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STGFW40H65FB

STMicroelectronics

STGFW40H65FB by STMicroelectronics

STGFW40H65FB by STMicroelectronics is an N-CHANNEL IGBT transistor with 650V VCEsat, 80A IC, and 62.5W power dissipation. Ideal for POWER CONTROL applications due to its fast turn-off time of 202ns and high operating temperature range (-55 to 175 °C).

Median Price

$4.010

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 290 parts In-Stock

1+ parts

$4.010

100+ parts

$1.530

1k+ parts

-

10k+ parts

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290

$4.010

$1.530

-

-

DigiKey

USA . 274 parts In-Stock

1+ parts

$4.010

100+ parts

$2.208

1k+ parts

$1.517

10k+ parts

$1.361

274

$4.010

$2.208

$1.517

$1.361

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 312 parts In-Stock

1+ parts

$3.088

100+ parts

-

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312

$3.088

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Vyrian

USA . 8,860 parts In-Stock

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8,860

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Anansix

USA . 1,620 parts In-Stock

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1,620

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,546 parts In-Stock

1+ parts

$1.567

100+ parts

-

1k+ parts

$1.410

10k+ parts

-

1,546

$1.567

-

$1.410

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Ampacity Inc.

Singapore . 224 parts In-Stock

1+ parts

$2.760

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-

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224

$2.760

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Corphita

USA . 1,246 parts In-Stock

1+ parts

$2.925

100+ parts

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1,246

$2.925

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MKK Technologies

India . 721 parts In-Stock

1+ parts

$2.946

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-

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721

$2.946

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DigiPath Technology Company

USA . 721 parts In-Stock

1+ parts

$2.946

100+ parts

-

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721

$2.946

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A-Z Elektronik GmbH

Germany . 6,602 parts In-Stock

1+ parts

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6,602

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Kepictronics

USA . 546 parts In-Stock

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546

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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GreenTree Electronics

Israel . 300 parts In-Stock

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300

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Parana Technologies

USA . 84 parts In-Stock

1+ parts

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100+ parts

$1.873

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84

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$1.873

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Overview

Elevate your power control applications with the STGFW40H65FB Insulated Gate Bipolar Transistor by STMicroelectronics. Manufactured with precision and expertise, this N-channel transistor offers high performance and reliability in a single configuration. With a maximum collector-emitter voltage of 650V and a maximum collector current of 80A, this transistor is designed to handle even the most demanding power control tasks. Trust STMicroelectronics to deliver quality and value in every component, providing you with the advantage you need to excel in your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides good insulation and protection for the internal components of the IGBT.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-resistance and higher current-carrying capability compared to P-channel IGBTs, making them more suitable for power control applications.

Maximum VCEsat: 2 V

A lower VCEsat value indicates lower power losses during operation, making the IGBT more efficient in power control applications.

Maximum Collector-Emitter Voltage: 650 V

With a high maximum collector-emitter voltage rating, this IGBT is suitable for high voltage power control applications.

Maximum Collector Current (IC): 80 A

The high collector current rating allows the IGBT to handle large currents, making it suitable for high-power applications.

Maximum Gate-Emitter Voltage: 20 V

The 20V gate-emitter voltage allows for effective gate control of the IGBT, ensuring reliable and efficient operation.

Maximum Power Dissipation (Abs): 62.5 W

The high power dissipation rating indicates that the IGBT can handle significant power levels without overheating.

Nominal Turn Off Time (toff): 202 ns

The fast turn-off time of 202 ns ensures quick switching speeds, making the IGBT ideal for applications requiring rapid power control.

Nominal Turn On Time (ton): 52 ns

The fast turn-on time of 52 ns allows for quick activation of the IGBT, improving efficiency in power control applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature tolerance makes this IGBT suitable for use in a wide range of environments and applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGFW40H65FB attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

202 ns

Nominal Turn On Time (ton):

52 ns

Maximum VCEsat:

2 V

Trade Compliance

STGFW40H65FB Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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