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AM5K2E02DABD25

Texas Instruments

AM5K2E02DABD25 by Texas Instruments

AM5K2E02DABD25 by Texas Instruments is a microprocessor with 64-bit external data bus width, integrated cache, and RISC technology. It operates b/w 0-85°C and has low power mode for energy efficiency. Ideal for applications requiring high-speed processing in compact devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,749 parts In-Stock

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Vyrian

USA . 2,778 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 496 parts In-Stock

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$5.979

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One Stop Electronics

USA . 1,496 parts In-Stock

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$19.000

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Parana Technologies

USA . 727 parts In-Stock

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$63.129

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DigiPath Technology Company

USA . 1,231 parts In-Stock

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$69.512

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$63.951

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ChromeModa Solutions

Germany . 242 parts In-Stock

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$70.931

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$58.163

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242

$70.931

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IDEA Electronic Components Group

UK . 197 parts In-Stock

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$70.931

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$67.384

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$63.838

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197

$70.931

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$63.838

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Northwest PG Solutions

USA . 1,989 parts In-Stock

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Corphita

USA . 1,336 parts In-Stock

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Native Components

USA . 374 parts In-Stock

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Overview

Experience the next level of performance with the AM5K2E02DABD25 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microprocessors that are perfect for a wide range of applications. Whether you're looking to enhance your computing power or improve your system's efficiency, this product has got you covered. With integrated cache, low power mode, and boundary scan technology, the AM5K2E02DABD25 offers unparalleled value and benefits to customers. Upgrade your technology today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microprocessor, ensuring reliability in various operating conditions.

Integrated Cache: YES

Having an integrated cache helps in faster access to frequently used data, improving overall performance and efficiency.

Surface Mount: YES

Surface mount technology allows for easier and more efficient installation on circuit boards, saving time and effort during production.

Maximum Supply Voltage: 0.997 V

Operating within a specified voltage range ensures stability and prevents damage to the microprocessor over time.

Address Bus Width: 16

A wider address bus allows for larger memory addressing capability, enabling support for more complex computational tasks.

No. of Terminals: 1089

Having a high number of terminals provides connectivity options for various interfaces and peripherals, enhancing versatility.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array design with fine pitch terminals allows for higher density packing of components, saving space and enabling efficient PCB layout.

Minimum Supply Voltage: 0.902 V

Operating within a specified voltage range ensures stability and prevents damage to the microprocessor over time.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microprocessor can perform reliably in challenging thermal conditions without overheating.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures functionality in cold environments, making this microprocessor suitable for a wide range of applications.

Terminal Position: BOTTOM

Bottom terminal positioning allows for easier soldering and better thermal management, contributing to overall system reliability.

Maximum Seated Height: 3.55 mm

The compact height of the microprocessor makes it suitable for slim and space-constrained devices, enabling sleek product designs.

Width: 27 mm

A moderate width allows for compatibility with standard mounting solutions, facilitating easy integration into various electronic systems.

Boundary Scan: YES

Boundary scan testing capabilities help in diagnosing and debugging potential issues with the microprocessor, ensuring high quality and reliability.

External Data Bus Width: 64

A wider external data bus allows for faster data transfer between the microprocessor and other components, improving overall system performance.

Length: 27 mm

A moderate length allows for compatibility with standard mounting solutions, facilitating easy integration into various electronic systems.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor allows for efficient execution of instructions, leading to high performance and low power consumption.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable in noisy environments.

Terminal Form: BALL

Ball terminal form provides reliable connections and allows for easy installation, ensuring secure electrical contacts for optimal performance.

Nominal Supply Voltage: 0.95 V

Having a stable nominal supply voltage ensures consistent performance and reliability of the microprocessor in various operating conditions.

Terminal Pitch: 0.8 mm

A fine terminal pitch allows for high-density mounting of components, promoting miniaturization and space-saving in electronic designs.

Format: FLOATING POINT

Supporting floating-point operations enables the microprocessor to handle complex mathematical calculations with high precision, expanding its computational capabilities.

Speed: 1250 rpm

Operating at a high speed of 1250 rpm allows for quick data processing and efficient execution of tasks, making this microprocessor suitable for demanding applications.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption when the microprocessor is idle or under low load, promoting energy efficiency and extending battery life.

Technical Specifications

Microprocessors AM5K2E02DABD25 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1089

Length:

27 mm

Low Power Mode:

YES

No. of Terminals:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

3.55 mm

Speed:

1250 rpm

Maximum Supply Voltage:

.997 V

Minimum Supply Voltage:

.902 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

AM5K2E02DABD25 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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