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SN74HCT125D

Texas Instruments

SN74HCT125D by Texas Instruments

SN74HCT125D by Texas Instruments is a 4-function bus driver with 33ns propagation delay at 5V. It features a 3-STATE output, operates in industrial temperature range (-40 to 85 °C), and has a max power supply current of 0.08mA. Ideal for applications requiring true output polarity control and enable low functionality.

Median Price

$0.772

Lifecycle Status

Suppliers In-Stock

43

In-Stock Inventory

1k+

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Mouser Electronics

USA . 9,732 parts In-Stock

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$0.491

Rochester

USA . 41,471 parts In-Stock

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DigiKey

USA . 31,467 parts In-Stock

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Verical

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Freelance Electronics

USA . 10 parts In-Stock

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DF Sales Co.

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Digiode

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Nova Conductors

Japan . 300 parts In-Stock

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Component Electronics Inc.

Canada . 20 parts In-Stock

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Ace Electronics

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Ampacity Inc.

Singapore . 22,764 parts In-Stock

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Corphita

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Continental Prestige Electronics

USA . 3,901 parts In-Stock

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Argo Parts USA

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Corohmni

South Africa . 216 parts In-Stock

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Andel Nordic

Denmark . 2,174 parts In-Stock

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$5.773

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Parana Technologies

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DigiPath Technology Company

USA . 2,139 parts In-Stock

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ChromeModa Solutions

Germany . 3,494 parts In-Stock

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IDEA Electronic Components Group

UK . 178 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of seamless data transmission with the Texas Instruments SN74HCT125D Bus Driver & Transceivers. Designed with precision and reliability in mind, this product boasts unparalleled quality from a trusted manufacturer. Perfect for a wide range of applications, this versatile device offers customers value, benefits, and advantages that are unmatched in the industry. Upgrade your systems today with the SN74HCT125D and experience the difference in performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage during use.

Propagation Delay at Nominal Supply: 33 ns

Low propagation delay ensures quick and efficient data transmission, making this product ideal for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and secure installation on circuit boards, saving space and simplifying assembly.

No. of Functions: 4

This product offers multiple functions in a single package, providing cost savings and simplifying circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, compatible with most common electronic systems.

Load Capacitance (CL): 150 pF

The specified load capacitance ensures optimal performance and reliability in communication systems.

Power Supplies (V): 5

Stable power supply at 5V ensures consistent and reliable operation of the product.

No. of Terminals: 14

Provides ample terminal connections for interfacing with external devices and components.

Package Style (Meter): SMALL OUTLINE

Compact small outline package design saves space on the circuit board and allows for high-density mounting.

Maximum I (ol): 6 Amp

Capable of driving high current loads, making it suitable for driving power-hungry devices.

Propagation Delay (tpd): 46 ns

Fast propagation delay ensures quick response times and efficient signal transmission.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows the product to function reliably in various environmental conditions.

Output Characteristics: 3-STATE

3-state output allows for high impedance output state, providing flexibility in multi-device communication systems.

Minimum Operating Temperature: -40 °C

Capable of operating in low-temperature environments, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures good contact reliability and corrosion resistance for long-term performance.

Terminal Position: DUAL

Dual terminal position provides flexibility in the orientation of the product during installation.

No. of Ports: 2

Dual ports allow for versatile connectivity options and support for different communication protocols.

Maximum Seated Height: 1.75 mm

Low profile design with a small seated height minimizes space requirements and allows for tight integration in compact systems.

Width: 3.9 mm

Slim width profile enables space-saving installation and multi-device mounting in confined spaces.

Output Polarity: TRUE

True output polarity ensures correct signal transmission and compatibility with other devices in the system.

Minimum Supply Voltage (Vsup): 4.5 V

Operates reliably at low supply voltages, making it suitable for battery-powered applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for extended periods during assembly processes, ensuring robust solder connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for lead-free and RoHS-compliant manufacturing processes.

Length: 8.65 mm

Compact length profile facilitates efficient board layout and optimal use of space in electronic assemblies.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh operating environments and industrial applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable operation in diverse electronic systems.

Terminal Form: GULL WING

Gull wing terminal form allows for easy and reliable soldering during assembly, ensuring secure electrical connections.

Packing Method: TUBE

Protective tube packaging ensures safe transportation and handling of the product during distribution and storage.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for compatibility with common PCB layouts and facilitates easy integration into existing designs.

Count Direction: UNIDIRECTIONAL

Unidirectional count direction simplifies control and monitoring of data flow in one direction, enhancing system efficiency.

Control Type: ENABLE LOW

Enable low control type provides flexible control options for activating or deactivating the device based on input signals.

Maximum Supply Voltage (Vsup): 5.5 V

Wide supply voltage range allows for compatibility with a variety of power sources and voltage levels in different applications.

Maximum Power Supply Current (ICC): 0.08 mA

Low power supply current consumption minimizes energy usage and heat generation, contributing to overall system efficiency.

Technical Specifications

Bus Driver & Transceivers SN74HCT125D attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

HCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

33 ns

Propagation Delay (tpd):

46 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

3.9 mm

Trade Compliance

SN74HCT125D Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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