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STGB7NC60HDT4

STMicroelectronics

STGB7NC60HDT4 by STMicroelectronics

STGB7NC60HDT4 from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max collector-emitter voltage of 600V, 25A collector current, and a fast turn-off time of 221ns. Ideal for high-performance switching in compact designs.

Median Price

$2.995

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 59 parts In-Stock

1+ parts

$2.510

100+ parts

$1.130

1k+ parts

$0.891

10k+ parts

-

59

$2.510

$1.130

$0.891

-

Newark

USA . 1,009 parts In-Stock

1+ parts

$2.990

100+ parts

$1.390

1k+ parts

$1.320

10k+ parts

-

1,009

$2.990

$1.390

$1.320

-

Mouser Electronics

USA . 1,031 parts In-Stock

1+ parts

$3.000

100+ parts

$1.380

1k+ parts

$1.070

10k+ parts

$1.010

1,031

$3.000

$1.380

$1.070

$1.010

Element14

Singapore . 59 parts In-Stock

1+ parts

$4.290

100+ parts

$1.930

1k+ parts

$1.660

10k+ parts

-

59

$4.290

$1.930

$1.660

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,842 parts In-Stock

1+ parts

$2.166

100+ parts

-

1k+ parts

-

10k+ parts

-

1,842

$2.166

-

-

-

Vyrian

USA . 3,826 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,826

-

-

-

-

Anansix

USA . 1,664 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,664

-

-

-

-

Schukat

Germany . 980 parts In-Stock

1+ parts

-

100+ parts

$1.600

1k+ parts

$1.270

10k+ parts

-

980

-

$1.600

$1.270

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 750 parts In-Stock

1+ parts

$0.531

100+ parts

-

1k+ parts

$0.478

10k+ parts

-

750

$0.531

-

$0.478

-

MKK Technologies

India . 742 parts In-Stock

1+ parts

$0.998

100+ parts

-

1k+ parts

-

10k+ parts

-

742

$0.998

-

-

-

DigiPath Technology Company

USA . 742 parts In-Stock

1+ parts

$0.998

100+ parts

-

1k+ parts

-

10k+ parts

-

742

$0.998

-

-

-

Corphita

USA . 1,606 parts In-Stock

1+ parts

$2.052

100+ parts

-

1k+ parts

-

10k+ parts

-

1,606

$2.052

-

-

-

Continental Prestige Electronics

USA . 120 parts In-Stock

1+ parts

$2.210

100+ parts

$1.420

1k+ parts

$0.945

10k+ parts

-

120

$2.210

$1.420

$0.945

-

Component Stockers USA

USA . 3,723 parts In-Stock

1+ parts

$2.220

100+ parts

$1.470

1k+ parts

$1.130

10k+ parts

-

3,723

$2.220

$1.470

$1.130

-

Ampacity Inc.

Singapore . 511 parts In-Stock

1+ parts

$2.360

100+ parts

-

1k+ parts

-

10k+ parts

-

511

$2.360

-

-

-

Microchip USA

USA . 4,163 parts In-Stock

1+ parts

$7.580

100+ parts

-

1k+ parts

-

10k+ parts

-

4,163

$7.580

-

-

-

Perfect Parts

USA . 47,946 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

47,946

-

-

-

-

RC Electronics

USA . 16,068 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,068

-

-

-

-

Kepictronics

USA . 4,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,700

-

-

-

-

Parana Technologies

USA . 1,893 parts In-Stock

1+ parts

-

100+ parts

$0.635

1k+ parts

-

10k+ parts

-

1,893

-

$0.635

-

-

A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,800

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Eastek

USA . 18 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18

-

-

-

-

Overview

Unlock unparalleled performance with the STGB7NC60HDT4 from STMicroelectronics, a leading innovator in semiconductor technology. This N-channel IGBT excels in power control applications, delivering remarkable efficiency and reliability, thanks to its robust design. With a compact footprint and advanced thermal management, it’s perfect for demanding environments. Trust in STMicroelectronics’ commitment to quality and elevate your projects with this high-performance solution that ensures optimal energy savings and longevity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a reliable and durable package, enhancing the device's overall robustness in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel configurations typically offer better performance and efficiency in power control applications, making this IGBT suitable for high-power tasks.

Configuration: SINGLE WITH BUILT-IN DIODE

The inclusion of a built-in diode simplifies integration and enhances performance in applications requiring fast switching and freewheeling capabilities.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT is ideal for applications that demand efficient handling of high-voltage and high-current conditions.

Surface Mount: YES

Surface mount technology allows for easier assembly and more efficient use of PCB space, making this IGBT suitable for compact circuit designs.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easier placement and improved thermal management, which is critical for high-performance applications.

Terminal Form: GULL WING

Gull wing terminals enhance solder joint reliability, making it easier to achieve robust connections on the PCB.

Nominal Turn Off Time (toff): 221 ns

A fast turn-off time improves switching efficiency, reducing power losses and making this IGBT suitable for high-frequency applications.

No. of Terminals: 2

With a simple 2-terminal design, this IGBT minimizes complexity in circuit design, making it easier to integrate into various applications.

Maximum Power Dissipation (Abs): 80 W

A maximum power dissipation of 80 W allows for high-power applications, making this IGBT suitable for demanding power management systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables compact designs while maintaining performance, making it ideal for space-constrained applications.

Maximum Operating Temperature: 150 °C

Withstanding high temperatures enhances thermal reliability and operational efficiency, making this IGBT suitable for diverse environments.

Maximum Collector-Emitter Voltage: 600 V

A maximum voltage rating of 600 V supports the use in high-voltage applications, ensuring versatility in power control solutions.

Transistor Element Material: SILICON

Silicon provides excellent electrical properties, making this IGBT suitable for effective power control with good thermal performance.

Maximum Gate-Emitter Voltage: 20 V

A maximum gate-emitter voltage of 20 V allows for efficient gate drive designs, improving overall circuit performance.

Maximum Collector Current (IC): 25 A

A collector current capacity of 25 A ensures this IGBT can handle significant current loads, suitable for high-power applications.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

A manageable threshold voltage allows for easy control and integration within various electronic circuitry.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin terminal finishing improves solderability and enhances long-term connection reliability during operation.

Terminal Position: SINGLE

A single terminal position simplifies design, allowing for easier layout on printed circuit boards.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures proper soldering during assembly, promoting reliability in connections.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245 °C indicates compatibility with modern soldering processes, enhancing manufacturability.

Nominal Turn On Time (ton): 25.5 ns

A quick turn-on time of 25.5 ns improves response time, enhancing performance in fast switching applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGB7NC60HDT4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

221 ns

Nominal Turn On Time (ton):

25.5 ns

Trade Compliance

STGB7NC60HDT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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