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STGF10M65DF2

STMicroelectronics

STGF10M65DF2 by STMicroelectronics

STGF10M65DF2 from STMicroelectronics is an N-channel IGBT ideal for power control applications. It features a max VCEsat of 2V, 650V collector-emitter voltage, and operates b/w -55 °C to 175 °C. Its compact design ensures efficient thermal management in various electronic systems.

Median Price

$1.750

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,112 parts In-Stock

1+ parts

$1.750

100+ parts

$0.745

1k+ parts

$0.537

10k+ parts

$0.436

2,112

$1.750

$0.745

$0.537

$0.436

Chip1Stop

Japan . 1,700 parts In-Stock

1+ parts

$3.340

100+ parts

$0.802

1k+ parts

$0.519

10k+ parts

-

1,700

$3.340

$0.802

$0.519

-

Avnet

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Future Electronics

Canada . 350 parts In-Stock

1+ parts

-

100+ parts

$0.500

1k+ parts

$0.475

10k+ parts

$0.445

350

-

$0.500

$0.475

$0.445

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,432 parts In-Stock

1+ parts

$0.532

100+ parts

-

1k+ parts

-

10k+ parts

-

1,432

$0.532

-

-

-

Chip Stock

USA . 11,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,500

-

-

-

-

Vyrian

USA . 5,039 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,039

-

-

-

-

Anansix

USA . 2,498 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,498

-

-

-

-

Semi Source

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

IBS Electronics

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$0.709

1k+ parts

$0.676

10k+ parts

$0.643

350

-

$0.709

$0.676

$0.643

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,668 parts In-Stock

1+ parts

$0.504

100+ parts

-

1k+ parts

-

10k+ parts

-

4,668

$0.504

-

-

-

IDEA Electronic Components Group

UK . 2,318 parts In-Stock

1+ parts

$0.558

100+ parts

-

1k+ parts

$0.502

10k+ parts

-

2,318

$0.558

-

$0.502

-

MKK Technologies

India . 246 parts In-Stock

1+ parts

$1.048

100+ parts

-

1k+ parts

-

10k+ parts

-

246

$1.048

-

-

-

DigiPath Technology Company

USA . 246 parts In-Stock

1+ parts

$1.048

100+ parts

-

1k+ parts

-

10k+ parts

-

246

$1.048

-

-

-

Microchip USA

USA . 4,709 parts In-Stock

1+ parts

$10.790

100+ parts

-

1k+ parts

-

10k+ parts

-

4,709

$10.790

-

-

-

AZTECH Wire

Italy . 1,042 parts In-Stock

1+ parts

$22.200

100+ parts

-

1k+ parts

-

10k+ parts

-

1,042

$22.200

-

-

-

RC Electronics

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,000

-

-

-

-

Parana Technologies

USA . 772 parts In-Stock

1+ parts

-

100+ parts

$0.667

1k+ parts

-

10k+ parts

-

772

-

$0.667

-

-

Overview

Unlock superior power control with the STGF10M65DF2 from STMicroelectronics! Renowned for their quality and innovation, STMicroelectronics offers this N-channel IGBT, perfect for demanding applications where efficiency and reliability are paramount. With built-in protection features and an impressive thermal management capability, it ensures optimal performance in various industrial sectors. Choose STMicroelectronics for unmatched value and robust solutions that elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protects against environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel configuration is known for higher efficiency and lower on-resistance, making it ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the versatility of the IGBT, allowing for seamless switching and improved protection in circuits.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance in energy management systems.

Maximum VCEsat: 2 V

A low VCEsat minimizes power loss during operation, leading to improved efficiency and heat management.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization in circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide reliable mechanical support and better thermal conductivity, ensuring stable connections.

Nominal Turn Off Time (toff): 260 ns

A relatively fast turn-off time enhances the switching efficiency, particularly in high-frequency applications.

No. of Terminals: 3

The three-terminal configuration simplifies integration within circuits while maintaining functionality.

Maximum Power Dissipation (Abs): 30 W

With a maximal power dissipation of 30 W, this IGBT can handle substantial loads without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount style ensures secure installation and improved thermal management in power applications.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature makes this product suitable for demanding environments, ensuring reliability.

Maximum Collector-Emitter Voltage: 650 V

The high voltage rating allows for versatile usage in various industrial applications requiring substantial voltage handling.

Transistor Element Material: SILICON

Silicon is a well-established material for power electronics, providing robustness and stability in performance.

Maximum Gate-Emitter Voltage: 20 V

A maximum gate-emitter voltage of 20 V ensures compatibility with various gate drive circuits.

Minimum Operating Temperature: -55 °C

A low minimum operating temperature expands the application range to extreme environments, enhancing versatility.

Maximum Collector Current (IC): 20 A

The high collector current capability supports demanding power applications, ensuring efficient operation.

Maximum Gate-Emitter Threshold Voltage: 7 V

A threshold voltage of 7 V provides reliable switching characteristics for diverse applications.

Terminal Position: SINGLE

A single terminal position simplifies mounting and minimizes space requirements in circuit layouts.

Case Connection: ISOLATED

An isolated case connection enhances safety and reduces the risk of short circuits in complex applications.

Nominal Turn On Time (ton): 27 ns

The nominal turn-on time of 27 ns allows for fast switching, making this IGBT ideal for high-speed applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGF10M65DF2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

260 ns

Nominal Turn On Time (ton):

27 ns

Maximum VCEsat:

2 V

Trade Compliance

STGF10M65DF2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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