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SN74HCT541DWR

Texas Instruments

SN74HCT541DWR by Texas Instruments

SN74HCT541DWR by Texas Instruments is an 8-bit bus driver with a propagation delay of 29 ns and output current of 6 Amp. It operates at a supply voltage of 5V, suitable for industrial applications requiring fast signal transmission in compact spaces. This CMOS technology-based device features a small outline package with dual terminals and true output polarity.

Median Price

$0.840

Lifecycle Status

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25

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1k+

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Texas Instruments

USA . 61,779 parts In-Stock

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Mouser Electronics

USA . 5,473 parts In-Stock

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$0.840

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$0.469

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$0.412

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$0.322

5,473

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$0.469

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$0.322

Adafruit Industries

USA . 2,500 parts In-Stock

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$32.978

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$31.329

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$31.329

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$32.978

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Distributors (In-Stock)

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Nova Conductors

Japan . 700 parts In-Stock

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Greenchips

USA . 632 parts In-Stock

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632

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Digiode

USA . 1,239 parts In-Stock

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TME

Poland . 758 parts In-Stock

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$0.640

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$0.357

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758

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Chip Stock

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Vyrian

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ComSIT USA

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Bristol Electronics

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Pegasus Components GmbH

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Sensible Micro Corp

USA . 1,702 parts In-Stock

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Carlin Systems, Inc.

USA . 1,700 parts In-Stock

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PC Components Company LLC

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ComSIT Distribution GmbH

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Inventory MP

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MRC Electronics

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EMSNET

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SIE Connect GmbH - GreenChips

Germany . 632 parts In-Stock

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Electronics Depot

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A&K Electronics

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Rotakorn

Sweden . 207 parts In-Stock

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Florida Circuit

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Prism Electronics

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,890 parts In-Stock

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$0.268

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$0.263

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$0.263

Argo Parts USA

USA . 3,508 parts In-Stock

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$0.268

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Ampacity Inc.

Singapore . 18,044 parts In-Stock

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Semicontronic

India . 17,607 parts In-Stock

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Corphita

USA . 2,697 parts In-Stock

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Andel Nordic

Denmark . 2,430 parts In-Stock

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$7.254

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$6.964

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$6.964

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$6.964

Parana Technologies

USA . 258 parts In-Stock

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$17.430

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$17.632

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DigiPath Technology Company

USA . 460 parts In-Stock

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$19.192

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$17.657

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ChromeModa Solutions

Germany . 2,708 parts In-Stock

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$19.584

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$16.059

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IDEA Electronic Components Group

UK . 1,171 parts In-Stock

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$19.584

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$18.605

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Corohmni

South Africa . 262 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$32.978

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$31.329

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Perfect Parts

USA . 36,730 parts In-Stock

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A-Z Elektronik GmbH

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 958 parts In-Stock

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Lixinc

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ChipTracer

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Overview

Enhance your electronic projects with the SN74HCT541DWR by Texas Instruments, a top-of-the-line bus driver and transceiver. Known for its exceptional quality and reliability, Texas Instruments delivers products that meet the highest industry standards. The SN74HCT541DWR offers seamless integration, efficient performance, and precise output characteristics. Whether you're working on data transmission or signal amplification, this versatile component is designed to elevate your projects to the next level. Trust in Texas Instruments for cutting-edge technology and superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it suitable for use in various applications.

Propagation Delay At Nominal Supply: 29 ns

The low propagation delay at nominal supply ensures fast and efficient data transmission, making the product ideal for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs, making it convenient for compact designs.

No. of Bits: 8

The 8-bit configuration allows for handling a wide range of data, providing versatility in data transmission and control.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Load Capacitance (CL): 150 pF

The load capacitance of 150pF provides stability in signal transmission and reception, ensuring reliable performance in various environments.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for high flexibility in signal control, enabling the product to efficiently manage data flow in complex systems.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers SN74HCT541DWR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

29 ns

Propagation Delay (tpd):

42 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN74HCT541DWR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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