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MM74HC573WM

Onsemi

MM74HC573WM by Onsemi

MM74HC573WM by Onsemi is an 8-bit bus driver with a propagation delay of 35ns. It operates at a nominal voltage of 4.5V and has a max operating temperature of 85°C. Ideal for applications requiring fast signal transmission in industrial settings.

Median Price

$0.450

Lifecycle Status

Suppliers In-Stock

62

In-Stock Inventory

1k+

Distributors (Authorized)

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Newark

USA . 38 parts In-Stock

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$0.131

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$0.131

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$0.131

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$0.131

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$0.131

$0.131

Mouser Electronics

USA . 461 parts In-Stock

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$0.540

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$0.416

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$0.343

461

$0.540

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$0.343

Arrow

USA . 199 parts In-Stock

1+ parts

$0.587

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$0.428

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$0.347

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$0.222

199

$0.587

$0.428

$0.347

$0.222

Element14

Singapore . 2,549 parts In-Stock

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$0.900

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$0.528

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$0.403

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$0.370

2,549

$0.900

$0.528

$0.403

$0.370

Farnell

UK . 2,654 parts In-Stock

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$1.050

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$0.393

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$0.355

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$0.319

2,654

$1.050

$0.393

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$0.319

Adafruit Industries

USA . 21 parts In-Stock

1+ parts

$34.002

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$30.942

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$27.882

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$34.002

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Future Electronics

Canada . 2,799 parts In-Stock

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$0.245

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$0.235

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EBV Elektronik

Germany . 2,546 parts In-Stock

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Master Electronics

USA . 1,966 parts In-Stock

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$0.395

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Verical

USA . 1,938 parts In-Stock

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Chip1Stop

Japan . 579 parts In-Stock

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Rochester

USA . 216 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 947 parts In-Stock

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TEDSS.com

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Nova Conductors

Japan . 650 parts In-Stock

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Freelance Electronics

USA . 25 parts In-Stock

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Ace Electronics

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Component Electronics Inc.

Canada . 122 parts In-Stock

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$0.870

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Flex Direct, LLC

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IBS Electronics

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Anansix

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NAC Semi

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Vyrian

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Bristol Electronics

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Atlantic Semiconductor

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Connect4Technologies Inc.

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Holdelec - ElecDif-Pro

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ComSIT Distribution GmbH

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PC Components Company LLC

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Lakeland Logistics Inc

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Connector Distribution Corp

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Right Parts Inc.

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Mil-Aero Solutions, Inc.

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ECAB

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Inventory MP

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MISTER SPROCKETS

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Resion

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Sensible Micro Corp

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Elcom Components

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Component Sense

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NPI Materials, Inc.

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Semicontronic

India . 1,682 parts In-Stock

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$0.191

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$0.186

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$0.185

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1,682

$0.191

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Ampacity Inc.

Singapore . 1,560 parts In-Stock

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Corphita

USA . 2,254 parts In-Stock

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Corohmni

South Africa . 274 parts In-Stock

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$0.250

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Argo Parts USA

USA . 636 parts In-Stock

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$0.434

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$0.421

636

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Bastille Electronics

Australia . 100 parts In-Stock

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$0.434

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$0.412

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$0.392

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$0.386

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$0.434

$0.412

$0.392

$0.386

Continental Prestige Electronics

USA . 3,453 parts In-Stock

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$0.507

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$0.398

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$0.309

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$0.300

3,453

$0.507

$0.398

$0.309

$0.300

Andel Nordic

Denmark . 3,056 parts In-Stock

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$8.536

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$8.195

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$8.195

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$8.195

Aztec Data Supply Inc.

USA . 4,496 parts In-Stock

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$29.384

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Advanced Electronics

New Zealand . 21 parts In-Stock

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$34.002

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$30.942

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$27.882

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Perfect Parts

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SupplyDigital Components

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Latvia . 5,988 parts In-Stock

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Overview

Unleash the power of seamless data transfer with the MM74HC573WM by Onsemi. Crafted with precision and expertise, this bus driver & transceiver is designed to elevate your connectivity experience. With a compact small outline package style and 8 bits, this versatile component offers a fast propagation delay of 35 ns and a maximum operating temperature of 85°C. Perfect for industrial applications, the MM74HC573WM ensures reliable performance and efficiency in every use. Upgrade your electronics with Onsemi's cutting-edge technology and unlock a world of possibilities. Elevate your projects with the ultimate solution in data management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and helps protect the components inside, making the product reliable and long-lasting.

Propagation Delay At Nominal Supply: 35 ns

With low propagation delay, this product ensures quick and efficient data transmission.

Surface Mount: YES

Surface mount technology allows for easy and compact installation, saving space and reducing assembly time.

No. of Bits: 8

Having 8 bits allows for a wide range of data transmission capabilities, making the product versatile.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V ensures stable and consistent power supply, enhancing the performance of the product.

Load Capacitance (CL): 50 pF

The load capacitance of 50pF helps in maintaining signal integrity and efficient data transmission.

Power Supplies (V): 2/6

Supporting a range of power supplies from 2V to 6V, this product is versatile and can be used in various applications.

Maximum I (ol): 6 Amp

With a maximum output current of 6A, this product can handle high-power applications effectively.

Propagation Delay (tpd): 194 ns

Although not the fastest, the propagation delay of 194ns is still quick enough for most applications, balancing speed and efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and operate reliably.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the product can function in extreme cold environments without any issues.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and ensures good electrical conductivity, making the product reliable in the long run.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product is sensitive to moisture but can still withstand moderate exposure, ensuring durability in various environments.

Technical Specifications

Bus Driver & Transceivers MM74HC573WM attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8015 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

35 ns

Propagation Delay (tpd):

194 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

MM74HC573WM Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-399-5371, 5962013995371

NIIN

013995371

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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