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SN74LVC1G126DBVR

Texas Instruments

SN74LVC1G126DBVR by Texas Instruments

SN74LVC1G126DBVR by Texas Instruments is a bus driver with 9ns propagation delay at 1.8V, suitable for automotive applications. It features a 32A max I (ol) and operates b/w -40 to 125°C temperature range. With a small outline package style, it has dual terminal position and supports true output polarity.

Median Price

$0.109

Lifecycle Status

Suppliers In-Stock

50

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,653,675 parts In-Stock

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Chip1Stop

Japan . 6,233 parts In-Stock

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Arrow

USA . 1,290 parts In-Stock

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DigiKey

USA . 44,375 parts In-Stock

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Mouser Electronics

USA . 16,768 parts In-Stock

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Newark

USA . 2,819 parts In-Stock

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Farnell

UK . 3,164 parts In-Stock

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Element14

Singapore . 3,164 parts In-Stock

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Rochester

USA . 3,000 parts In-Stock

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UK . 2,825 parts In-Stock

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Verical

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Digiode

USA . 311 parts In-Stock

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Ozdisan Elektronik

Türkiye . 249 parts In-Stock

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Maritex

Poland . 760 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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TME

Poland . 1,225 parts In-Stock

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Component Electronics Inc.

Canada . 5 parts In-Stock

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Vyrian

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Inventory MP

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Micros sp.j. W. Kędra i J. Lic

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PC Components Company LLC

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Ampacity Inc.

Singapore . 774,587 parts In-Stock

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Semicontronic

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Corphita

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Corohmni

South Africa . 483 parts In-Stock

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Modulus Dynamics

Lithuania . 136 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Component Stockers USA

USA . 107,962 parts In-Stock

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Parana Technologies

USA . 1,602 parts In-Stock

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DigiPath Technology Company

USA . 1,011 parts In-Stock

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IDEA Electronic Components Group

UK . 1,524 parts In-Stock

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$26.348

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$25.031

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$23.713

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$26.348

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ChromeModa Solutions

Germany . 1,264 parts In-Stock

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$26.348

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$21.605

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$38.754

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$35.266

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$31.778

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$38.754

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Andel Nordic

Denmark . 471 parts In-Stock

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$120.436

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$115.619

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Perfect Parts

USA . 669,726 parts In-Stock

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iodParts Technologies Inc.

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Allen Electronics Distributors

USA . 3,225 parts In-Stock

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Futuretech Components

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Brazil . 1,674 parts In-Stock

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Lucentia Tech

USA . 1,674 parts In-Stock

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Lixinc

USA . 1,104 parts In-Stock

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Overview

Unlock seamless data transfer and efficient signal management with the Texas Instruments SN74LVC1G126DBVR, a top-tier Bus Driver & Transceiver. Crafted with precision using high-quality materials, this product boasts unmatched reliability and durability. Ideal for a wide range of applications, this compact device ensures smooth operation and optimal performance. Elevate your projects with the superior quality and advanced technology that Texas Instruments is renowned for. Experience unparalleled value and functionality with the SN74LVC1G126DBVR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to external elements, making the product suitable for rugged environments.

Propagation Delay At Nominal Supply: 9 ns

Low propagation delay ensures quick signal transmission, making this product efficient for high-speed data communication.

Surface Mount: YES

Surface mount capability allows for easy installation on printed circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage requirement helps in reducing power consumption and heat generation, making the product energy-efficient.

Load Capacitance (CL): 50 pF

Optimal load capacitance ensures signal integrity and stability, making the product reliable for data transmission.

Power Supplies (V): 3.3

Compatible with standard power supplies, offering versatility in terms of integration with existing systems.

Maximum I (ol): 32 Amp

High output current capability allows the product to drive multiple loads without any performance degradation.

Output Characteristics: 3-STATE

3-STATE output allows for tristate logic, enabling the product to control multiple bus lines efficiently.

Temperature Grade: AUTOMOTIVE

Automotive grade temperature tolerance ensures reliable operation in extreme temperature conditions, making the product suitable for automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the product.

Technical Specifications

Bus Driver & Transceivers SN74LVC1G126DBVR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74LVC1G126DBVR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-655-5606, 5962016555606

NIIN

016555606

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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