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STGF10NC60SD

STMicroelectronics

STGF10NC60SD by STMicroelectronics

STGF10NC60SD from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control. It features a max collector-emitter voltage of 600V, a turn-off time of 560ns, and can handle up to 10A current. Ideal for applications in industrial motor drives and power converters.

Median Price

$0.447

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,799 parts In-Stock

1+ parts

$0.447

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-

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10k+ parts

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1,799

$0.447

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Chip1Stop

Japan . 1,799 parts In-Stock

1+ parts

$0.862

100+ parts

-

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-

10k+ parts

-

1,799

$0.862

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Verical

USA . 1,799 parts In-Stock

1+ parts

-

100+ parts

$0.447

1k+ parts

-

10k+ parts

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1,799

-

$0.447

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,906 parts In-Stock

1+ parts

$0.420

100+ parts

-

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3,906

$0.420

-

-

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Component Electronics Inc.

Canada . 4 parts In-Stock

1+ parts

$11.540

100+ parts

$8.650

1k+ parts

$7.500

10k+ parts

-

4

$11.540

$8.650

$7.500

-

Vyrian

USA . 4,109 parts In-Stock

1+ parts

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4,109

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Anansix

USA . 1,001 parts In-Stock

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1,001

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,315 parts In-Stock

1+ parts

$0.376

100+ parts

-

1k+ parts

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1,315

$0.376

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Corphita

USA . 2,016 parts In-Stock

1+ parts

$0.398

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-

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2,016

$0.398

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IDEA Electronic Components Group

UK . 1,242 parts In-Stock

1+ parts

$1.777

100+ parts

-

1k+ parts

$1.599

10k+ parts

-

1,242

$1.777

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$1.599

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MKK Technologies

India . 838 parts In-Stock

1+ parts

$3.341

100+ parts

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838

$3.341

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DigiPath Technology Company

USA . 838 parts In-Stock

1+ parts

$3.341

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838

$3.341

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AZTECH Wire

Italy . 171 parts In-Stock

1+ parts

$13.070

100+ parts

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171

$13.070

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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QUARKTWIN TECHNOLOGY LTD

USA . 6,808 parts In-Stock

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6,808

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Perfect Parts

USA . 404 parts In-Stock

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404

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Parana Technologies

USA . 270 parts In-Stock

1+ parts

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100+ parts

$2.124

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270

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$2.124

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Overview

Unlock the power of efficiency with the STGF10NC60SD from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel IGBT delivers exceptional performance for power control applications, ensuring reliability and durability in demanding environments. With built-in diode capability and robust construction, it excels in industrial automation, renewable energy systems, and motor drives. Elevate your designs today—experience unmatched quality and support from a trusted name in technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection against environmental factors, making the IGBT suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally offer lower conduction losses and higher overall efficiency, making them ideal for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The single configuration with a built-in diode simplifies design and enhances reliability by reducing the number of components needed.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT can efficiently switch large amounts of power, making it suitable for high-power applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy mounting and integration into various designs, optimizing space and layout.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure secure connections and reliable performance, suitable for applications that require robust physical connections.

Nominal Turn Off Time (toff): 560 ns

A fast turn-off time of 560 ns allows for efficient control of switching processes, reducing losses during operation.

No. of Terminals: 3

Three terminals provide a simple yet effective interface for connection, making this IGBT easy to work with in circuit designs.

Maximum Power Dissipation (Abs): 25 W

With a maximum power dissipation of 25 W, this IGBT can handle significant power while minimizing the risk of thermal overload.

Package Style (Meter): FLANGE MOUNT

The flange mount style allows for stable mounting and effective heat dissipation, which is crucial for maintaining performance in high-power applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C ensures that the IGBT can perform reliably under demanding thermal conditions.

Maximum Collector-Emitter Voltage: 600 V

With a maximum collector-emitter voltage of 600 V, this IGBT is well-suited for high-voltage applications, enhancing its versatility.

Transistor Element Material: SILICON

Silicon as the element material provides good performance characteristics and reliability, making it a standard choice for power transistors.

Maximum Gate-Emitter Voltage: 20 V

A maximum gate-emitter voltage of 20 V allows for flexibility in drive circuits, making it easier to integrate with various control systems.

Maximum Collector Current (IC): 10 A

The capability to handle a maximum collector current of 10 A makes this IGBT suitable for a wide range of high-current applications.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

A low threshold voltage of 5.75 V allows for efficient gate drive requirements, which improves overall system responsiveness.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable long-term connections.

Terminal Position: SINGLE

A single terminal position simplifies the design and assembly of circuits, making it user-friendly for engineers and designers.

Case Connection: ISOLATED

An isolated case connection enhances safety and performance by reducing the risk of short circuits or unintended connections.

Nominal Turn On Time (ton): 22.5 ns

With a nominal turn-on time of 22.5 ns, this IGBT allows for rapid switching, ideal for applications requiring quick response times.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGF10NC60SD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Additional Features:

ULTRA FAST

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

560 ns

Nominal Turn On Time (ton):

22.5 ns

Trade Compliance

STGF10NC60SD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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