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STGF19NC60WD

STMicroelectronics

STGF19NC60WD by STMicroelectronics

STGF19NC60WD from STMicroelectronics is an N-channel IGBT ideal for motor control applications. It features a max collector-emitter voltage of 600V, power dissipation of 32W, and operates at up to 150 °C. Its fast switching times (ton: 25ns, toff: 127ns) enhance efficiency.

Median Price

$2.990

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 19 parts In-Stock

1+ parts

$2.990

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-

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19

$2.990

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Distributors (In-Stock)

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Digiode

USA . 4,038 parts In-Stock

1+ parts

$2.840

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4,038

$2.840

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Vyrian

USA . 7,754 parts In-Stock

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7,754

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Anansix

USA . 2,430 parts In-Stock

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2,430

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Lakeland Logistics Inc

USA . 1,000 parts In-Stock

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1,000

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Bristol Electronics

USA . 1,000 parts In-Stock

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-

100+ parts

$2.038

1k+ parts

$1.791

10k+ parts

-

1,000

-

$2.038

$1.791

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 222 parts In-Stock

1+ parts

$0.756

100+ parts

-

1k+ parts

$0.681

10k+ parts

-

222

$0.756

-

$0.681

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MKK Technologies

India . 1,010 parts In-Stock

1+ parts

$1.422

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1,010

$1.422

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DigiPath Technology Company

USA . 1,010 parts In-Stock

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$1.422

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1,010

$1.422

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Corphita

USA . 4,315 parts In-Stock

1+ parts

$2.691

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4,315

$2.691

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Microchip USA

USA . 385 parts In-Stock

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$13.975

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385

$13.975

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,848 parts In-Stock

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6,848

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RC Electronics

USA . 2,358 parts In-Stock

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2,358

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Perfect Parts

USA . 749 parts In-Stock

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749

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Parana Technologies

USA . 420 parts In-Stock

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$0.904

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420

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$0.904

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Overview

Unlock the power of innovation with the STGF19NC60WD IGBT from STMicroelectronics, a leader in semiconductor technology. Designed for motor control applications, this robust N-channel device delivers exceptional performance and reliability, ensuring optimal efficiency in your projects. With its built-in diode and through-hole configuration, it simplifies integration while providing superior thermal management. Trust STMicroelectronics for quality that drives success in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the IGBT suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically offer better performance and efficiency, particularly in high-speed applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode helps in fast switching applications, reducing component count and simplifying circuit design.

Transistor Application: MOTOR CONTROL

Designed specifically for motor control applications, this IGBT ensures high efficiency and reliability in controlling motor operations.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on circuit boards, facilitating easier integration into designs.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides robust mechanical support and simplifies soldering for stable connections.

Nominal Turn Off Time (toff): 127 ns

A fast turn-off time enhances the switching performance, making it suitable for high-frequency applications.

No. of Terminals: 3

The three terminals allow for simplified connections while ensuring efficient current flow and control.

Maximum Power Dissipation (Abs): 32 W

With a high power dissipation capability, it can handle significant power loads, enhancing its reliability in demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount offers enhanced heat dissipation, which is crucial for maintaining performance during high operation periods.

Maximum Operating Temperature: 150 °C

A high operating temperature tolerance ensures reliability in harsh environments and reduces the risk of thermal failure.

Maximum Collector-Emitter Voltage: 600 V

A high collector-emitter voltage rating allows for versatile application in high-voltage systems.

Transistor Element Material: SILICON

Silicon as a semiconductor material provides good thermal conductivity and performance stability under varying conditions.

Maximum Gate-Emitter Voltage: 20 V

This voltage rating allows for flexible driving configurations while maintaining safe operation limits.

Maximum Collector Current (IC): 14 A

With a maximum collector current of 14 A, this IGBT can handle significant current loads, making it ideal for power applications.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

A moderate threshold voltage provides optimal gate drive requirements for efficient switching and control.

Terminal Position: SINGLE

Single terminal positioning simplifies design and reduces the potential for misalignment during assembly.

Case Connection: ISOLATED

Isolated case connection prevents unintended current flow to other parts of the circuit, enhancing safety and operational integrity.

Nominal Turn On Time (ton): 25 ns

Fast turn-on time results in quick response in switching applications, improving overall circuit efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGF19NC60WD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

127 ns

Nominal Turn On Time (ton):

25 ns

Trade Compliance

STGF19NC60WD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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