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STGP3NB60KD

STMicroelectronics

STGP3NB60KD by STMicroelectronics

STGP3NB60KD by STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max collector-emitter voltage of 600V, a turn-off time of 220ns, and can handle up to 68W dissipation. Ideal for high-performance switching in industrial systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,927 parts In-Stock

1+ parts

-

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6,927

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-

-

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Anansix

USA . 2,082 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,082

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Digiode

USA . 785 parts In-Stock

1+ parts

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785

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 95 parts In-Stock

1+ parts

$0.375

100+ parts

-

1k+ parts

$0.338

10k+ parts

-

95

$0.375

-

$0.338

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MKK Technologies

India . 2,040 parts In-Stock

1+ parts

$0.706

100+ parts

-

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-

10k+ parts

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2,040

$0.706

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DigiPath Technology Company

USA . 2,040 parts In-Stock

1+ parts

$0.706

100+ parts

-

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-

10k+ parts

-

2,040

$0.706

-

-

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$2.261

100+ parts

$2.058

1k+ parts

$1.854

10k+ parts

-

2,000

$2.261

$2.058

$1.854

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AZTECH Wire

Italy . 931 parts In-Stock

1+ parts

$11.090

100+ parts

-

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931

$11.090

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Corphita

USA . 2,833 parts In-Stock

1+ parts

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2,833

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Parana Technologies

USA . 468 parts In-Stock

1+ parts

-

100+ parts

$0.449

1k+ parts

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468

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$0.449

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Overview

Unlock superior power control with the STGP3NB60KD IGBT from STMicroelectronics, a leader in semiconductor innovation. Engineered for reliability and performance, this N-channel transistor excels in demanding applications, ensuring efficiency and durability. Its compact design and built-in diode make it ideal for various industries, providing robust solutions that enhance productivity while optimizing energy consumption. Choose ST for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making this IGBT suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel configuration provides better efficiency and higher current carrying capacity, enhancing performance in power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies the circuit design and increases reliability by reducing the number of components needed.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT is ideal for high-efficiency applications in industrial and commercial power systems.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space and allows for efficient heat dissipation, making it suitable for compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enhances mechanical stability and is convenient for assembly in various applications.

Nominal Turn Off Time: 220 ns

With a nominal turn-off time of 220 ns, this IGBT allows for fast switching, improving overall system efficiency and performance.

No. of Terminals: 3

The three-terminal design simplifies connections while maintaining functionality, which is advantageous for various circuitry setups.

Maximum Power Dissipation (Abs): 68 W

A high maximum power dissipation of 68 W ensures that this IGBT can handle substantial loads, making it suitable for demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style facilitates secure installation and enhances thermal conductivity, making it suitable for high-power applications.

Maximum Operating Temperature: 150 °C

The ability to operate at temperatures of up to 150 °C allows for reliable performance in high-temperature environments.

Maximum Collector-Emitter Voltage: 600 V

With a maximum collector-emitter voltage of 600 V, this IGBT is capable of handling high voltage applications effectively.

Transistor Element Material: SILICON

Silicon material ensures optimal performance characteristics, reliability, and thermal management in high-power applications.

Maximum Gate-Emitter Voltage: 20 V

A maximum gate-emitter voltage of 20 V provides sufficient control over the device, permitting versatile application possibilities.

Maximum Collector Current (IC): 10 A

The capability of handling a maximum collector current of 10 A makes this IGBT suitable for medium to high power applications.

Maximum Gate-Emitter Threshold Voltage: 7 V

A threshold voltage of 7 V ensures reliable operation and minimizes power loss during switching, enhancing efficiency.

Terminal Finish: MATTE TIN

Matte tin terminal finish increases corrosion resistance and improves solderability, enhancing the longevity of connections.

Terminal Position: SINGLE

Single terminal position simplifies the design and integration into various applications, making it user-friendly.

Nominal Turn On Time: 19 ns

With an incredibly fast turn-on time of 19 ns, this IGBT ensures quick response times, critical for efficient switching applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGP3NB60KD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

220 ns

Nominal Turn On Time (ton):

19 ns

Trade Compliance

STGP3NB60KD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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