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STGP100N30

STMicroelectronics

STGP100N30 by STMicroelectronics

STMicroelectronics' STGP100N30 is an N-CHANNEL IGBT with 330V VCE, 90A IC, and 250W Ptot. Ideal for general purpose switching applications due to its fast 310ns turn-off time and max operating temp of 150°C. Package style is flange mount with through-hole terminals.

Median Price

$7.010

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 848 parts In-Stock

1+ parts

$7.010

100+ parts

$3.442

1k+ parts

$2.893

10k+ parts

-

848

$7.010

$3.442

$2.893

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 484 parts In-Stock

1+ parts

$6.660

100+ parts

-

1k+ parts

-

10k+ parts

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484

$6.660

-

-

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Vyrian

USA . 5,213 parts In-Stock

1+ parts

-

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-

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5,213

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Anansix

USA . 302 parts In-Stock

1+ parts

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302

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Nova Conductors

Japan . 15 parts In-Stock

1+ parts

-

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-

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,175 parts In-Stock

1+ parts

$0.393

100+ parts

-

1k+ parts

$0.354

10k+ parts

-

2,175

$0.393

-

$0.354

-

Aztec Data Supply Inc.

USA . 1,214 parts In-Stock

1+ parts

$0.522

100+ parts

-

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-

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1,214

$0.522

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-

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Corohmni

South Africa . 180 parts In-Stock

1+ parts

$0.618

100+ parts

-

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-

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180

$0.618

-

-

-

MKK Technologies

India . 923 parts In-Stock

1+ parts

$0.739

100+ parts

-

1k+ parts

-

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-

923

$0.739

-

-

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DigiPath Technology Company

USA . 923 parts In-Stock

1+ parts

$0.739

100+ parts

-

1k+ parts

-

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-

923

$0.739

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-

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Advanced Electronics

New Zealand . 75 parts In-Stock

1+ parts

$4.429

100+ parts

$4.075

1k+ parts

$3.818

10k+ parts

-

75

$4.429

$4.075

$3.818

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Ampacity Inc.

Singapore . 474 parts In-Stock

1+ parts

$5.960

100+ parts

-

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474

$5.960

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Corphita

USA . 104 parts In-Stock

1+ parts

$6.309

100+ parts

-

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104

$6.309

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AZTECH Wire

Italy . 557 parts In-Stock

1+ parts

$12.632

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-

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557

$12.632

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Microchip USA

USA . 5,804 parts In-Stock

1+ parts

$17.080

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5,804

$17.080

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Continental Prestige Electronics

USA . 2,984 parts In-Stock

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2,984

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Parana Technologies

USA . 1,346 parts In-Stock

1+ parts

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$0.470

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1,346

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$0.470

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Argo Parts USA

USA . 1,096 parts In-Stock

1+ parts

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1,096

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Perfect Parts

USA . 1,006 parts In-Stock

1+ parts

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1,006

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Aranea Global

USA . 100 parts In-Stock

1+ parts

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100+ parts

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100

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Overview

Upgrade your electronics with the STGP100N30 by STMicroelectronics, a top-quality Insulated Gate Bipolar Transistor that offers unparalleled performance in general purpose switching applications. With its durable plastic/epoxy package body and N-channel configuration, this transistor ensures reliable operation and efficient power dissipation up to 250W. Whether you're designing industrial machinery or automotive systems, the STGP100N30 delivers superior functionality and longevity, making it the ideal choice for your next project. Experience the value and benefits of cutting-edge technology with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation properties, making the IGBT suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs offer higher efficiency and faster switch times compared to P-channel IGBTs, making them ideal for high-speed switching applications.

Configuration: SINGLE

A single configuration simplifies the circuit design and allows for easy integration into various electronic systems.

Transistor Application: GENERAL PURPOSE SWITCHING

This IGBT is versatile and can be used in various switching applications, offering flexibility and adaptability.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and optimal use of space in compact electronic designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and stability in circuit applications, ensuring reliable performance.

Nominal Turn Off Time (toff): 310 ns

The fast turn-off time helps minimize switching losses and improve overall efficiency in power electronics systems.

No. of Terminals: 3

With three terminals, the IGBT offers simple connections and ease of use in circuit designs.

Maximum Power Dissipation (Abs): 250 W

This high power dissipation capability enables the IGBT to handle high loads and maintain stability under demanding conditions.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides secure mounting and heat dissipation, ensuring long-term reliability in operation.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this IGBT can withstand elevated temperatures and harsh environmental conditions.

Maximum Collector-Emitter Voltage: 330 V

The high collector-emitter voltage rating ensures the IGBT can handle high voltage levels, making it suitable for power electronics applications.

Transistor Element Material: SILICON

Silicon-based transistor elements offer excellent performance and reliability in electronic circuits, ensuring long-term stability and efficiency.

Maximum Gate-Emitter Voltage: 20 V

The high gate-emitter voltage rating allows for efficient control and modulation of the IGBT during switching operations.

Maximum Collector Current (IC): 90 A

With a high collector current rating, this IGBT can handle high current loads, making it suitable for power applications.

Maximum Gate-Emitter Threshold Voltage: 5.5 V

The low gate-emitter threshold voltage ensures efficient control and modulation of the IGBT, enhancing performance in switching applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and connections, making the IGBT easy to integrate into electronic systems.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGP100N30 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

330 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

5.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

GENERAL PURPOSE SWITCHING

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

310 ns

Trade Compliance

STGP100N30 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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