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SN74LV1T34DCKRG4

Texas Instruments

SN74LV1T34DCKRG4 by Texas Instruments

SN74LV1T34DCKRG4 by Texas Instruments is a bus driver with 14.5 ns propagation delay, suitable for automotive applications. It operates at 1.8V with 30pF load capacitance and features a small outline package style. With dual terminal position and Gull Wing form, it offers true output polarity and can handle up to 8A max I (ol).

Median Price

$0.508

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 623 parts In-Stock

1+ parts

$0.420

100+ parts

$0.225

1k+ parts

$0.198

10k+ parts

$0.172

623

$0.420

$0.225

$0.198

$0.172

Chip1Stop

Japan . 2,257 parts In-Stock

1+ parts

$0.508

100+ parts

-

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2,257

$0.508

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Mouser Electronics

USA . 5,258 parts In-Stock

1+ parts

$0.510

100+ parts

$0.347

1k+ parts

-

10k+ parts

$0.346

5,258

$0.510

$0.347

-

$0.346

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.211

100+ parts

-

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100

$0.211

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Digiode

USA . 2,460 parts In-Stock

1+ parts

$0.399

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2,460

$0.399

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Chip Stock

USA . 112,530 parts In-Stock

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112,530

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Semtec, LLC

USA . 12,000 parts In-Stock

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Vyrian

USA . 5,417 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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5

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Distributors (Availability)

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Semicontronic

India . 5,690 parts In-Stock

1+ parts

$0.169

100+ parts

$0.165

1k+ parts

$0.164

10k+ parts

-

5,690

$0.169

$0.165

$0.164

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Ampacity Inc.

Singapore . 5,470 parts In-Stock

1+ parts

$0.169

100+ parts

-

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5,470

$0.169

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Modulus Dynamics

Lithuania . 53 parts In-Stock

1+ parts

$0.207

100+ parts

$0.205

1k+ parts

$0.199

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53

$0.207

$0.205

$0.199

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Continental Prestige Electronics

USA . 4,041 parts In-Stock

1+ parts

$0.211

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-

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$0.207

4,041

$0.211

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-

$0.207

Argo Parts USA

USA . 838 parts In-Stock

1+ parts

$0.211

100+ parts

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$0.204

838

$0.211

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$0.204

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.211

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100

$0.211

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Corphita

USA . 971 parts In-Stock

1+ parts

$0.378

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971

$0.378

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$9.955

100+ parts

$9.457

1k+ parts

$9.457

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100

$9.955

$9.457

$9.457

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Corohmni

South Africa . 171 parts In-Stock

1+ parts

$23.172

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171

$23.172

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Parana Technologies

USA . 1,530 parts In-Stock

1+ parts

$24.354

100+ parts

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$25.026

10k+ parts

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1,530

$24.354

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$25.026

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ChromeModa Solutions

Germany . 6,567 parts In-Stock

1+ parts

$27.364

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$22.438

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6,567

$27.364

$22.438

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IDEA Electronic Components Group

UK . 1,868 parts In-Stock

1+ parts

$27.364

100+ parts

$25.996

1k+ parts

$24.628

10k+ parts

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1,868

$27.364

$25.996

$24.628

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DigiPath Technology Company

USA . 1,687 parts In-Stock

1+ parts

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$24.671

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1,687

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$24.671

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Robosynatics

Brazil . 450 parts In-Stock

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450

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Lucentia Tech

USA . 450 parts In-Stock

1+ parts

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$4.897

1k+ parts

$4.897

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$4.897

450

-

$4.897

$4.897

$4.897

Overview

Discover the innovative SN74LV1T34DCKRG4 by Texas Instruments, a top-tier manufacturer known for cutting-edge solutions in the Bus Driver & Transceivers category. Designed with precision and quality in mind, this product offers unparalleled performance and reliability. Ideal for a wide range of applications, it provides customers with value, benefits, and advantages like no other. Upgrade your systems with the SN74LV1T34DCKRG4 and experience excellence in technology like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 14.5 ns

Low propagation delay ensures efficient signal transmission in bus driver applications.

Surface Mount: YES

Surface mount capability makes it easy to integrate into PCB designs for space-efficient solutions.

Nominal Supply Voltage / Vsup (V): 1.8

Low nominal supply voltage allows for energy-efficient operation.

Load Capacitance (CL): 30 pF

Suitable load capacitance ensures stable and accurate signal transmission.

No. of Terminals: 5

Optimal number of terminals for connecting to other components in a bus driver system.

Maximum Operating Temperature: 125 °C

Wide operating temperature range suitable for automotive and industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage allows for flexibility in design and compatibility with different systems.

Technical Specifications

Bus Driver & Transceivers SN74LV1T34DCKRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Inputs:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR, 7 INCH

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.0055 mA

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

15.5 ns

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.6 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

SN74LV1T34DCKRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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