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74HCT1G125GW,115

NXP Semiconductors

74HCT1G125GW,115 by NXP Semiconductors

74HCT1G125GW,115 by NXP Semiconductors is a bus driver & transceiver with 1 bit and 2 ports. It has a propagation delay of 36 ns and operates at temperatures ranging from -40 to 125 °C. This compact CMOS device is commonly used in automotive applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip Stock

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Nova Conductors

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One Stop Electronics

USA . 1,230 parts In-Stock

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AZTECH Wire

Italy . 11,681 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

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Advanced Electronics

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Semicontronic

India . 1,001 parts In-Stock

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Ampacity Inc.

Singapore . 862 parts In-Stock

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Supply Digital

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Continental Prestige Electronics

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Corphita

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Overview

Experience the power of innovation with the 74HCT1G125GW,115 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors guarantees top-notch quality and reliability. This bus driver and transceiver boasts a small outline, thin profile package that delivers exceptional performance. With its true output polarity and 3-STATE characteristics, this product offers seamless connectivity and optimal functionality. Perfect for automotive applications, it operates flawlessly even under extreme temperature conditions. Trust NXP Semiconductors to provide you with the best solution for your electronic needs. Upgrade your technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable, suitable for various applications in the bus driver and transceiver category.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into electronic systems, enhancing the versatility and convenience of this product.

No. of Functions: 1

With a single function, this product provides a simplistic yet efficient solution for bus driver and transceiver applications.

Package Shape: RECTANGULAR

The rectangular package shape ensures compatibility and easy integration into standard electronic designs, making this product a reliable choice.

No. of Bits: 1

This product offers a single bit resolution, enabling precise data transmission and control in bus driver and transceiver applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this product ensures stable and reliable performance in various electronic systems.

No. of Terminals: 5

With five terminals, this product allows for efficient connectivity and signal transmission, making it an ideal choice for bus driver and transceiver requirements.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style of this product enables space-saving installations and enhances compatibility with compact electronic designs.

Propagation Delay (tpd): 36 ns

The low propagation delay of 36 ns ensures fast and efficient data transmission, making this product suitable for high-speed bus driver and transceiver applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product provides reliable performance even in demanding operating conditions, making it a dependable choice.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for flexible control and signal routing, enhancing the functionality and versatility of this product.

Minimum Operating Temperature: -40 °C

Operating reliably even at extremely low temperatures (-40°C), this product is suitable for a wide range of bus driver and transceiver applications in harsh environments.

Terminal Finish: TIN

The tin terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability and optimal performance of this product.

Terminal Position: DUAL

Featuring dual terminal positions, this product offers flexibility in connectivity options, accommodating different installation requirements.

No. of Ports: 2

With two ports, this product allows for efficient data transmission and connectivity in bus driver and transceiver applications, making it a convenient choice.

Maximum Seated Height: 1.1 mm

Featuring a maximum seated height of 1.1 mm, this product offers a compact and low-profile design, enabling its integration into space-constrained systems.

Width: 1.25 mm

The narrow width of 1.25 mm makes this product suitable for applications where space is limited, providing versatility and compatibility with various electronic designs.

Output Polarity: TRUE

With a true output polarity, this product ensures accurate and reliable signal transmission, enhancing the overall performance and usability in bus driver and transceiver applications.

Minimum Supply Voltage (Vsup): 4.5 V

With a minimum supply voltage of 4.5V, this product allows for flexible power supply options, accommodating different system requirements.

Length: 2.05 mm

The compact length of 2.05 mm makes this product suitable for space-constrained applications, providing ease of integration and installation.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets the high temperature and reliability standards required in the automotive industry, making it a reliable choice for bus driver and transceiver needs.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption, high noise immunity, and compatibility with a wide range of electronic systems, making it an efficient and versatile choice.

Terminal Form: GULL WING

The gull wing terminal form ensures secure and reliable soldering connections, enhancing the durability and performance of this product.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this product provides fine-pitch connections, suitable for high-density installations and miniaturized electronic systems.

Maximum Supply Voltage (Vsup): 5.5 V

Operating within a maximum supply voltage of 5.5V, this product offers a wide voltage range, ensuring compatibility and reliable performance in various bus driver and transceiver applications.

Technical Specifications

Bus Driver & Transceivers 74HCT1G125GW,115 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

36 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74HCT1G125GW,115 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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