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SN74LVC1G125DCK3

Texas Instruments

SN74LVC1G125DCK3 by Texas Instruments

SN74LVC1G125DCK3 by Texas Instruments is a 3-STATE bus driver with a propagation delay of 4.5 ns at 1.8V, suitable for industrial applications. It has a max operating temperature of 85°C and can handle load capacitance up to 50 pF, making it ideal for compact designs requiring fast signal transmission. With a small outline package style and dual terminal position, this CMOS technology device offers reliable performance in space-constrained environments.

Median Price

$0.218

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 926,213 parts In-Stock

1+ parts

$0.187

100+ parts

$0.127

1k+ parts

$0.065

10k+ parts

-

926,213

$0.187

$0.127

$0.065

-

Mouser Electronics

USA . 12,883 parts In-Stock

1+ parts

$0.250

100+ parts

$0.133

1k+ parts

$0.110

10k+ parts

$0.100

12,883

$0.250

$0.133

$0.110

$0.100

DigiKey

USA . 10,922 parts In-Stock

1+ parts

$0.250

100+ parts

$0.132

1k+ parts

$0.110

10k+ parts

$0.099

10,922

$0.250

$0.132

$0.110

$0.099

Chip1Stop

Japan . 6,000 parts In-Stock

1+ parts

-

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-

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-

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$0.090

6,000

-

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-

$0.090

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.145

100+ parts

-

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100

$0.145

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Digiode

USA . 2,044 parts In-Stock

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$0.178

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2,044

$0.178

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Vyrian

USA . 239,585 parts In-Stock

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-

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239,585

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Chip Stock

USA . 154,080 parts In-Stock

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Semtec, LLC

USA . 6,298 parts In-Stock

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6,298

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Distributors (Availability)

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Ampacity Inc.

Singapore . 244,304 parts In-Stock

1+ parts

$0.076

100+ parts

-

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-

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244,304

$0.076

-

-

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Semicontronic

India . 244,164 parts In-Stock

1+ parts

$0.076

100+ parts

$0.074

1k+ parts

$0.074

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244,164

$0.076

$0.074

$0.074

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Argo Parts USA

USA . 3,173 parts In-Stock

1+ parts

$0.137

100+ parts

-

1k+ parts

-

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$0.133

3,173

$0.137

-

-

$0.133

Continental Prestige Electronics

USA . 2,347 parts In-Stock

1+ parts

$0.137

100+ parts

-

1k+ parts

-

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$0.135

2,347

$0.137

-

-

$0.135

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.145

100+ parts

-

1k+ parts

$0.138

10k+ parts

$0.135

50

$0.145

-

$0.138

$0.135

Corohmni

South Africa . 1,182 parts In-Stock

1+ parts

$0.145

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$0.145

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$0.149

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$0.142

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$0.142

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100

$0.149

$0.142

$0.142

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Modulus Dynamics

Lithuania . 700 parts In-Stock

1+ parts

$0.152

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$0.151

1k+ parts

$0.146

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700

$0.152

$0.151

$0.146

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Corphita

USA . 1,958 parts In-Stock

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$0.168

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1,958

$0.168

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Microchip USA

USA . 3,531 parts In-Stock

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$0.795

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3,531

$0.795

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Andel Nordic

Denmark . 1,478 parts In-Stock

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$6.250

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$6.000

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$6.000

1,478

$6.250

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$6.000

Parana Technologies

USA . 22 parts In-Stock

1+ parts

$20.546

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$20.626

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22

$20.546

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DigiPath Technology Company

USA . 2,318 parts In-Stock

1+ parts

$22.623

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$20.813

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2,318

$22.623

$20.813

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ChromeModa Solutions

Germany . 5,843 parts In-Stock

1+ parts

$23.085

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$18.930

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$23.085

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IDEA Electronic Components Group

UK . 2,292 parts In-Stock

1+ parts

$23.085

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$21.931

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$20.776

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2,292

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Lixinc

USA . 3,784 parts In-Stock

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GreenTree Electronics

Israel . 990 parts In-Stock

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990

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

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900

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Overview

Experience top-notch quality and performance with the Texas Instruments SN74LVC1G125DCK3, a cutting-edge Bus Driver & Transceiver designed to deliver unparalleled reliability and efficiency. Perfect for a wide range of applications, this product boasts a compact design and advanced technology, making it an ideal choice for your electronic projects. With Texas Instruments' reputation for excellence in manufacturing, you can trust that you are getting a superior product that offers exceptional value and benefits. Upgrade your electronics with the SN74LVC1G125DCK3 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for applications where weight and reliability are important.

Propagation Delay At Nominal Supply: 4.5 ns

With a low propagation delay, this product ensures fast signal transmission, making it suitable for high-speed communication systems.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, making it convenient for mass production.

Package Shape: RECTANGULAR

The rectangular shape of the package provides compatibility with standard PCB layouts, making integration into existing designs seamless.

Nominal Supply Voltage / Vsup (V): 1.8

With a low nominal supply voltage, this product is energy-efficient and can operate efficiently in low-power applications.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable signal transmission and reception, making it suitable for reliable data communication.

No. of Terminals: 5

The 5 terminals provide sufficient connection points for interfacing with other components, offering flexibility in system design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch design make this product space-saving and suitable for compact electronic devices.

Technical Specifications

Bus Driver & Transceivers SN74LVC1G125DCK3 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e6

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

9 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

SN74LVC1G125DCK3 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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