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AM1808EZCED4

Texas Instruments

AM1808EZCED4 by Texas Instruments

AM1808EZCED4 by Texas Instruments is a 32-bit microprocessor with integrated cache, operating at max 30 MHz. Ideal for industrial applications, it features a 23-bit address bus width and low power mode for efficient performance in various systems. With a package style of grid array and terminal finish of tin silver copper, this processor offers reliable functionality in demanding environments.

Median Price

$16.500

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,400 parts In-Stock

1+ parts

$16.500

100+ parts

$14.413

1k+ parts

$9.940

10k+ parts

-

1,400

$16.500

$14.413

$9.940

-

Mouser Electronics

USA . 64 parts In-Stock

1+ parts

$26.270

100+ parts

$16.300

1k+ parts

$15.930

10k+ parts

-

64

$26.270

$16.300

$15.930

-

Avnet

USA . 1,103 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$12.582

10k+ parts

$12.272

1,103

-

-

$12.582

$12.272

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,276 parts In-Stock

1+ parts

$15.675

100+ parts

-

1k+ parts

-

10k+ parts

-

3,276

$15.675

-

-

-

Vyrian

USA . 5,661 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,661

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 548 parts In-Stock

1+ parts

$14.850

100+ parts

-

1k+ parts

-

10k+ parts

-

548

$14.850

-

-

-

Parana Technologies

USA . 415 parts In-Stock

1+ parts

$71.576

100+ parts

-

1k+ parts

-

10k+ parts

-

415

$71.576

-

-

-

DigiPath Technology Company

USA . 1,735 parts In-Stock

1+ parts

$78.815

100+ parts

$72.509

1k+ parts

-

10k+ parts

-

1,735

$78.815

$72.509

-

-

ChromeModa Solutions

Germany . 3,457 parts In-Stock

1+ parts

$80.423

100+ parts

$65.947

1k+ parts

-

10k+ parts

-

3,457

$80.423

$65.947

-

-

IDEA Electronic Components Group

UK . 339 parts In-Stock

1+ parts

$80.423

100+ parts

$76.402

1k+ parts

$72.381

10k+ parts

-

339

$80.423

$76.402

$72.381

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Native Components

USA . 533 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.450

10k+ parts

-

533

-

-

$3.450

-

Northwest PG Solutions

USA . 67 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.486

10k+ parts

-

67

-

-

$3.486

-

Overview

Experience unmatched performance and reliability with the AM1808EZCED4 by Texas Instruments, a leading manufacturer in the industry. This cutting-edge microprocessor is perfect for a wide range of applications, offering seamless integration and enhanced functionality. With its advanced features and high-quality design, this product provides exceptional value and benefits to customers looking for top-notch performance in their electronic devices. Trust Texas Instruments to deliver superior technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Having integrated cache allows for faster data access and processing, improving overall performance.

Maximum Supply Voltage: 1.35 V

Allows for efficient power usage and optimal performance without risking damage from excessive voltage.

Surface Mount: YES

Enables easy installation and integration into circuit boards, saving time and effort during assembly.

Address Bus Width: 23

With a wider address bus width, the microprocessor can access larger amounts of memory, increasing its capabilities.

Package Shape: SQUARE

A square package shape allows for efficient use of space and easier mounting onto circuit boards.

Bit Size: 32

A 32-bit architecture provides superior processing power and efficiency compared to lower-bit processors.

No. of Terminals: 361

Having a high number of terminals allows for a greater level of connectivity and versatility in the microprocessor's usage.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style provides a secure and stable mounting option while maintaining a compact size for space-constrained applications.

Minimum Supply Voltage: 1.25 V

Even at lower voltages, the microprocessor can maintain stability and performance, offering energy-efficient operation.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the microprocessor can withstand demanding environments and prolonged use without overheating.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures, making it suitable for a wide range of environmental conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connectivity.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure mounting onto circuit boards, enhancing stability and reliability.

Maximum Seated Height: 1.3 mm

With a low seated height, the microprocessor can fit into compact devices without compromising performance.

Width: 13 mm

A compact width makes the microprocessor suitable for small form factor devices and applications with limited space.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging the microprocessor, ensuring quality and reliability in operation.

External Data Bus Width: 16

The external data bus width of 16 bits allows for efficient data transfer between the microprocessor and external components.

Maximum Clock Frequency: 30 MHz

A high maximum clock frequency enables fast processing speeds, ideal for demanding applications and multitasking.

Maximum Time At Peak Reflow Temperature (s): 30

The microprocessor can withstand peak reflow temperatures for extended durations, ensuring proper soldering during assembly.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures without damage, ensuring reliable performance during the manufacturing process.

Length: 13 mm

A compact length allows for flexible placement within devices and circuit boards, optimizing space utilization.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, offering ruggedness and reliability in harsh operating conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

Based on RISC architecture, this microprocessor delivers efficient and high-speed processing for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Terminal Form: BALL

Terminal form of ball provides secure and reliable connections, ensuring stable operation and data transmission.

Nominal Supply Voltage: 1.3 V

Nominal supply voltage of 1.3V ensures optimal performance and efficiency, balancing power consumption and processing capabilities.

Terminal Pitch: 0.65 mm

A fine terminal pitch of 0.65mm allows for precise and compact board designs, enhancing connectivity and space efficiency.

Format: FIXED POINT

Fixed-point format allows for efficient arithmetic operations and precise calculations, essential for a wide range of computational tasks.

Moisture Sensitivity Level (MSL): 3

MSL of 3 indicates the microprocessor's resistance to moisture absorption, ensuring long-term reliability in various environmental conditions.

Speed: 456 rpm

With a speed of 456 rpm, the microprocessor can perform high-speed calculations and data processing, meeting the requirements of demanding applications.

Low Power Mode: YES

Low power mode enhances energy efficiency and prolongs battery life in portable devices, making the microprocessor a sustainable choice.

Technical Specifications

Microprocessors AM1808EZCED4 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Speed:

456 rpm

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

AM1808EZCED4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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