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AM5K2E02SABD25

Texas Instruments

AM5K2E02SABD25 by Texas Instruments

AM5K2E02SABD25 by Texas Instruments is a microprocessor with 64-bit external data bus width, integrated cache, and RISC technology. It operates b/w 0-85°C and has low power mode for energy efficiency. Ideal for applications requiring high-speed processing in compact devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,669 parts In-Stock

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Digiode

USA . 1,679 parts In-Stock

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1,679

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Distributors (Availability)

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Native Components

USA . 333 parts In-Stock

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$0.447

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$0.429

333

$0.447

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$0.429

Northwest PG Solutions

USA . 976 parts In-Stock

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$0.491

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$0.433

976

$0.491

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$0.433

AZTECH Wire

Italy . 611 parts In-Stock

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$7.415

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611

$7.415

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One Stop Electronics

USA . 898 parts In-Stock

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$23.000

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898

$23.000

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Parana Technologies

USA . 1,490 parts In-Stock

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$63.323

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1,490

$63.323

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DigiPath Technology Company

USA . 376 parts In-Stock

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$69.726

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376

$69.726

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ChromeModa Solutions

Germany . 6,543 parts In-Stock

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$71.149

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$58.342

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IDEA Electronic Components Group

UK . 1,972 parts In-Stock

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$71.149

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$67.592

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$64.034

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1,972

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$64.034

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Corphita

USA . 3,581 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the AM5K2E02SABD25 microprocessor. Designed for various applications, this innovative product offers integrated cache, low power mode, and a wide external data bus width to enhance performance. With advanced technology and precision engineering, Texas Instruments delivers a top-notch microprocessor that provides exceptional value, efficiency, and versatility for all your computing needs. Trust in Texas Instruments to power your projects with the best in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it ideal for portable devices.

Integrated Cache: YES

Having an integrated cache helps improve the overall performance and speed of the microprocessor by reducing the need to access external memory frequently.

Surface Mount: YES

Being surface mountable makes the installation of the microprocessor easy and efficient, especially in compact electronic devices.

Maximum Supply Voltage: 0.997 V

The low maximum supply voltage helps in reducing power consumption and heat generation, resulting in energy-efficient operation.

Address Bus Width: 16

A wider address bus width allows the microprocessor to access and process larger amounts of memory, enhancing its capabilities.

Package Shape: SQUARE

The square package shape provides a good balance between compact design and efficient use of space in electronic equipment.

No. of Terminals: 1089

Having a high number of terminals allows for more connections and functionality within the microprocessor, making it versatile for various applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array fine pitch package style ensures precise and reliable connections, improving the overall performance and durability of the microprocessor.

Minimum Supply Voltage: 0.902 V

The low minimum supply voltage allows the microprocessor to operate efficiently even under low power conditions, extending its battery life.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microprocessor can withstand heat and perform reliably in various environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures the microprocessor's functionality in cold environments without any performance issues.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure connections, enhancing the overall reliability and stability of the microprocessor.

Maximum Seated Height: 3.55 mm

The compact maximum seated height allows for slim and sleek device designs, ideal for space-constrained applications.

Width: 27 mm

The moderate width of the microprocessor enables it to fit comfortably within different electronic devices, ensuring compatibility and flexibility.

Boundary Scan: YES

The presence of boundary scan capability allows for efficient testing and debugging of the microprocessor, ensuring quality and reliability.

External Data Bus Width: 64

A wider external data bus width enables faster data transfer and processing speeds, enhancing the overall performance of the microprocessor.

Length: 27 mm

The moderate length of the microprocessor contributes to its compact design, making it suitable for integration into small electronic devices.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor type ensures efficient and streamlined processing of instructions, improving overall performance and speed.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable for various applications.

Terminal Form: BALL

The ball terminal form provides secure and stable connections, ensuring the reliability and durability of the microprocessor.

Nominal Supply Voltage: 0.95 V

The nominal supply voltage of 0.95 V strikes a balance between power efficiency and performance, making the microprocessor versatile for different applications.

Terminal Pitch: 0.8 mm

With a narrow terminal pitch, the microprocessor allows for compact and efficient layout designs, ideal for space-constrained electronic devices.

Format: FLOATING POINT

The floating-point format enhances the microprocessor's ability to perform complex mathematical calculations with high precision and accuracy.

Speed: 1250 rpm

The high speed of 1250 rpm enables fast data processing and responsiveness, making the microprocessor suitable for demanding applications.

Low Power Mode: YES

Having a low power mode option allows the microprocessor to conserve energy when not operating at full capacity, improving efficiency and battery life.

Technical Specifications

Microprocessors AM5K2E02SABD25 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1089

Length:

27 mm

Low Power Mode:

YES

No. of Terminals:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

3.55 mm

Speed:

1250 rpm

Maximum Supply Voltage:

.997 V

Minimum Supply Voltage:

.902 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

AM5K2E02SABD25 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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