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AM1808BZWTT3

Texas Instruments

AM1808BZWTT3 by Texas Instruments

AM1808BZWTT3 by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. Operating at a max clock frequency of 50 MHz, it is suitable for low power applications requiring high-speed processing. The package style is grid array, making it ideal for compact designs in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,590 parts In-Stock

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3,590

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Digiode

USA . 2,611 parts In-Stock

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2,611

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 945 parts In-Stock

1+ parts

$0.332

100+ parts

-

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$0.319

945

$0.332

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$0.319

Northwest PG Solutions

USA . 463 parts In-Stock

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$0.365

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-

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$0.322

463

$0.365

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$0.322

AZTECH Wire

Italy . 752 parts In-Stock

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$17.531

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752

$17.531

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One Stop Electronics

USA . 1,435 parts In-Stock

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$19.000

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1,435

$19.000

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Parana Technologies

USA . 114 parts In-Stock

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$28.638

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$49.866

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114

$28.638

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$49.866

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DigiPath Technology Company

USA . 2,350 parts In-Stock

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$31.534

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2,350

$31.534

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ChromeModa Solutions

Germany . 6,118 parts In-Stock

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$32.178

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$26.386

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$32.178

$26.386

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IDEA Electronic Components Group

UK . 1,466 parts In-Stock

1+ parts

$32.178

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$30.569

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$28.960

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1,466

$32.178

$30.569

$28.960

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Component Stockers USA

USA . 355 parts In-Stock

1+ parts

$99.990

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355

$99.990

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Corphita

USA . 2,290 parts In-Stock

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2,290

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Lucentia Tech

USA . 300 parts In-Stock

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$42.330

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$39.198

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$39.198

300

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$42.330

$39.198

$39.198

Microchip USA

USA . 242 parts In-Stock

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242

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Overview

Experience the power and reliability of the Texas Instruments AM1808BZWTT3 microprocessor, designed to meet your high-performance needs. With integrated cache and a maximum clock frequency of 50 MHz, this processor offers seamless operation for a wide range of applications. From industrial automation to consumer electronics, the AM1808BZWTT3 delivers exceptional speed and efficiency. Trust in Texas Instruments' reputation for quality and innovation, and unlock the potential of your projects with this cutting-edge microprocessor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the sensitive internal components of the microprocessor.

Integrated Cache: YES

Having an integrated cache improves the performance of the microprocessor by allowing for faster access to frequently used data.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power requirements and can support demanding applications without compromising performance.

Address Bus Width: 23

A wider address bus width allows for larger memory access, which is beneficial for handling complex data processing tasks efficiently.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides good conductivity and corrosion resistance, ensuring reliable connections for optimal performance.

Technology: CMOS

CMOS technology offers low power consumption and fast switching speeds, making the microprocessor energy-efficient and suitable for various applications.

Technical Specifications

Microprocessors AM1808BZWTT3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Speed:

375 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

AM1808BZWTT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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