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74LVC1G126GV,125

NXP Semiconductors

74LVC1G126GV,125 by NXP Semiconductors

NXP Semiconductors' 74LVC1G126GV,125 is a CMOS bus driver with 6ns propagation delay and 24A output current. It operates at a voltage range of 1.65V to 5.5V, making it suitable for automotive applications requiring fast signal transmission in compact spaces. This surface-mount device features a small outline package with dual terminals and true output polarity.

Median Price

$0.087

Lifecycle Status

Suppliers In-Stock

25

In-Stock Inventory

1k+

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Chip1Stop

Japan . 3,434 parts In-Stock

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DigiKey

USA . 482,473 parts In-Stock

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$0.130

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$0.067

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$0.055

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$0.048

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$0.067

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Mouser Electronics

USA . 17 parts In-Stock

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$0.064

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$0.052

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Newark

USA . 4,397 parts In-Stock

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TTI

USA . 291,000 parts In-Stock

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Arrow

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Verical

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Rochester

USA . 15,844 parts In-Stock

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Future Electronics

Canada . 3,000 parts In-Stock

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Element14

Singapore . 2,889 parts In-Stock

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Farnell

UK . 2,279 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 1,886 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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TME

Poland . 2,370 parts In-Stock

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$0.090

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$0.067

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$0.047

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2,370

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Chip Stock

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IBS Electronics

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NAC Semi

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Vyrian

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Connector Distribution Corp

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Right Parts Inc.

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Netsource Technology, Inc.

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Bristol Electronics

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Prism Electronics

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Ampacity Inc.

Singapore . 95,489 parts In-Stock

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Semicontronic

India . 95,281 parts In-Stock

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Corphita

USA . 4,245 parts In-Stock

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AZTECH Wire

Italy . 8,890 parts In-Stock

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Argo Parts USA

USA . 1,460 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Microchip USA

USA . 3,822 parts In-Stock

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Andel Nordic

Denmark . 731 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,460 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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Corohmni

South Africa . 92 parts In-Stock

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Perfect Parts

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Eastek

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QUARKTWIN TECHNOLOGY LTD

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GreenTree Electronics

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Continental Prestige Electronics

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Authorized Procurement Solutions

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iodParts Technologies Inc.

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Metaverse IC Inc.

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Supply Digital

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Overview

Upgrade your electronic designs with the high-quality 74LVC1G126GV,125 by NXP Semiconductors. This reliable bus driver and transceiver offers fast propagation delay and true output polarity, making it perfect for a wide range of applications. With NXP Semiconductors' reputation for excellence in semiconductor manufacturing, you can trust that this component will deliver exceptional performance and reliability. Discover the value and benefits of incorporating this versatile component into your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making it suitable for various operating conditions.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures efficient power usage and compatibility with a wide range of systems.

No. of Terminals: 5

Having 5 terminals allows for multiple connectivity options and flexibility in wiring configurations.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, the product can withstand high temperature environments without compromising performance.

Output Characteristics: 3-STATE

3-STATE output characteristics allow for high flexibility in controlling the output signal, making it suitable for various applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of systems, making it a reliable choice for bus driver and transceiver applications.

Technical Specifications

Bus Driver & Transceivers 74LVC1G126GV,125 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE HIGH

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

74LVC1G126GV,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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