$74.007

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ChromeModa Solutions

Germany . 3,403 parts In-Stock

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$82.084

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$67.309

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3,403

$82.084

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IDEA Electronic Components Group

UK . 253 parts In-Stock

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$82.084

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$77.980

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$73.876

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253

$82.084

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$73.876

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Corphita

USA . 4,738 parts In-Stock

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Overview

Elevate your projects with the AM5K2E02XABD by Texas Instruments, a top-tier microprocessor that embodies innovation and reliability. Crafted with precision and expertise, this powerhouse of a chip boasts integrated cache and a wide address bus width, making it ideal for a myriad of applications. From enhancing computational efficiency to optimizing system performance, this microprocessor is designed to exceed expectations. Experience seamless functionality and unparalleled value with the AM5K2E02XABD - the ultimate choice for cutting-edge technology solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Integrated Cache: YES

Having integrated cache improves the processing speed and efficiency of the microprocessor.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 0.997 V

Operating at a low maximum supply voltage helps in reducing power consumption and heat generation.

Address Bus Width: 16

With a wider address bus, the microprocessor can handle larger amounts of data efficiently.

No. of Terminals: 1089

Having a large number of terminals allows for more connectivity options and functionality.

Package Shape: SQUARE

The square package shape helps in efficient PCB layout and space utilization.

Minimum Supply Voltage: 0.902 V

Operating at a low minimum supply voltage ensures stability and energy efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microprocessor can perform reliably even in demanding conditions.

Minimum Operating Temperature: 0 °C

A low minimum operating temperature ensures that the product can function in a wide range of environments.

Terminal Position: BOTTOM

Bottom terminal position makes it easier to mount and connect the microprocessor on the PCB.

Maximum Seated Height: 3.55 mm

The low seated height allows for compact design and integration into smaller devices.

Width: 27 mm

The compact width makes the microprocessor suitable for smaller form factor devices.

Boundary Scan: YES

Boundary scan capability helps in testing and diagnosing potential issues in the microprocessor.

External Data Bus Width: 64

Having a wider external data bus allows for faster data transfer and processing speed.

Length: 27 mm

The compact length of the microprocessor contributes to its suitability for small devices.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computer) microprocessor allows for efficient and fast execution of instructions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy efficient and reliable.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections for the microprocessor.

Nominal Supply Voltage: 0.95 V

Operating at a nominal supply voltage ensures stability and efficient power usage.

Terminal Pitch: 0.8 mm

Having a small terminal pitch allows for high-density mounting on the PCB.

Format: FLOATING POINT

Using floating-point format enables the microprocessor to perform complex mathematical calculations accurately and efficiently.

Speed: 1000 rpm

With a high speed of 1000 rpm, the microprocessor can handle demanding computational tasks quickly.

Low Power Mode: YES

Having a low power mode option helps in further reducing power consumption and extending battery life in portable devices.

Technical Specifications

Microprocessors AM5K2E02XABD attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1089

Length:

27 mm

Low Power Mode:

YES

No. of Terminals:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

3.55 mm

Speed:

1000 rpm

Maximum Supply Voltage:

.997 V

Minimum Supply Voltage:

.902 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

AM5K2E02XABD Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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