Loading...

AM1808BZCED4

Texas Instruments

AM1808BZCED4 by Texas Instruments

AM1808BZCED4 by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. Operating at up to 50 MHz, it has a temperature range of -40 to 90°C, making it suitable for industrial applications requiring low power consumption. The package style is grid array with 361 terminals in a square shape measuring 13mm x 13mm.

Median Price

$21.180

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10 parts In-Stock

1+ parts

-

100+ parts

$21.180

1k+ parts

$18.950

10k+ parts

$17.830

10

-

$21.180

$18.950

$17.830

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,271 parts In-Stock

1+ parts

$23.465

100+ parts

-

1k+ parts

-

10k+ parts

-

1,271

$23.465

-

-

-

Vyrian

USA . 4,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,700

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,981 parts In-Stock

1+ parts

$14.710

100+ parts

-

1k+ parts

$15.149

10k+ parts

-

1,981

$14.710

-

$15.149

-

Native Components

USA . 712 parts In-Stock

1+ parts

$15.620

100+ parts

-

1k+ parts

-

10k+ parts

-

712

$15.620

-

-

-

ChromeModa Solutions

Germany . 6,048 parts In-Stock

1+ parts

$16.528

100+ parts

$13.553

1k+ parts

-

10k+ parts

-

6,048

$16.528

$13.553

-

-

IDEA Electronic Components Group

UK . 191 parts In-Stock

1+ parts

$16.528

100+ parts

$15.702

1k+ parts

$14.875

10k+ parts

-

191

$16.528

$15.702

$14.875

-

Northwest PG Solutions

USA . 643 parts In-Stock

1+ parts

$17.182

100+ parts

$15.464

1k+ parts

-

10k+ parts

-

643

$17.182

$15.464

-

-

AZTECH Wire

Italy . 412 parts In-Stock

1+ parts

$17.830

100+ parts

-

1k+ parts

-

10k+ parts

-

412

$17.830

-

-

-

Corphita

USA . 3,067 parts In-Stock

1+ parts

$22.230

100+ parts

-

1k+ parts

-

10k+ parts

-

3,067

$22.230

-

-

-

DigiPath Technology Company

USA . 622 parts In-Stock

1+ parts

-

100+ parts

$14.902

1k+ parts

-

10k+ parts

-

622

-

$14.902

-

-

Microchip USA

USA . 146 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

146

-

-

-

-

Overview

Experience the exceptional performance of the Texas Instruments AM1808BZCED4 microprocessor, a top-of-the-line product designed to meet the demands of industrial applications. With integrated cache and low-power mode, this microprocessor offers unparalleled efficiency and reliability. Backed by Texas Instruments' reputation for quality and innovation, the AM1808BZCED4 delivers seamless operation and optimal functionality. Whether you're in the automotive, telecommunications, or consumer electronics industry, this microprocessor is the perfect choice for your next project. Upgrade your technology with the AM1808BZCED4 and enjoy superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product easy to handle and suitable for a wide range of applications.

Integrated Cache: YES

Having an integrated cache helps improve the overall performance of the microprocessor by reducing the time it takes to access frequently used data.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microprocessor onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.35 V

The low maximum supply voltage helps minimize power consumption and heat dissipation, making the product energy-efficient.

Address Bus Width: 23

A wider address bus allows for efficient memory access and faster data processing, enhancing the overall performance of the microprocessor.

Package Shape: SQUARE

The square package shape provides efficient use of space on circuit boards and facilitates uniform heat dissipation, contributing to the product's reliability.

Bit Size: 32

A 32-bit architecture allows the microprocessor to handle larger chunks of data at once, improving processing speed and efficiency.

Power Supplies (V): 1.3,1.8,3.3

Having multiple power supply options allows for flexibility in designing and powering the microprocessor, catering to various system requirements.

No. of Terminals: 361

A higher number of terminals enables more connectivity options and functionality, making the microprocessor versatile and adaptable to different configurations.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The combination of grid array, low profile, and fine pitch package styles offers a compact form factor, efficient heat dissipation, and easy installation, enhancing the product's overall performance.

Minimum Supply Voltage: 1.25 V

The low minimum supply voltage ensures stable operation and optimal performance of the microprocessor, even under low power conditions.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature allows the microprocessor to function reliably in harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the microprocessor can operate in extreme cold environments, increasing its versatility and usability.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides corrosion resistance, good conductivity, and reliability, contributing to the overall durability and performance of the microprocessor.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easier and more secure soldering onto circuit boards, ensuring proper electrical connections and stability.

Maximum Seated Height: 1.3 mm

The low maximum seated height allows for a slim profile, enabling compact designs and efficient heat dissipation in space-constrained applications.

Width: 13 mm

The moderate width ensures compatibility with standard industry specifications and facilitates easy integration into existing systems and designs.

Boundary Scan: YES

Boundary scan capability allows for efficient testing, debugging, and diagnosing of the microprocessor, enhancing reliability and ease of maintenance.

External Data Bus Width: 16

A wider external data bus width enables faster data transfer between the microprocessor and external devices, enhancing overall system performance.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency allows for fast data processing and efficient operation, making the microprocessor suitable for handling complex tasks and applications.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures proper soldering and reliable connections, contributing to the overall quality and performance of the microprocessor.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the microprocessor can withstand the soldering process without compromising its functionality or reliability.

Length: 13 mm

The moderate length ensures compatibility with standard industry specifications and facilitates easy integration into existing systems and designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures the microprocessor can operate reliably in demanding and rugged environments, making it suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, it offers simplified and faster instruction execution, leading to improved performance and efficiency in processing tasks.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the microprocessor efficient and reliable for various applications.

Terminal Form: BALL

The ball terminal form provides secure attachment and reliable electrical connections, ensuring stable operation and optimal performance of the microprocessor.

Nominal Supply Voltage: 1.3 V

The specified nominal supply voltage ensures stable operation and optimal performance of the microprocessor, meeting industry standards and requirements.

Terminal Pitch: 0.65 mm

The narrow terminal pitch allows for closer spacing and higher terminal density, enabling more features and functionality in a compact form factor.

Format: FIXED POINT

Having a fixed-point format simplifies arithmetic operations and data handling, optimizing performance and efficiency in processing numerical data.

Moisture Sensitivity Level (MSL): 3

The specified MSL ensures proper handling and storage of the microprocessor to prevent moisture-related issues, maintaining its reliability and performance over time.

Speed: 456 rpm

The high speed rating indicates the microprocessor's ability to quickly execute instructions and process data, enhancing overall system performance and responsiveness.

Low Power Mode: YES

Having a low power mode allows the microprocessor to conserve energy during idle or low-demand periods, extending battery life and reducing overall power consumption.

Technical Specifications

Microprocessors AM1808BZCED4 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1V AND 1.1 V NOMINAL

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.3 mm

Speed:

456 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

AM1808BZCED4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20