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RHFXH162245K-01V

STMicroelectronics

RHFXH162245K-01V by STMicroelectronics

RHFXH162245K-01V by STMicroelectronics is a dual 8-bit bus driver with a propagation delay of just 4.9 ns, ideal for high-speed applications. It operates within a supply voltage range of 1.8 to 3.6 V and withstands extreme temperatures from -55 °C to 125 °C. This military-grade device features a ceramic, metal-sealed package for enhanced reliability in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,386 parts In-Stock

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2,386

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Anansix

USA . 1,170 parts In-Stock

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1,170

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Vyrian

USA . 1,098 parts In-Stock

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1,098

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Distributors (Availability)

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Andel Nordic

Denmark . 1,200 parts In-Stock

1+ parts

$2.952

100+ parts

-

1k+ parts

$2.833

10k+ parts

$2.833

1,200

$2.952

-

$2.833

$2.833

IDEA Electronic Components Group

UK . 1,608 parts In-Stock

1+ parts

$18.502

100+ parts

-

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$16.652

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1,608

$18.502

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$16.652

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MKK Technologies

India . 636 parts In-Stock

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$34.792

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636

$34.792

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DigiPath Technology Company

USA . 636 parts In-Stock

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$34.792

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636

$34.792

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Corphita

USA . 4,206 parts In-Stock

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4,206

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Parana Technologies

USA . 501 parts In-Stock

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$22.122

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501

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$22.122

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Overview

Unlock unparalleled performance with the RHFXH162245K-01V from STMicroelectronics—a trusted leader in high-quality semiconductor solutions. Built for durability and reliability, this advanced bus driver and transceiver offers swift data transmission in demanding applications, ensuring seamless communication in military, aerospace, and industrial environments. Experience enhanced efficiency, lower power consumption, and robust design—perfect for your next project!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This robust package material enhances durability and reliability, making it suitable for harsh environments.

Propagation Delay At Nominal Supply: 4.9 ns

A low propagation delay ensures faster signal transmission, which is essential for high-speed applications.

Surface Mount: YES

Surface mount technology enables compact designs and simplifies the manufacturing process.

No. of Functions: 2

Having multiple functions increases versatility, allowing for more efficient circuit designs.

Screening Level: MIL-PRF-38535 Class V

This screening level indicates high reliability and performance under military specifications, ensuring resilience.

Package Shape: RECTANGULAR

The rectangular shape optimizes space in PCB layouts, facilitating better integration into various designs.

No. of Bits: 8

An 8-bit configuration supports a wide range of data processing applications.

Nominal Supply Voltage / Vsup (V): 2.3

This nominal voltage supports energy-efficient designs while ensuring high-performance operation.

Load Capacitance (CL): 30 pF

A low load capacitance improves switching speeds and signal integrity, beneficial for fast circuit operations.

Power Supplies (V): 2.5/3.3

Dual voltage options provide flexibility in power supply design and can be compatible with various systems.

No. of Terminals: 48

A higher terminal count allows for more connections, enhancing the functionality of the device.

Package Style (Meter): FLATPACK

Flatpack style contributes to a low-profile design, ideal for space-constrained applications.

Maximum I (ol): 6 Amp

A high output current rating supports demanding applications, providing better performance in power-intensive scenarios.

Propagation Delay (tpd): 4.9 ns

Consistently low propagation delay ensures efficient signal switching for high-speed data processing.

Maximum Operating Temperature: 125 °C

This high operating temperature rating indicates suitability for use in extreme thermal conditions.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

The 3-state output with series resistor enhances flexibility in data bus configurations, promoting effective communication.

Minimum Operating Temperature: -55 °C

Withstanding low temperatures makes this part ideal for applications in polar environments or space applications.

Terminal Position: DUAL

Dual terminal position aids in easier PCB layout design, improving accessibility and soldering efficiency.

No. of Ports: 2

Two ports enable bidirectional communication, which is crucial for many modern digital applications.

Maximum Seated Height: 2.72 mm

The low seated height is advantageous for compact designs, ensuring compatibility with thin profile requirements.

Width: 9.65 mm

A moderate width provides a balance between size and performance, making it suitable for diverse applications.

Output Polarity: TRUE

True output polarity ensures predictable logic behavior, which is essential for circuit reliability.

Minimum Supply Voltage (Vsup): 1.8 V

The low minimum supply voltage promotes lower power consumption, extending battery life in portable devices.

Length: 15.75 mm

A compact length facilitates integration into smaller form factor devices without sacrificing performance.

Temperature Grade: MILITARY

Designed to military specifications, this part guarantees high performance in extreme conditions, ensuring longevity.

Total Dose (V): 300k Rad(Si)

High total dose tolerance makes this device suitable for space applications, where radiation resistance is critical.

Technology: CMOS

CMOS technology ensures low power consumption with high speed, making it ideal for modern electronic devices.

Terminal Form: FLAT

Flat terminals allow for better surface contact, enhancing the reliability of connections on PCBs.

Terminal Pitch: 0.635 mm

A standard terminal pitch supports compatibility with various PCB layouts, improving design flexibility.

Count Direction: BIDIRECTIONAL

Bidirectional counting capability enhances versatility for dynamic data handling and processing.

Control Type: COMMON CONTROL

Common control simplifies the management of multiple functions, making circuit design easier and more efficient.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of electronic systems.

Technical Specifications

Bus Driver & Transceivers RHFXH162245K-01V attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-CDFP-F48

Length:

15.75 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

4.9 ns

Propagation Delay (tpd):

4.9 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.72 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Translation:

N/A

Width:

9.65 mm

Trade Compliance

RHFXH162245K-01V Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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