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RHFXH163245K03V

STMicroelectronics

RHFXH163245K03V by STMicroelectronics

RHFXH163245K03V by STMicroelectronics is a 16-bit bus driver with a propagation delay of just 7.5 ns, ideal for high-speed applications. It operates within a supply voltage range of 1.4-3.6 V and supports dual ports with bidirectional control. Designed for harsh environments, it meets MIL-PRF-38535 Class V standards.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,226 parts In-Stock

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4,226

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Anansix

USA . 930 parts In-Stock

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930

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Digiode

USA . 750 parts In-Stock

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750

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Distributors (Availability)

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Andel Nordic

Denmark . 500 parts In-Stock

1+ parts

$2.494

100+ parts

-

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$2.394

10k+ parts

$2.394

500

$2.494

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$2.394

$2.394

IDEA Electronic Components Group

UK . 725 parts In-Stock

1+ parts

$19.020

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$17.118

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725

$19.020

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$17.118

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MKK Technologies

India . 829 parts In-Stock

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$35.766

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829

$35.766

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DigiPath Technology Company

USA . 829 parts In-Stock

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$35.766

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829

$35.766

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Corphita

USA . 2,952 parts In-Stock

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2,952

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Parana Technologies

USA . 975 parts In-Stock

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$22.741

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975

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$22.741

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Overview

Elevate your designs with the RHFXH163245K03V from STMicroelectronics, a trusted leader in innovative technology. This robust 16-bit bus driver and transceiver delivers exceptional performance with rapid propagation delays and superior reliability, ideal for high-demand applications in aerospace, military, and industrial sectors. With its ceramic metal-sealed package, it ensures outstanding durability and temperature resilience, giving you peace of mind and unmatched value in every deployment. Experience the difference that quality engineering can make!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This durable package material provides excellent protection against environmental factors, ensuring reliability in harsh conditions.

Propagation Delay At Nominal Supply: 7.5 ns

The low propagation delay enhances signal integrity and enables high-speed communication, making it suitable for fast applications.

Surface Mount: YES

Surface mount technology facilitates compact design and ease of integration into modern circuit boards.

Screening Level: MIL-PRF-38535 Class V

This screening level indicates a high level of reliability suitable for military and aerospace applications.

Package Shape: RECTANGULAR

The rectangular package shape is efficient for layout and design, aiding in space optimization on PCBs.

No. of Bits: 16

With 16 bits, this product offers substantial data handling capabilities for a variety of applications.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a nominal supply voltage of 1.8V enables lower power consumption, which is crucial for energy-sensitive applications.

Load Capacitance (CL): 30 pF

A low load capacitance ensures faster switching speeds and enhances overall performance in high-frequency applications.

No. of Terminals: 48

With 48 terminals, this device allows for more connections and intercommunication possibilities in complex systems.

Package Style (Meter): FLATPACK

The flatpack style provides a low profile which is ideal for space-constrained applications.

Maximum I (ol): 18 Amp

With a maximum output current of 18 Amps, this product supports high power requirements, making it versatile for various applications.

Propagation Delay (tpd): 7.5 ns

The consistent propagation delay further enhances its suitability for high-speed data transfer applications.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures ensures reliability in demanding environments.

Output Characteristics: 3-STATE

The 3-state output capability provides flexible data management in multi-device communication systems.

Minimum Operating Temperature: -55 °C

This wide operating temperature range makes it ideal for extreme environments, enhancing its versatility.

Terminal Position: DUAL

Dual terminal positioning supports various layout requirements, improving design flexibility.

No. of Ports: 2

With two ports, this product can efficiently manage communication between separate system components.

Maximum Seated Height: 2.72 mm

The compact height minimizes space requirements on the circuit board while ensuring effective performance.

Width: 9.65 mm

A manageable width aids in the product's integration into various circuit designs, allowing flexibility in layout.

Output Polarity: TRUE

True output polarity is important for consistent logic level interpretation across different circuits.

Minimum Supply Voltage (Vsup): 1.4 V

The minimum supply voltage capability ensures wider compatibility with different power supply configurations.

Length: 15.75 mm

The length is designed for optimized performance within compact electronic systems.

Total Dose (V): 300k Rad(Si)

The high total dose tolerance indicates suitability for radiation-intensive applications like space and nuclear environments.

Technology: CMOS

CMOS technology enhances power efficiency and performance, making it ideal for battery-powered devices.

Terminal Form: FLAT

Flat terminals improve soldering and connectivity, enhancing manufacturing reliability.

Packing Method: TR

The tape and reel packing method simplifies automation in manufacturing and assembly processes.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm allows for dense placement on circuit boards, supporting advanced designs.

Count Direction: BIDIRECTIONAL

Bidirectional counting allows for flexible data handling in both directions, enhancing usability in different applications.

Control Type: COMMON CONTROL

Common control type streamlines operation, making it easier to manage multiple devices in a system.

Maximum Supply Voltage (Vsup): 3.6 V

A high maximum supply voltage compatibility makes this device suitable for a wide range of applications.

Technical Specifications

Bus Driver & Transceivers RHFXH163245K03V attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-CDFP-F48

Length:

15.75 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

18 Amp

No. of Bits:

16

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL48,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TR

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

7.5 ns

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.72 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Width:

9.65 mm

Trade Compliance

RHFXH163245K03V Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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