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AM5K2E02DABDA25

Texas Instruments

AM5K2E02DABDA25 by Texas Instruments

AM5K2E02DABDA25 by Texas Instruments is a Microprocessor with 64-bit External Data Bus, 16-bit Address Bus, and Integrated Cache. It features a CMOS Technology, operates at 1250 rpm speed, and supports Boundary Scan. This processor is ideal for applications requiring low power consumption and high processing capabilities in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,550 parts In-Stock

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6,550

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Digiode

USA . 2,055 parts In-Stock

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2,055

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 865 parts In-Stock

1+ parts

$0.424

100+ parts

-

1k+ parts

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10k+ parts

$0.407

865

$0.424

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$0.407

Northwest PG Solutions

USA . 2,257 parts In-Stock

1+ parts

$0.466

100+ parts

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$0.411

2,257

$0.466

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$0.411

One Stop Electronics

USA . 742 parts In-Stock

1+ parts

$14.000

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742

$14.000

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AZTECH Wire

Italy . 398 parts In-Stock

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$17.102

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398

$17.102

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Parana Technologies

USA . 1,259 parts In-Stock

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$57.829

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1,259

$57.829

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DigiPath Technology Company

USA . 686 parts In-Stock

1+ parts

$63.676

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686

$63.676

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ChromeModa Solutions

Germany . 947 parts In-Stock

1+ parts

$64.976

100+ parts

$53.280

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947

$64.976

$53.280

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IDEA Electronic Components Group

UK . 211 parts In-Stock

1+ parts

$64.976

100+ parts

$61.727

1k+ parts

$58.478

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211

$64.976

$61.727

$58.478

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Corphita

USA . 800 parts In-Stock

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800

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Overview

Experience cutting-edge technology with the AM5K2E02DABDA25 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microprocessors that guarantee high performance and reliability. Whether you're working on industrial applications, automotive systems, or smart home devices, this microprocessor offers seamless integration and maximum efficiency. Unlock endless possibilities and elevate your projects with the AM5K2E02DABDA25 - the ultimate solution for all your processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Integrated Cache: YES

Having integrated cache enhances the processing speed and efficiency of the microprocessor.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 0.997 V

The maximum supply voltage of 0.997 V ensures efficient power consumption and low heat generation.

Address Bus Width: 16

With a wide address bus width of 16, the microprocessor can handle large amounts of data efficiently.

Package Shape: SQUARE

The square package shape makes the microprocessor easy to handle and integrate into various systems.

No. of Terminals: 1089

Having a high number of terminals allows for increased connectivity and functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array fine pitch package style provides high density packaging and efficient signal routing.

Minimum Supply Voltage: 0.902 V

The low minimum supply voltage of 0.902 V helps in reducing power consumption and operating costs.

Terminal Position: BOTTOM

Bottom terminal position simplifies the installation process and improves heat dissipation.

Maximum Seated Height: 3.55 mm

The maximum seated height of 3.55 mm allows for compact design and space-saving installation.

Width: 27 mm

The 27 mm width ensures compatibility with standard board sizes and easy integration.

Boundary Scan: YES

Having boundary scan capability enables efficient testing and debugging during production and operation.

External Data Bus Width: 64

The wide external data bus width of 64 enables high-speed data transfer and processing.

Length: 27 mm

The 27 mm length contributes to the overall compactness and space efficiency of the microprocessor.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor allows for faster and more efficient processing of instructions and tasks.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable performance for the microprocessor.

Terminal Form: BALL

The ball terminal form provides reliable connections and ease of soldering during assembly.

Nominal Supply Voltage: 0.95 V

The nominal supply voltage of 0.95 V ensures stable and efficient operation of the microprocessor.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8 mm allows for closely spaced connections and compact design layouts.

Format: FLOATING POINT

The floating point format enables precise and fast computation of complex mathematical operations.

Speed: 1250 rpm

With a speed of 1250 rpm, the microprocessor can deliver high performance for various applications.

Low Power Mode: YES

The low power mode feature helps in reducing energy consumption and prolonging battery life in portable devices.

Technical Specifications

Microprocessors AM5K2E02DABDA25 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1089

Length:

27 mm

Low Power Mode:

YES

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

3.55 mm

Speed:

1250 rpm

Maximum Supply Voltage:

.997 V

Minimum Supply Voltage:

.902 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

AM5K2E02DABDA25 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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