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AM5K2E02SABDA25

Texas Instruments

AM5K2E02SABDA25 by Texas Instruments

AM5K2E02SABDA25 by Texas Instruments is a microprocessor with 64-bit external data bus width, 16-bit address bus width, and integrated cache. It is ideal for applications requiring high-speed processing in a compact form factor, featuring low power mode and boundary scan capabilities. The package style is grid array with fine pitch terminals, making it suitable for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,642 parts In-Stock

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Digiode

USA . 3,529 parts In-Stock

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3,529

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Distributors (Availability)

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Native Components

USA . 386 parts In-Stock

1+ parts

$0.734

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386

$0.734

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Northwest PG Solutions

USA . 1,591 parts In-Stock

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$0.808

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One Stop Electronics

USA . 161 parts In-Stock

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$1.000

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161

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AZTECH Wire

Italy . 387 parts In-Stock

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$7.892

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387

$7.892

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Parana Technologies

USA . 1,084 parts In-Stock

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$43.679

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1,084

$43.679

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ChromeModa Solutions

Germany . 5,466 parts In-Stock

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$49.077

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$40.243

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5,466

$49.077

$40.243

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IDEA Electronic Components Group

UK . 1,750 parts In-Stock

1+ parts

$49.077

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$46.623

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$44.169

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$49.077

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Corphita

USA . 3,403 parts In-Stock

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DigiPath Technology Company

USA . 533 parts In-Stock

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$44.248

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Overview

Experience top-notch performance and reliability with the AM5K2E02SABDA25 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional quality microprocessors that are perfect for a wide range of applications. From consumer electronics to industrial automation, this microprocessor offers unparalleled value, benefits, and advantages to customers. Stay ahead of the curve with advanced technology and innovative solutions provided by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, contributing to overall product reliability.

Integrated Cache: YES

Having integrated cache improves performance by reducing the time needed to access frequently used data.

Maximum Supply Voltage: 0.997 V

The maximum supply voltage of 0.997 V ensures stable operation without exceeding safe limits.

Address Bus Width: 16

A wider address bus width of 16 allows for efficient memory addressing and data transfer capabilities.

Package Shape: SQUARE

The square package shape helps in efficient layout design and space utilization on PCBs.

No. of Terminals: 1089

With a high number of terminals, the processor can connect to various external components, expanding its functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array fine pitch package style allows for high-density mounting, saving space and improving signal integrity.

Minimum Supply Voltage: 0.902 V

The minimum supply voltage of 0.902 V ensures efficient power consumption and extends the product's battery life.

Maximum Seated Height: 3.55 mm

The maximum seated height of 3.55 mm enables the processor to be used in slim devices without compromising performance.

Width: 27 mm

The 27 mm width provides a compact form factor, making it suitable for small-scale applications where space is limited.

Boundary Scan: YES

Having boundary scan capability allows for efficient testing and debugging during manufacturing and maintenance processes.

External Data Bus Width: 64

A wider external data bus width of 64 enables faster data transfer rates and improved overall performance.

Length: 27 mm

With a length of 27 mm, the processor maintains a square form factor, aiding in PCB layout and component placement.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor offers enhanced performance, power efficiency, and scalability for various applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high speed, and reliable operation, making it suitable for battery-powered devices.

Terminal Form: BALL

Having ball terminals simplifies the soldering process during assembly, ensuring secure and reliable connections.

Nominal Supply Voltage: 0.95 V

The nominal supply voltage of 0.95 V strikes a balance between performance and power efficiency, ideal for a wide range of applications.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm enables high-density mounting, reducing PCB footprint and improving signal integrity.

Format: FLOATING POINT

Operating in floating-point format allows for precise numerical calculations, essential for computational-intensive tasks.

Speed: 1250 rpm

With a speed of 1250 rpm, the processor delivers fast processing capabilities, suitable for demanding applications.

Low Power Mode: YES

The low power mode option enhances energy efficiency, reducing power consumption and heat generation during idle or low-load scenarios.

Technical Specifications

Microprocessors AM5K2E02SABDA25 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1089

Length:

27 mm

Low Power Mode:

YES

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

3.55 mm

Speed:

1250 rpm

Maximum Supply Voltage:

.997 V

Minimum Supply Voltage:

.902 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

AM5K2E02SABDA25 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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