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RHFXH162373K-01V

STMicroelectronics

RHFXH162373K-01V by STMicroelectronics

RHFXH162373K-01V by STMicroelectronics is a dual 8-bit bus driver with a max supply voltage of 3.6V and operates in extreme temperatures from -55 °C to 125 °C. It features a low propagation delay of 5.7 ns and supports military applications with Class V screening. Ideal for high-reliability systems, it offers robust performance in harsh environments.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 4,269 parts In-Stock

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Anansix

USA . 790 parts In-Stock

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Digiode

USA . 210 parts In-Stock

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Andel Nordic

Denmark . 1,200 parts In-Stock

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$4.797

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$4.606

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$4.606

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$4.797

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$4.606

IDEA Electronic Components Group

UK . 1,965 parts In-Stock

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$30.711

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$27.639

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MKK Technologies

India . 891 parts In-Stock

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$57.749

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DigiPath Technology Company

USA . 891 parts In-Stock

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$57.749

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Corphita

USA . 2,973 parts In-Stock

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Parana Technologies

USA . 529 parts In-Stock

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$36.719

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Overview

Unlock superior performance with the RHFXH162373K-01V from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. Designed for robust applications in military and aerospace environments, this reliable bus driver and transceiver ensures exceptional signal integrity and durability. With its advanced ceramic-metal sealed packaging and wide operating temperature range, you can elevate your designs while enjoying reduced power consumption and enhanced system efficiency. Choose STMicroelectronics for innovation that drives your success!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed co-fired package ensures high reliability and durability, making it suitable for harsh environments.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern PCBs, which is ideal for space-constrained applications.

No. of Functions: 2

With dual functionality, this device provides greater versatility, enabling it to serve multiple purpose requirements within a single component.

Screening Level: MIL-PRF-38535 Class V

This high screening level signifies a robust level of quality and reliability for military and aerospace applications, ensuring performance under extreme conditions.

Package Shape: RECTANGULAR

The rectangular shape eases layout in designs and maximizes the use of PCB space, contributing to efficient circuit design.

No. of Bits: 8

An 8-bit configuration allows for handling a moderate amount of data, ideal for many communication and control tasks.

Nominal Supply Voltage / Vsup (V): 2.3

A nominal voltage of 2.3V ensures compatibility with low-voltage applications, promoting energy efficiency.

Load Capacitance (CL): 30 pF

A low load capacitance (CL) supports higher speed operations and reduces delays in signal transmission, enhancing system performance.

Power Supplies (V): 2.5/3.3

Supports both 2.5V and 3.3V, providing flexibility in design and compatibility with a wide range of systems.

No. of Terminals: 48

A greater number of terminals provides more connectivity options, enabling complex configurations for intricate designs.

Package Style (Meter): FLATPACK

Flatpack style contributes to low profile design, facilitating better thermal management and lower height profiles.

Maximum I (ol): 8 Amp

An output current of up to 8 Amperes indicates significant drive capability, ensuring reliable operation in power-intensive applications.

Propagation Delay (tpd): 5.7 ns

A low propagation delay of 5.7 nanoseconds allows for high-speed signal processing, making it ideal for fast-paced applications.

Maximum Operating Temperature: 125 °C

With a high operating temperature limit, this component is suitable for demanding environments where other devices may fail.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state output capacity enhances flexibility when interfacing with multiple devices on a bus, reducing contention and signal conflicts.

Minimum Operating Temperature: -55 °C

Ability to operate at extremely low temperatures ensures reliable performance in cold environments, crucial for military and aerospace applications.

Terminal Position: DUAL

Dual terminal positioning simplifies routing on printed circuit boards, improving design efficiency.

No. of Ports: 2

Two ports allow for bi-directional communication, increasing the functionality and efficiency of the overall system.

Maximum Seated Height: 2.72 mm

A low seated height allows for more compact designs and better integration into low-profile applications.

Width: 9.65 mm

A compact width enhances layout flexibility and maintains efficient space usage on the PCB.

Output Polarity: TRUE

True output polarity indicates a positive signal convention, which is standard for many digital systems, ensuring compatibility.

Minimum Supply Voltage (Vsup): 1.8 V

Able to operate with a minimum voltage of 1.8V aligns with modern low-power requirements, maximizing energy efficiency.

Length: 15.75 mm

A moderate length offers a good balance between space efficiency and layout flexibility on PCBs.

Temperature Grade: MILITARY

Designed to military standards, ensuring high reliability and performance in extreme conditions, making it suited for critical applications.

Total Dose (V): 300k Rad(Si)

High radiation tolerance makes this component suitable for space applications or environments with high radiation levels.

Technology: CMOS

CMOS technology enhances energy efficiency and enables complex logic functions within a compact area.

Terminal Form: FLAT

Flat terminals provide ease of soldering and connection, ensuring strong mechanical and electrical contact.

Terminal Pitch: 0.635 mm

A tight terminal pitch allows for increased terminal density, saving board space while enabling intricate designs.

Maximum Supply Voltage (Vsup): 3.6 V

Supports a maximum voltage of 3.6V for robust operation in various circuits, ensuring compatibility with standard system designs.

Technical Specifications

Bus Driver & Transceivers RHFXH162373K-01V attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-CDFP-F48

Length:

15.75 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5/3.3

Propagation Delay (tpd):

5.7 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.72 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Width:

9.65 mm

Trade Compliance

RHFXH162373K-01V Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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