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AM5K2E02SABDA

Texas Instruments

AM5K2E02SABDA by Texas Instruments

AM5K2E02SABDA by Texas Instruments is a Microprocessor with 64-bit External Data Bus, 16-bit Address Bus, and integrated cache. It features CMOS technology, operates at 1000 rpm speed, and supports low power mode. Ideal for applications requiring high processing power in compact devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,695 parts In-Stock

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4,695

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Vyrian

USA . 3,811 parts In-Stock

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3,811

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AZTECH Wire

Italy . 745 parts In-Stock

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$12.608

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745

$12.608

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Parana Technologies

USA . 1,559 parts In-Stock

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$23.126

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$23.762

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DigiPath Technology Company

USA . 1,955 parts In-Stock

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$25.464

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$23.427

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$25.464

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ChromeModa Solutions

Germany . 2,315 parts In-Stock

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$25.984

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$21.307

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2,315

$25.984

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IDEA Electronic Components Group

UK . 1,544 parts In-Stock

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$25.984

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$24.685

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$23.386

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1,544

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$24.685

$23.386

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One Stop Electronics

USA . 1,178 parts In-Stock

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$32.000

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Northwest PG Solutions

USA . 1,122 parts In-Stock

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Corphita

USA . 890 parts In-Stock

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890

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Native Components

USA . 591 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the AM5K2E02SABDA by Texas Instruments. This high-quality microprocessor offers integrated cache and boundary scan capabilities, making it perfect for a wide range of applications. With a low power mode and impressive speed, this product provides unparalleled performance and efficiency. Trust in Texas Instruments' expertise and innovation to deliver top-of-the-line solutions that exceed expectations. Elevate your projects to new heights with the AM5K2E02SABDA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Integrated Cache: YES

Having integrated cache improves the efficiency and speed of data retrieval, enhancing overall performance.

Surface Mount: YES

Surface mount capability allows for easy installation and compact design, suitable for space-constrained applications.

Maximum Supply Voltage: 0.997 V

With a relatively low maximum supply voltage, the product operates efficiently while consuming less power.

Address Bus Width: 16

The 16-bit address bus width enables efficient memory addressing and data transfer.

No. of Terminals: 1089

Having a high number of terminals allows for versatile connectivity options and integration with other components.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enhances the product's reliability and performance in high-density layouts.

Minimum Supply Voltage: 0.902 V

The low minimum supply voltage ensures energy-efficient operation and prolongs battery life in mobile devices.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB assembly and maintenance.

Maximum Seated Height: 3.55 mm

The compact maximum seated height allows for slim device designs and efficient heat dissipation.

Width: 27 mm

The compact width of the product enables space-efficient PCB layouts and system integration.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes, enhancing product reliability and manufacturability.

External Data Bus Width: 64

The wide 64-bit external data bus width enables high-speed data transfer and computational efficiency.

Length: 27 mm

The length of 27 mm contributes to a compact form factor and efficient utilization of board space.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor offers optimized performance, reduced power consumption, and enhanced multitasking capabilities.

Technology: CMOS

The CMOS technology provides low power consumption, high-speed operation, and reliable performance for various applications.

Terminal Form: BALL

The ball terminal form ensures secure connections and efficient heat dissipation, suitable for demanding operating conditions.

Nominal Supply Voltage: 0.95 V

The nominal supply voltage of 0.95 V balances performance and power efficiency, making it an optimal choice for energy-conscious designs.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8 mm allows for high-density mounting, enabling compact PCB designs and efficient signal routing.

Format: FLOATING POINT

Supporting floating-point operations enhances numerical accuracy and computational capabilities, crucial for complex calculations in scientific and engineering applications.

Speed: 1000 rpm

The operational speed of 1000 rpm ensures responsive performance and efficient task execution, meeting the demands of modern computing tasks.

Low Power Mode: YES

The low power mode feature reduces energy consumption during idle or low-demand periods, extending battery life and promoting sustainability.

Technical Specifications

Microprocessors AM5K2E02SABDA attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1089

Length:

27 mm

Low Power Mode:

YES

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

3.55 mm

Speed:

1000 rpm

Maximum Supply Voltage:

.997 V

Minimum Supply Voltage:

.902 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

AM5K2E02SABDA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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