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74LVC1G125GW-Q100

NXP Semiconductors

74LVC1G125GW-Q100 by NXP Semiconductors

NXP Semiconductors' 74LVC1G125GW-Q100 is a CMOS bus driver with 6ns propagation delay, suitable for automotive applications. It operates at 3.3V, has a load capacitance of 50pF, and features a max I (ol) of 24Amp. This small outline package with dual terminals is AEC-Q100 compliant and supports TRUE output polarity.

Median Price

$0.055

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DigiKey

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Newark

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Adafruit Industries

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Rochester

USA . 1,165,442 parts In-Stock

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Future Electronics

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Arrow

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Verical

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Element14

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Farnell

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Nova Conductors

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NAC Semi

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Chip Stock

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IBS Electronics

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VNN

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Semicontronic

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Corphita

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AZTECH Wire

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Continental Prestige Electronics

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Argo Parts USA

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Andel Nordic

Denmark . 1,714 parts In-Stock

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Aztec Data Supply Inc.

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Allen Electronics Distributors

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Authorized Procurement Solutions

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Supply Digital

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Robosynatics

Brazil . 250 parts In-Stock

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Overview

Enhance your automotive electronic designs with the 74LVC1G125GW-Q100 by NXP Semiconductors, a top-tier manufacturer known for quality and reliability. This bus driver & transceiver offers fast propagation delays and 3-state output characteristics, making it ideal for various automotive applications. With a wide operating temperature range and AEC-Q100 screening level, this component ensures optimal performance in harsh environments. Trust NXP Semiconductors to deliver cutting-edge solutions that provide value, efficiency, and seamless integration into your projects. Elevate your designs with the 74LVC1G125GW-Q100 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for automotive applications.

Propagation Delay At Nominal Supply: 6 ns

Low propagation delay ensures fast response time and efficient data transmission in bus driver applications.

Surface Mount: YES

The surface mount feature enables easy and convenient installation of the product on circuit boards.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high quality and reliability of the product for automotive electronics.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard supply voltage of 3.3V, suitable for various electronic systems.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF allows for optimized performance and signal transmission in bus driver applications.

Power Supplies (V): 3.3

The product is designed to work efficiently with a power supply voltage of 3.3V, ensuring stable operation.

No. of Terminals: 5

The presence of 5 terminals provides connectivity options and flexibility in the circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile of the package make it suitable for compact electronic designs with space constraints.

Maximum I (ol): 24 Amp

High maximum output current capability of 24 Amps allows for driving demanding loads in the bus system.

Propagation Delay (tpd): 10.5 ns

The propagation delay of 10.5 ns ensures quick data transmission and efficient bus communication.

Maximum Operating Temperature: 125 °C

Operates effectively at high temperatures up to 125°C, suitable for automotive and industrial environments.

Output Characteristics: 3-STATE

The 3-STATE output feature allows for tristate operation, expanding the flexibility and functionality of the product.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures down to -40°C, making it suitable for a wide range of operating conditions.

Terminal Finish: Tin (Sn)

Tin terminal finish provides corrosion resistance and ensures reliable electrical connections.

No. of Ports: 2

Dual ports allow for multiple connections and versatile integration in bus systems.

Maximum Seated Height: 1.1 mm

Low seated height of 1.1 mm enables compact PCB layout and space-saving installation.

Width: 1.25 mm

Narrow width of 1.25 mm contributes to overall size reduction and enhanced integration in electronic designs.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and compatibility with other components in the system.

Minimum Supply Voltage (Vsup): 1.65 V

Can operate efficiently at low supply voltages down to 1.65V, enabling energy-efficient performance.

Maximum Time At Peak Reflow Temperature (s): 30

Allows sufficient time for peak reflow soldering process, ensuring proper solder connections and reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures secure solder joints and robust assembly.

Length: 2.05 mm

Compact length of 2.05 mm contributes to space-efficient design and easy integration in circuit layouts.

Temperature Grade: AUTOMOTIVE

Designed with automotive-grade temperature specifications, ensuring reliability and performance in automotive applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various systems.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and secure solder connections for reliable operation.

Packing Method: TR

TR packing method offers convenient tape and reel packaging for automated assembly processes.

Terminal Pitch: 0.65 mm

Narrow terminal pitch of 0.65 mm allows for high-density mounting and efficient use of PCB space.

Control Type: ENABLE LOW

Enable low control type allows for easy and efficient control of the driving functionality in bus systems.

Maximum Supply Voltage (Vsup): 5.5 V

Withstands high supply voltages up to 5.5V, making it versatile for a wide range of electronic applications.

Technical Specifications

Bus Driver & Transceivers 74LVC1G125GW-Q100 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74LVC1G125GW-Q100 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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