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AM5K2E02SABDA4

Texas Instruments

AM5K2E02SABDA4 by Texas Instruments

AM5K2E02SABDA4 by Texas Instruments is a microprocessor with 64-bit external data bus width, 16-bit address bus width, and integrated cache. It is designed for low power mode operation and features boundary scan capability. This processor is suitable for applications requiring high-speed processing in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,784 parts In-Stock

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2,784

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Digiode

USA . 1,079 parts In-Stock

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1,079

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Distributors (Availability)

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AZTECH Wire

Italy . 867 parts In-Stock

1+ parts

$14.577

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867

$14.577

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Parana Technologies

USA . 2,352 parts In-Stock

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$16.386

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$16.680

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2,352

$16.386

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$16.680

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DigiPath Technology Company

USA . 1,959 parts In-Stock

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$18.043

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1,959

$18.043

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ChromeModa Solutions

Germany . 2,415 parts In-Stock

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$18.411

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$15.097

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2,415

$18.411

$15.097

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IDEA Electronic Components Group

UK . 1,157 parts In-Stock

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$18.411

100+ parts

$17.490

1k+ parts

$16.570

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1,157

$18.411

$17.490

$16.570

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One Stop Electronics

USA . 1,173 parts In-Stock

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$32.000

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1,173

$32.000

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Native Components

USA . 868 parts In-Stock

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$41.730

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$40.061

868

$41.730

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$40.061

Northwest PG Solutions

USA . 1,773 parts In-Stock

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$45.903

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Corphita

USA . 1,887 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the AM5K2E02SABDA4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microprocessors that are perfect for a wide range of applications. With integrated cache and low power mode, this microprocessor offers unmatched performance and efficiency. Whether you're looking to boost the speed of your device or enhance its capabilities, the AM5K2E02SABDA4 is the perfect choice. Upgrade your technology today and experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor easy to handle and less prone to damage during installation.

Integrated Cache: YES

Having integrated cache improves the speed and efficiency of data access, resulting in better overall performance of the microprocessor.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the microprocessor on circuit boards, saving space and improving production efficiency.

Maximum Supply Voltage: 0.997 V

Operating at a relatively low maximum supply voltage helps in reducing power consumption and heat generation, making the microprocessor energy efficient.

Address Bus Width: 16

A wider address bus allows the microprocessor to handle larger amounts of memory and data, improving its capabilities for complex computing tasks.

No. of Terminals: 1089

Having a high number of terminals provides more connectivity options and flexibility in designing and integrating the microprocessor into various systems.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array style with fine pitch terminals enables high density packaging, reducing overall size while maintaining high performance and reliability.

Minimum Supply Voltage: 0.902 V

The low minimum supply voltage allows for efficient power management and operation at lower power levels, contributing to energy savings.

Terminal Position: BOTTOM

Bottom terminal position makes it easier to mount and connect the microprocessor on circuit boards, enhancing the overall assembly process.

Maximum Seated Height: 3.55 mm

The relatively low maximum seated height allows for compact design and integration of the microprocessor in space-constrained applications.

Width: 27 mm

A compact width dimension offers versatility in installation and compatibility with various system designs, making it easier to incorporate the microprocessor.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging of the microprocessor during production and maintenance, ensuring reliable performance.

External Data Bus Width: 64

With a wider external data bus, the microprocessor can efficiently transfer larger chunks of data between components, enhancing overall system speed and performance.

Length: 27 mm

A balanced length dimension allows for a compact form factor and efficient use of space, making the microprocessor suitable for diverse system configurations.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture of the microprocessor enables faster and more efficient processing of instructions, enhancing overall system performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor suitable for energy-efficient and reliable applications.

Terminal Form: BALL

Ball terminal form provides robust electrical connections and ease of soldering during installation, ensuring reliable and stable operation of the microprocessor.

Nominal Supply Voltage: 0.95 V

Operating at a nominal supply voltage of 0.95 V strikes a balance between power efficiency and performance, making the microprocessor versatile for various applications.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for high density packaging and efficient connectivity, enabling compact design and reliable performance of the microprocessor.

Format: FLOATING POINT

Supporting floating-point calculations enhances the microprocessor's ability to handle complex mathematical computations with high precision and accuracy.

Speed: 1400 rpm

Operating at a speed of 1400 rpm ensures fast and efficient processing of instructions, enabling quick response times and smooth performance of the microprocessor.

Low Power Mode: YES

The presence of a low power mode option allows for energy-saving operation when required, extending the battery life and overall efficiency of the microprocessor.

Technical Specifications

Microprocessors AM5K2E02SABDA4 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1089

Length:

27 mm

Low Power Mode:

YES

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

3.55 mm

Speed:

1400 rpm

Maximum Supply Voltage:

.997 V

Minimum Supply Voltage:

.902 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

AM5K2E02SABDA4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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