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SN74LVC2G126DCUR

Texas Instruments

SN74LVC2G126DCUR by Texas Instruments

SN74LVC2G126DCUR by Texas Instruments is a 2-function bus driver with a propagation delay of 4 ns at 1.8V, suitable for automotive applications. It features a max operating temperature of 125°C, output polarity TRUE, and terminal finish Matte Tin (Sn). This CMOS technology device has a small outline package style with very thin profile and shrink pitch.

Median Price

$0.375

Lifecycle Status

Suppliers In-Stock

36

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 159,006 parts In-Stock

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Farnell

UK . 7,772 parts In-Stock

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DigiKey

USA . 54,288 parts In-Stock

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Mouser Electronics

USA . 38,218 parts In-Stock

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Element14

Singapore . 7,772 parts In-Stock

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Avnet

USA . 1,434 parts In-Stock

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Verical

USA . 690 parts In-Stock

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Chip1Stop

Japan . 471 parts In-Stock

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Distributors (In-Stock)

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Maritex

Poland . 636 parts In-Stock

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$0.208

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636

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Nova Conductors

Japan . 39 parts In-Stock

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Digiode

USA . 1,728 parts In-Stock

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Vyrian

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Chip Stock

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Cyclops Electronics Ltd

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Bristol Electronics

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Flip Electronics

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Atlantic Semiconductor

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North Shore Components

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Inventory MP

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Prism Electronics

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Sensible Micro Corp

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Microfarads

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Connector Distribution Corp

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PC Components Company LLC

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Contempo Components LLC

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CoreStaff

Japan . 5 parts In-Stock

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$0.098

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$0.091

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$0.091

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Semicontronic

India . 43,852 parts In-Stock

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Continental Prestige Electronics

USA . 2,125 parts In-Stock

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Argo Parts USA

USA . 1,520 parts In-Stock

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Corohmni

South Africa . 1,044 parts In-Stock

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Advanced Electronics

New Zealand . 50 parts In-Stock

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Corphita

USA . 933 parts In-Stock

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Ampacity Inc.

Singapore . 43,656 parts In-Stock

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Parana Technologies

USA . 2,190 parts In-Stock

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$20.746

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$1,926.572

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$18.671

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DigiPath Technology Company

USA . 1,297 parts In-Stock

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$22.844

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ChromeModa Solutions

Germany . 5,517 parts In-Stock

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IDEA Electronic Components Group

UK . 512 parts In-Stock

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$23.310

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$22.144

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$20.979

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$20.979

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Andel Nordic

Denmark . 3,050 parts In-Stock

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$49.492

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$47.512

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Perfect Parts

USA . 316,863 parts In-Stock

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GreenTree Electronics

Israel . 16,000 parts In-Stock

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XScomponents

USA . 10,441 parts In-Stock

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Lixinc

USA . 8,201 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 3,000 parts In-Stock

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S.R.D Solutions

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Glotronic Ltd.

UK . 2,400 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,974 parts In-Stock

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

USA . 150 parts In-Stock

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Overview

Experience cutting-edge technology with the SN74LVC2G126DCUR by Texas Instruments, a top-quality bus driver and transceiver designed for a wide range of applications. With its innovative design and reliable performance, this product offers unparalleled value and benefits to customers seeking seamless communication solutions. Trust in Texas Instruments' reputation for excellence and elevate your projects with the SN74LVC2G126DCUR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in automotive applications where weight is a concern.

Propagation Delay At Nominal Supply: 4 ns

The low propagation delay ensures fast data transmission, making this bus driver/transceiver suitable for high-speed communication systems.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage of 1.8V ensures power efficiency and compatibility with various electronic devices.

Output Characteristics: 3-STATE

The 3-state output allows for high impedance output, enabling multiple devices to share the same bus line without interfering with each other.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade design ensures the product can withstand the harsh operating conditions in automotive environments, providing reliable performance.

Technology: CMOS

The use of CMOS technology results in low power consumption and compatibility with a wide range of devices, making the product energy-efficient and versatile.

Technical Specifications

Bus Driver & Transceivers SN74LVC2G126DCUR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

9.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

2 mm

Trade Compliance

SN74LVC2G126DCUR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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