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RHFXH162245K03V

STMicroelectronics

RHFXH162245K03V by STMicroelectronics

STMicroelectronics' RHFXH162245K03V is a 2-function bus driver with 8 bits, operating at 2.5/3.3V. It features a propagation delay of 4.9ns, load capacitance of 30pF, and can handle up to 6A current. Ideal for military applications due to its MIL-graded temperature range (-55 to 125 °C) and radiation tolerance (300k Rad(Si)).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,872 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,872

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Digiode

USA . 1,983 parts In-Stock

1+ parts

-

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1,983

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Anansix

USA . 1,841 parts In-Stock

1+ parts

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1,841

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,262 parts In-Stock

1+ parts

$14.343

100+ parts

-

1k+ parts

$12.909

10k+ parts

-

1,262

$14.343

-

$12.909

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MKK Technologies

India . 1,025 parts In-Stock

1+ parts

$26.971

100+ parts

-

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1,025

$26.971

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DigiPath Technology Company

USA . 1,025 parts In-Stock

1+ parts

$26.971

100+ parts

-

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1,025

$26.971

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Component Stockers USA

USA . 634 parts In-Stock

1+ parts

$99.990

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634

$99.990

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Corphita

USA . 2,044 parts In-Stock

1+ parts

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2,044

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Parana Technologies

USA . 209 parts In-Stock

1+ parts

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100+ parts

$17.149

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209

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$17.149

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Overview

Enhance your electronic designs with the RHFXH162245K03V by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality bus drivers & transceivers that ensure reliable performance and durability. This versatile product is ideal for applications requiring high-speed data transmission and efficient signal processing. With a focus on value and innovation, the RHFXH162245K03V offers customers the benefits of enhanced functionality, increased efficiency, and seamless integration. Upgrade your projects with this cutting-edge solution and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal properties, making the product suitable for high-temperature environments.

Propagation Delay At Nominal Supply: 4.9 ns

Low propagation delay ensures fast data transmission, making this product ideal for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in manufacturing.

No. of Functions: 2

Multiple functions in a single device offer versatility and space-saving benefits in circuit design.

Screening Level: 38535V;38534K;883S

Compliance with multiple screening standards ensures reliability and quality in performance.

No. of Bits: 8

8-bit resolution provides sufficient data processing capability for various applications.

Load Capacitance (CL): 30 pF

Optimal load capacitance ensures signal integrity and stability in communication.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages allows for compatibility with different systems.

No. of Terminals: 48

Sufficient terminals enable easy connectivity and integration within a circuit design.

Package Style (Meter): FLATPACK

Flatpack design offers space-saving benefits and ease of integration in compact electronic devices.

Maximum I (ol): 6 Amp

High output current capability ensures robust performance and reliability in driving loads.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows for use in harsh environmental conditions.

Output Characteristics: 3-STATE

3-state output allows for flexibility in controlling the bus lines, enabling efficient data transmission.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures reliability in cold environments.

Terminal Position: DUAL

Dual terminal position simplifies the connection and installation process in the circuit.

Output Polarity: TRUE

True output polarity ensures accuracy and consistency in signal transmission.

Temperature Grade: MILITARY

Military-grade temperature rating ensures durability and performance in rugged applications.

Total Dose (V): 300k Rad(Si)

High total dose rating makes the product suitable for radiation-resistant applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing efficiency and reliability.

Terminal Form: FLAT

Flat terminal form facilitates easy soldering and PCB mounting, contributing to a streamlined assembly process.

Packing Method: TR

TR (Tape and Reel) packing method ensures convenient handling and storage during production.

Terminal Pitch: 0.635 mm

Fine terminal pitch allows for compact layout design and efficient use of PCB space.

Count Direction: BIDIRECTIONAL

Bidirectional functionality enables data transmission in both directions, enhancing communication capabilities.

Control Type: COMMON CONTROL

Common control interface simplifies the operation and integration of the product within a system.

Technical Specifications

Bus Driver & Transceivers RHFXH162245K03V attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

JESD-30 Code:

R-XDFP-F48

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TR

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

4.9 ns

Qualification:

Not Qualified

Screening Level:

38535V;38534K;883S

Sub-Category:

Bus Driver/Transceivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Translation:

N/A

Trade Compliance

RHFXH162245K03V Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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