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74HCT1G125GW,165

NXP Semiconductors

74HCT1G125GW,165 by NXP Semiconductors

NXP Semiconductors' 74HCT1G125GW,165 is a CMOS Bus Driver with 36ns Propagation Delay and 3-STATE Output. Operating b/w -40 to 125 °C, it has a supply voltage range of 4.5V to 5.5V. Ideal for automotive applications due to its small form factor and dual terminal position.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Chip Stock

USA . 72,000 parts In-Stock

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Digiode

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Vyrian

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Anansix

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Nova Conductors

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Microchip USA

USA . 365 parts In-Stock

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$0.577

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AZTECH Wire

Italy . 8,429 parts In-Stock

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Andel Nordic

Denmark . 2,270 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$9.044

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Semicontronic

India . 273 parts In-Stock

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$16.575

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$16.490

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Corohmni

South Africa . 686 parts In-Stock

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Aztec Data Supply Inc.

USA . 965 parts In-Stock

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One Stop Electronics

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Argo Parts USA

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Corphita

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Continental Prestige Electronics

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Supply Digital

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Bastille Electronics

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Overview

Enhance your electronic designs with the NXP Semiconductors 74HCT1G125GW,165 bus driver and transceiver. With a reputation for top-quality manufacturing, NXP delivers reliable components that meet demanding industry standards. This small outline, thin profile package offers 3-state output characteristics, making it ideal for a wide range of applications. From automotive to industrial, this versatile component provides value, efficiency, and performance, ensuring that your projects run smoothly and reliably. Upgrade your designs today with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable construction for the product.

Surface Mount: YES

The surface mount capability makes it easy to integrate this product onto circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with a wide range of systems.

Propagation Delay (tpd): 36 ns

The low propagation delay of 36 ns ensures fast signal transmission, ideal for applications requiring quick response times.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C makes it suitable for use in automotive environments or other harsh conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the overall efficiency of the product.

Technical Specifications

Bus Driver & Transceivers 74HCT1G125GW,165 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

36 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74HCT1G125GW,165 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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