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74LVC1G125GW

NXP Semiconductors

74LVC1G125GW by NXP Semiconductors

NXP Semiconductors' 74LVC1G125GW is a CMOS bus driver with 6ns propagation delay, suitable for automotive applications. It operates at a nominal voltage of 3.3V and features a max I (ol) of 24Amp, making it ideal for driving signals in compact electronic systems. The device comes in a small outline package with dual terminals and supports surface mount installation.

Median Price

$0.110

Lifecycle Status

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28

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Maritex

Poland . 102 parts In-Stock

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LIBRA Elektronik GmbH

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Bristol Electronics

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Andel Nordic

Denmark . 757 parts In-Stock

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AZTECH Wire

Italy . 6,902 parts In-Stock

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Singapore . 231 parts In-Stock

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Overview

Maximize efficiency in your electronic designs with the 74LVC1G125GW by NXP Semiconductors. This high-quality bus driver & transceiver offers unparalleled performance and reliability, perfect for a wide range of applications. With a fast propagation delay and low power consumption, this product provides exceptional value to customers looking for cutting-edge solutions. Trust NXP Semiconductors for superior technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver, ensuring a longer lifespan and reliable performance.

Propagation Delay At Nominal Supply: 6 ns

Low propagation delay ensures fast signal transmission, making the bus driver efficient for high-speed data communication.

Surface Mount: YES

Ease of installation and space-saving design make this bus driver suitable for compact and modern electronic systems.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage level commonly used in electronic devices, ensuring compatibility and easy integration.

Output Characteristics: 3-STATE

The 3-STATE output allows for flexible control of the bus lines, enabling multiple drivers to share the same bus without interference.

Maximum Operating Temperature: 125 °C

Withstands high temperatures, making it suitable for automotive applications where heat resistance is important.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the bus driver.

Technical Specifications

Bus Driver & Transceivers 74LVC1G125GW attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74LVC1G125GW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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